Henkel Corporation - Electronics has promoted these products / services:

Henkel Corporation - Electronics - Ultimate Adhesive Reliability - Loctite 85-1

LOCTITE ABLESTIK 85-1 is one of Henkel’s high reliability adhesives formulated to connect electronic assembly components. (read more)

Henkel Corporation - Electronics - Thermally Conductive Adhesives

Customizable liquid, tapes, pads, or mix for the mechanical attachment of components to a heat sink with thermal transfer properties and without the need for additional fasteners. (read more)

Henkel Corporation - Electronics - Electrically Insulating Film Adhesives

Electrically Insulating Film Adhesives
Dielectric films and tapes offer conformability, easy application, and reliable tack designed to perform at high temperatures and resist oxidation, solvents, and oils while maintaining physical and electrical integrity. (read more)

Henkel Corporation - Electronics - SIL PAD - Solutions-Driven Thermal Management

Electrically and non-electrically insulating thermal materials for cleaner and more efficient thermal interfaces (read more)

Henkel Corporation - Electronics - Thermal Gap Pads

Effective thermal interface between heat sinks and electronic devices with shock dampening qualities for conformability and higher thermal performance, also available silicone-free. (read more)

Henkel Corporation - Electronics - Non-Conductive Paste

Pre-applied semiconductor underfill, facilitating bump protection and interconnection in a single step. offering excellent bump reinforcement and safeguarding for fine pitch devices. (read more)

Henkel Corporation - Electronics - Low Pressure Molding

Providing electrical insulation and temperature, vibration and solvent resistance for modern PCB and circuitry protection against high humidity, long-term UV exposure and thermal cycling. (read more)

Henkel Corporation - Electronics - Sealing solutions to prevent leaks

Used to seal surfaces in order to prevent passage of liquids or gas. (read more)

Henkel Corporation - Electronics - Insulation for PCBs.

A permanent protective solution providing reliable shielding and adhesion against environmental influences, improving mechanical strength and providing high electrical (read more)

Henkel Corporation - Electronics - Epoxy, Die Attach

LOCTITE ABLESTIK 84-1LMIT1, Epoxy, Die Attach LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh.

  • Electrically conductive
  • High thermal conductivity
  • Solvent-free formulation
  • Low viscosity
(read more)
Henkel Corporation - Electronics - Epoxy, Silver-filled film adhesive

Within harsh conditions, LOCTITE ABLESTIK CF 3366 maintains its adhesion strength up to temperatures as high as 175°C, facilitating reliable thermal and electrical performance even during extended exposure to elevated temperatures. Available in custom-cut dimensions, LOCTITE ABLESTIK CF 3366 offers a clean, low cost-of-ownership alternative to paste adhesives. (read more)

Henkel Corporation - Electronics - Electrically Conductive Die Attach Paste

Highly-conductive, metal-filled adhesives with excellent electrical conductivity, dispensability and high-reliability performance (read more)

Henkel Corporation - Electronics - Epoxy Film, Die attach

LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. (read more)

Henkel Corporation - Electronics - Hot Melt Polyolefin, Masking
  • Silicone free
  • Halogen free
  • RoHS compliant
  • Easily peelable without residues
  • Zero outgassing @ 100 °C
  • Ultra fast process time
  • 100% Solids material
  • Solidifies upon cooling, no additional curing process required
  • Good resistance to conformal coating ingression
(read more)
Henkel Corporation - Electronics - Peelable Solder Mask

Technomelt AS 8998 is a peelable hot melt adhesive used to mask off areas that need protection before conformal coating is applied. (read more)

Henkel Corporation - Electronics - Ultra Low Modulus 10 W/m-K gap pad

BERGQUIST GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. (read more)

Henkel Corporation - Electronics - Semi-sintering, silver die attach paste

LOCTITE ABLESTIK ICP 9000 is a semi-sintering die attach paste that delivers a robust, lead-free solder alternative with best-in-class electrical and thermal performance. This technology provides lower in-package thermal resistance than many standard die attach pastes on silver, copper and PPF leadframes. (read more)

Henkel Corporation - Electronics - MIL STD 883 Electrically Conductive Adhesive

LOCTITE ABLESTIK QMI529HT-LV, electrically conductive die attach adhsive has been formualted for use in high throughput die attach applications. It passes NASA outgassing standards and is qualified to MIL-STD-883, Method 5011. (read more)

Henkel Corporation - Electronics - Film Adhesive with high temperature adhesion

Loctite Ablestik CF3366, electrically conductive film adhesive, formulated to maintain consistent high adhesion strength at elevated temperatures (200 C) which makes it suitable for extreme environmental applicaitons. (read more)

Henkel Corporation - Electronics - Low Pressure Molding With Great Flexibility

TECHNOMELT PA 6208 is a high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage (read more)

Henkel Corporation - Electronics - Conformal EMI Shielding Material


Data Package Conformal EMI Shielding Material (read more)

Henkel Corporation - Electronics - Better EMI shielding performance

LOCTITE ABLESTIK EMI 8660S achieves uniform top and sidewall coating for all the spray parameters
o Spray speed and flow rate have significant effect on coating thickness and are the key parameters
to adjust the coating thickness
o 4-8 μm uniform coating can be achieved by adjusting flow rate and spray speed (read more)

Henkel Corporation - Electronics - EMI Shielding Solutions for Semiconductor Packages

Webinar: EMI Shielding Solutions for Semiconductor Packages (read more)

Henkel Corporation - Electronics - Designed for thermal compression bonding processes
  • High purity
  • Non-conductive
  • Excellent protection of electrical joints
  • Compatible with small assembly gap and tight pitches
(read more)