Microprocessor Chips (MPU) Specifications

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General Specifications


	Architecture:
	Your choices are...
	RISC		Microprocessors that use a reduced instruction set computer (RISC) design process a few simple instructions rather than many complex ones in order to speed operations.
	CISC		Microprocessors that use a complex instruction set computer (CISC) design provide variable length instructions, multiple addressing formats, and contain only a small number of general purpose registers
	Other		Other unlisted architectures.
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	Data Bus		Data buses are a bidirectional set of conductive paths. Data or instruction codes are transferred into the digital signal processor (DSP). The results of operations and computations are output from the DSP.
	Your choices are...
	8-Bit		Microprocessors have an 8-bit data bus.
	16-Bit		Microprocessors have a 16-bit data bus.
	24-Bit		Microprocessors have a 24-bit data bus.
	32-Bit		Microprocessors have a 32-bit data bus.
	64-Bit		Microprocessors have a 64-bit data bus.
	128-Bit		Microprocessors have a 128-bit data bus.
	256-Bit		Microprocessors have a 256-bit data bus.
	Other		Any other unlisted data bus.
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	Microprocessor Family:		The processor family of the microcontroller.
	Your choices are...
	Intel® 8051		Intel provides Intel® 8051 microprocessors.
	Intel® x86		Intel provides Intel® x86 microprocessors.
	AMD		Advanced Micro Devices (AMD) provides microprocessors.
	Motorola 68K		Some Motorola microprocessors are designed for use with 68K code.
	Motorola PowerPC®		Motorola provides Motorola PowerPC® microprocessors.
	ZiLOG® Z80		ZiLOG® produces 8-bit Z80 microprocessors with dual register banks for fast context switching and interrupt handling.
	ARM		ARM provides 16/32-bit RISC microprocessors.
	Geode(TM)		National Semiconductor developed the Geode(TM) family of microprocessors.
	MIPS Technologies		MIPS Technologies provides microprocessors.
	SPARC®		Sun Microsystems, Inc. provides microprocessors for the SPARC® platform.
	PIC®		Microchip provides the peripheral interface controller (PIC®), a versatile microcontroller.
	Via Technologies		Via Technologies provides microprocessors.
	Other		Other unlisted, specialized, or proprietary microprocessor families.
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	Supply Voltage:
	Your choices are...
	-5 V		Microprocessors operate at -5 volts.
	-4.5 V		Microprocessors operate at -4.5 volts.
	-3.3 V		Microprocessors operate at -3.3 volts.
	-3 V		Microprocessors operate at -3 volts.
	1.2 V		Microprocessors operate at -1.2 volts.
	1.5 V		Microprocessors operate at 1.5 volts.
	1.8 V		Microprocessors operate at 1.8 volts.
	2.5 V		Microprocessors operate at 2.5 volts.
	3 V		Microprocessors operate at 3 volts.
	3.3 V		Microprocessors operate at 3.3 volts.
	3.6 V		Microprocessors operate at 3.6 volts.
	5 V		Microprocessors operate at 5 volts.
	Other		Other unlisted supply voltages.
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Performance


	Clock Speed		Clock speed, the frequency that determines how fast devices connected to the system bus operate, is generally expressed in megahertz (MHz).
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	RAM		Random access memory (RAM) is generally expressed in kilobytes (kB) or megabytes (MB).
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	Power Dissipation		Power dissipation, the device's total power consumption, is generally expressed in watts (W) or milliwatts.
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	Operating Temperature		This is the range of operating temperatures.
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I/O Ports and Interfaces Input/output (I/O) ports and interfaces are connections to a microprocessor that provide a data path between the microprocessor and external devices such as a keyboard, display, or reader.


