MacDermid Alpha Electronics Solutions has promoted these products / services:
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has attained International Automotive Task Force (IATF) 16949:2016 certification for all manufacturing facilities globally that produce products for automotive applications.
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC).
ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with Antimony (Sb) content ranging from 5-10%. They are well suited for automotive and power semiconductor applications.
Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this ebook on Low-Temperature Soldering illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions.
Alpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability.
Alpha advances automotive electronics technology - Our goal is to help you improve automotive electronics reliability and reduce your warranty costs.
Void reduction is complex. A number of factors contribute to void generation, so in order to address this common problem, Alpha is focused on understanding all the variables.
Non-Eutectic, Low Temperature, Pin Testable, Solder Paste for
Motherboard Assemblies with High Warpage Chips
An OEM’s long-term competitiveness and endurance is dependent upon their ability to provide effi cient and consistent assemblies. The right combination of Solder Paste, Liquid Flux, Cored Wire and Flux Gel is a critical aspect to producing highperforming products that will meet stringent specifi cations, and thereby a key concern for OEMs and customers alike. So what material sets...
In response to the power semiconductor market's drive to improve reliability and device performance for automotive, alternative energy, transportation, consumer electronics, telecommunications and industrial applications, Alpha has developed a line of ALPHA® Argomax® advanced sinter technology products.
ALPHA® EF 2100VOC-Free, Halide-Free Flux Designed to Meet Current REACH and RoHS Legislation
No-clean, water soluble, low VOC, halogen-free fluxes meet the challenges of both tin-lead and lead-free processes.
Bring your most innovative designs to market with the lightweight strength and reliability that only Alpha performance materials can provide. Our comprehensive experience on the assembly line, combined with intensive research and development, has resulted in the customized solutions for complex circuitry of the industry
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.
The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y...
ALPHA® tensoRED® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA® tensoRED® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t...
ALPHA® TrueHeight™ Spacer Blocks are burr free, non-collapse copper discs coated with a barrier layer of nickel, and finish coated with flash gold. TrueHeight™ Spacer Blocks are designed to be automatically placed and reflowed onto a printed circuit board pad printed with a nominal amount of solder paste.
Alpha provides electronics assemblers safe, efficient solder recycling services which will help them meet environmental and legislative requirements while maximizing the return on their solder dross, scrap and solder paste waste.
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce both solder pastes and printing stencils… all combined with a genuine will to meet your most stringent delivery expectations.
News articles and press releases for MacDermid Alpha Electronics Solutions:
ALPHA WILL PRESENTON PREVENTION OF WEAK SOLDER JOINT FORMATION IN MULTI BUSBAR INTERCONNECTION AT SNEC PV POWER EXPO IN SHANGHAI CHINA
Alpha, a division of MacDermid Alpha Electronics Solutions, received 4 awards at NEPCON CHINA recognizing its high level of achievement in soldering technology. Alpha's OM-358 Solder Paste & BTC-578 Preforms received both Vision and Innovation awards.
Alpha Assembly Solutions has attained International Automotive Task Force (IATF) 16949:2016 certification for all manufacturing facilities globally that produce products for automotive applications.
MacDermid Performance Solutions announced that effective January 1, 2019, it will combine its Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions business units to form MacDermid Alpha Electronics Solutions.
Alpha Assembly Solutions has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC).
Alpha will feature its industry leading Silver Sintering technology for power electronics at Booth #212 during the Electric and Hybrid Vehicle Technology Expo being held in Novi, Michigan, September 11 – 13, 2018.
Alpha has recently published, through iConnect007, a micro eBook on the evolution of modern low-temperature soldering.
Alpha has recently introduced ALPHA® OM-358, a lead-free, zero-halogen solder paste designed to provide ultra-low voiding performance on all component types, including bottom terminated components.
Alpha has recently announced their acquisition of HiTech Korea Co., LTD (HiTech), a premier electronics assembly polymer and epoxy-based materials supplier, with its primary operational facility in Korea.
Alpha has joined forces with Fairphone, the creator of the world’s first ethical, modular smartphone, to research and raise awareness on the challenges associated with sourcing recycled materials in the electronics industry.
Alpha has recently reached a milestone of being able to produce solder products made from 100% recycled tin.
Alpha Assembly Solutions is participating in the IDTechEx Show taking place on April 11th-12th in Berlin, Germany. Alpha will be exhibiting jointly with MacDermid Autotype at Booth #J15.
Alpha is introducing ALPHA® OM-550, a new low temperature chemistry paired with Alpha’s HRL1 alloy for assemblies with temperature sensitive substrates, components and high warpage chips.
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing ALPHA® EF-2100, their latest VOC-free, zero-halogen liquid soldering flux designed to meet current REACH and RoHS legislation.
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce the launch of its new ALPHA® tensoRED™ Master Tensioning Frame.
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing its no-silver cored solder wire solution for highest wetting speed performance.
Alpha has specially engineered its Telecore HF-850 Cored Solder Wire with InnoLot alloy to increase reliability to under hood electronics.
Alpha announced a collaborative partnership with the National Graphene Institute (NGI) at The University of Manchester to develop next generation Graphene-Based Electronic Materials for the Electronics Assembly & Packaging.