Announcements

Indium Corporation has promoted these products / services:

Indium Corporation - inTACK™ Robust Tacking Agent

InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. (read more)

Indium Corporation - Rel-ion™ Technology for e-Mobility

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation® is announcing a line of material solutions for e-Mobility. The Rel-ion™ suite of electrical, mechanical, and thermal solutions are designed to be reliable, scalable, and proven materials, reducing electric vehicle (EV) manufacturers' time to market. (read more)

Indium Corporation - m2TIM™ Hybrid Thermal Interface Material

The m2TIM is a unique solid/liquid hybrid thermal interface material that combines liquid metal with a solid metal preform to provide reliable thermal conductivity while eliminating the need for a solderable surface. (read more)

Indium Corporation - Heat-Spring® Metal Thermal Interface Materials

Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi. (read more)

Indium Corporation - Indium 8.9HF

No-Clean, Lead-Free Solder Paste (read more)

Indium Corporation - Durafuse™ LT: The Ultimate Drop-Shock Solution

Drop shock is a concern in reliability in the electronics we rely on every day. Solder joints provide the electrical and mechanical bridge between the package & board assembly, and their integrity is vital. Read about the testing on DurafuseLT (read more)

Indium Corporation - Indalloy®291 Supplemental Bar Alloys

Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy®291 wave solder pots designed to maintain recommended solder pot specifications. (read more)

Indium Corporation - Indium Corporation Expands Fine Wire Capabilities

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004” (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications. (read more)

Indium Corporation - WS-3910 Liquid Flip-Chip Flux

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications. (read more)

Indium Corporation - InFORMS® Reinforced Solder

Indium Corporation is redefining solder with its InFORMS solder preforms. (read more)

Indium Corporation - Proven Flux-Cored Wire for Robotic/Laser Soldering

Indium Corporation is offering a proven, award-winning flux-cored wire for robotic and laser soldering. (read more)

Indium Corporation - Indium Corporation Introduces New Ball-Attach Flux

Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. (read more)

Indium Corporation - Solder Alloys...Gold Based Advantages

Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. (read more)

Indium Corporation - Indium Trichloride for R&D, Semiconductors

IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications. (read more)

Indium Corporation - Solder Preforms - A Primer and Video

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy. (read more)

Indium Corporation - Indium Corporation Announces New High-Reli Alloy

Indium Corporation has released a new high-reliability alloy with enhanced thermal cycling performance specially formulated for harsh environments. (read more)

Indium Corporation - Precision (0.00035”) AuSn Preforms

Indium Corporation now offers precision AuSn preforms—AuLTRA® ThInFORMS™—for die-attach applications (read more)

Indium Corporation - No spatter flux-cored wire capabilities

Indium Corporation’s Core 230-RC is specially developed to meet the demanding requirements of robotic and laser soldering. Fully REACH- and RoHS-compliant, it delivers an impressive <1% total flux spatter, as tested per IPC TM-650 2.4.48 standards. (read more)

Indium Corporation - Properties & Applications of Indium VIDEO

Learn about the physical properties, melting point, coefficient of thermal expansion, thermal conductivity, hardness, vapor pressure, etc. and applications such as thermal interface material, compression sealing, cryogenic use, high vacuum use, and many more (read more)

Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at http://www.indium.com/webinar. (read more)

Indium Corporation - New One-Step Ball-Attach & Flip-Chip Flux

Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. (read more)

Indium Corporation - Non Silicone Based Thermal Interface Material

Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges. HSMF-OS, a non-silicone based metal/polymer material, is designed for burn-in and test applications. (read more)

Indium Corporation - Not all fluxes & solder pastes are created equal

Fluxes and solder pastes are specially engineered materials formulated with various applications in mind. The differences in the chemical formulations are such so that specific characteristics of a flux or solder paste can be achieved. You may require ultra-low or near zero residue amounts after reflow, or an enhanced oxygen barrier formulation. (read more)

Indium Corporation - Fine-Grade AuSn Ribbon for Laser Diode Assembly

AuLTRA-fine die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation’s precision, high-volume production lines can produce AuLTRA-FINE ribbons as small as 0.254mm (0.010”) wide by 0.0152mm (0.0006”) thick. (read more)

Indium Corporation - Unique Properties for Challenging Applications

The characteristics of Indium metal are very unusual and deliver the right ingredients & performance in an array of products. Because of its unique properties with virtually limitless applications, indium is literally all around us (read more)

Indium Corporation - New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. (read more)

Indium Corporation - High Purity Indium for Substrate Manufacturing

Indium Corporation supplies high quality indium ingots for substrate makers, and indium and gallium compounds for manufacturers of metal-organic chemical vapor deposition (MOCVD) precursor materials. (read more)

Indium Corporation - Cryogenic Sealing - Advantages of Indium

Indium is ideal for many sealing applications, especially cryogenic sealing. There are two main advantages to using indium in your cryogenic sealing applications:

  • It remains malleable at cryogenic temperatures
  • It is soft and pliable so it fills imperfections in mating metal surfaces and creates a hermetic seal
(read more)
Indium Corporation - Indium our product our service our name 85 years

Indium Corporation was founded in 1934 in Utica, NY by Dr. William S. Murray—a man who dedicated his life to investigating and developing the uses of indium metal. Since those early days, the company has continued to lead and support the advancement of technologies on which we rely today. (read more)

Indium Corporation - Ultra-reliable conductivity for heat dissipation

A new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation, Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity. (read more)

Indium Corporation - Achieving Uniform Solder Bondline Thickness VIDEO

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications. Indium Corporation’s InFORMS® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance (read more)

Indium Corporation - Vacuum Coating Applications of Indium & Gallium

Indium and gallium compounds are used in the manufacturing of a variety of products, including semiconductor chips, electronic components, flat panel displays, and other complex electronic products. (read more)

Indium Corporation - Quality, Quality, Quality - IATF 16949

With the vast amount of electronics now in our cars & trucks, ensuring the performance of those systems is vital. Indium has proven their commitment to supplying the best, high-reliability materials & products for vehicle applications by achieving IATF 16949, meeting the highest standard for automotive industry (read more)

Indium Corporation - Materials to Advance University Research

At Indium Corporation we have created a strong research and development team that has made us a top solder manufacturer with global resources. We understand the challenges that today’s universities and research labs face when developing products. One of the key hurdles in product development is being able to test a variety of options quickly and efficiently and at a reasonable cost. (read more)

Indium Corporation - Thermal Interface Material - Compressible Solution

Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi. (read more)

Indium Corporation - Everything you wanted to know about indium VIDEO

From the discovery of indium metal in 1863 to the advancement of technologies and development of indium for commercial use, learn about the story of this amazing material. Self lubricating bearings for aircraft in WWII to quantum dots this versatile, conductive, malleable material has unique properties with virtually limitless applications. (read more)

Indium Corporation - Solder Ribbon Selector Kit

One of the key hurdles in product development is being able to test a variety of options at a reasonable cost. With our Solder Ribbon Selector Kits you can select various assembly solders to experiment with, then choose the one that works best in your application. (read more)

Indium Corporation -  Flux Coatings-reduce voiding w/Solder Preforms

Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less... (read more)

Indium Corporation - Indium Metal for Soldering and Sealing

No other metal is as versatile as indium metal. In its various forms it is used for:

  • Sealing in cryogenic applications - stays malleable and ductile below -150°C
  • Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C
  • High-end device cooling - reduces operating temperatures by up to 10°C
(read more)
Indium Corporation - Solder Research Kits for New Product Development

One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C. (read more)