	I/O Ports		The number of I/O ports is equal to the number of input, output, and general-purpose ports, or lines, combined.
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	Number of UARTs		Universal asynchronous receiver/transmitter (UART) is a circuit that accepts parallel data information and converts it into an asynchronous serial data stream.
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	DMA Channels		Direct memory access (DMA) is a method of transferring data directly between two peripherals with minimal processor intervention. Usually, these two peripherals are memory and an I/O device.
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	Interface / Port Support		Communication controllers manage data input and output to a host computer or computer network. The units may be complex front-end mainframe interfaces or simpler devices such as multiplexers, bridges, and routers. The devices convert parallel computer data to serial data for transmission over communication lines and perform all the necessary control functions, error checking, and synchronization.
	Your choices are...
	TCP/IP		Microprocessors have available ports for transport control protocol/internet protocol (TCP/IP) communication.
	SPI		Serial peripheral interface (SPI) is a four-wire, full duplex, synchronous serial data link. SPI was originally developed by Motorola to provide a glueless microcontroller interface to industry-standard serial devices, such as EEPROM, and other serial devices.
	I²C		The Inter-IC (I²C) bus is a two-wire serial bus designed by Phillips that provides a communications link between integrated circuits. I²Cs are used to control and monitor applications in communications, computer, and industrial settings. Physically, the bus consists of two active wires and a ground connection. The active wires, the serial data line (SDA) and the serial clock line (SCL), are both bidirectional. Each component that is connected to the bus has a unique address and can, depending on its functionality, receive and/or transmit information.
	IrDA		Infrared data association (IrDA) ports transfer data from one device to another with infrared light waves instead of cables.
	SDLC/HDLC		Designed by IBM in 1975, synchronous data link control (SDLC) is the oldest two-layer protocol for carrying system network architecture (SNA) traffic. In 1979, ISO used SDCL to create high-level data link control (HDLC).
	SMBus		Microprocessors use system management bus (SMBus) ports.
	CAN		Microprocessors use control area network (CAN) bus ports.
	USB		Microprocessors use universal serial bus (USB) ports.
	JTAG Interface		The joint test action group (JTAG) created the JTAG interface to allow access to the inner workings of an IC for testing, controlling, and programming purposes.
	PWM Interface		Microprocessors use pulse width modulation (PWM) interfaces.
	Other		Other unlisted communication ports or interfaces.
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Packaging Information


	Package Type:
	Your choices are...
	BGA		Ball grid array (BGA) is a type of memory chip with soldered balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance.
	PBGA		Plastic-ball grid array (PBGA).
	TBGA		Tape-ball grid array (TBGA).
	FLGA		Fine-pitch land grid array (FLGA).
	QFP		Quad flat packages (QFP) are etched or stamped with fine lead frames. This design enables QFPs to contain more leads and features in a smaller profile (the lead width can be as small as 0.16 mm while the lead pitch is 0.4 mm). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package to PCB). Quad packages have been used for years to meet increasing challenges of advancing processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipset, video-DAC, multi-media and other related applications. QFPs are widely used in consumer and industrial products, automotive technology, PCs and other related products.
	LFQP		Low-profile quad flat package (LQFP).
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline IC (SOIC).
	TSOP Type I		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	TSOP Type II		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual In-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Plastic dual-in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. Ceramic dual-In-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	SIP		Single inline package (SIP).
	SDIP		Shrink dual inline package (SDIP).
	SZIP		Shrink zigzag inline package (SZIP).
	Other		Other unlisted, specialized, or proprietary packages.
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	Pin Count		The pin count is the number of pins in the microprocessor.
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Features


	PLL / DLL?		Integrated phase locked loops (PLLs) and delay locked loops (DLLs) with clock frequency synthesis capabilities allow designers to generate high-speed internal clocks for sampling data in microprocessor applications. PLLs and DLLs give designers greater control over the clock frequencies used in integrated designs. This is vital for system integration because different parts of a system operate at different clock frequencies.
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	Watchdog Timer?		Watchdog timers are simple countdown timers that are used to reset microprocessors after specific intervals of time.
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	On-Chip Oscillator		On-chip oscillators are embedded.
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	Real Time Clock (RTC)		Real time clocks (RTCs) are embedded.
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	Supervisory Functions		Microprocessors have programmable supervisory functions.
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	Programmable Alarms		Microprocessors have programmable alarms.
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Microprocessor Chips (MPU) Specifications

Architecture:

Data Bus:

Microprocessor Family:

Supply Voltage:

Clock Speed:

RAM:

Power Dissipation:

Operating Temperature:

Number of UARTs:

DMA Channels:

Interface / Port Support:

Package Type:

Pin Count:

PLL / DLL?

Watchdog Timer?

On-Chip Oscillator?

Real Time Clock (RTC)?

Supervisory Functions?

Programmable Alarms?

Help with Microprocessor Chips (MPU) specifications: