Announcements

Shiu Li Technology Co., Ltd has promoted these products / services:

Shiu Li Technology Co., Ltd - Thermal Conductive Die Attach Adhesive

LiPOLY’s TIM12 & TIM14 is a one-part compound with excellent heat dissipation, mechanical and rheological properties. High reliability for the electronic assembly of semiconductor components. Suited for dispensing robots. (read more)

Shiu Li Technology Co., Ltd - Two-part liquid gap filler

Li-POLY DM series is a two-part liquid gap filler for different heights of design gap with a fast-curing feature. Low Viscosity. Thermal Conductivity: 2.2 W/m.k~7.0 W/m.k. Available for dispensing machines. (read more)

Shiu Li Technology Co., Ltd - Thermal Conductive Die Attach Adhesive TIM14

LiPOLY’s TIM14 is a one-part compound silicone base thermal conductive adhesive gel. It’s with high performance and reliability for IC package applications enabling packages with excellent heat dissipation properties. High deformation can fill small air gaps perfectly to absorb tolerance. It’s ideally suited for dispensing robots or syringes. (read more)

Shiu Li Technology Co., Ltd - Thermal Conductive Die Attach Adhesive TIM12

Thermal Conductive Die Attach Adhesive

LiPOLY’s TIM12 is a one-part compound silicone base thermal conductive adhesive gel. It’s with high performance and reliability for IC package application enabling packages with excellent heat dissipation properties. High deformation can fill small air gaps perfectly to absorb tolerance. It’s ideally suited for dispensing ro... (read more)

Shiu Li Technology Co., Ltd - Thermal Conductive RF Absorber Pad

LiPOLY TEM96 series is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 2~4.0 W/m*K. (read more)

Shiu Li Technology Co., Ltd - Thermally Conductive Gap Pad

LiPOLY T-Top 81 is a high deflection material, designed to allow minimal stress on components while offering high thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-Top 81 offers excellent performance at an extremely competitive price. (read more)

Shiu Li Technology Co., Ltd - Thermally Conductive Tape_UL rating

LiPOLY ST6000 is a thermally conductive tape the thermal conductivity is 1.8W/m*K with/without glass fabrics. The thermal conductivity and stickiness will increase when temperature and pressure rise. (read more)

Shiu Li Technology Co., Ltd - High Thermal Conductivity Material_T-work90000

Li-POLY T-work9000

Features

  • Thermal conductivity: 20.0 W/m*K
  • Highly conformable / Dielectric breakdown 8KV/mm
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink
(read more)
Shiu Li Technology Co., Ltd - Liquid Gap Filler- TWO-PART Fast Cured Material

Liquid Gap Filler- Ultra-Conforming Two-Part Fast Curing Thermal Conductive Gel (read more)

Shiu Li Technology Co., Ltd - SH-Putty3 is a Reliable Putty of K= 8.0W/m*K

LiPOLY SH-putty3 is a one-part dispensable material with thermal conductivity of 8.0W/m*K. High deformation can fill small air gaps perfectly to absorb tolerance. It also can overcome overflow and dry-out concerns to increase the thermal conductivity. SH-putty3 is a great alternative to thermal grease and is suited for dispensing robots and manual accessories. Visit us today to learn more! (read more)

Shiu Li Technology Co., Ltd - K=7.0 W/m.k PK700DM Two Part Thermal Material

Features

  • Thermal conductivity: 7.0 W/m.K
  • Low viscosity with Thixotropic characteristics
  • Gel-like material after cured
  • Available for Accelerate cure schedule and Room temperature cured
(read more)
Shiu Li Technology Co., Ltd - PK404DM Electrical Insulated thermally 2-Part Gel

LiPOLY PK404DM is a two-part liquid gap filler for contacting different heights of design gap between the heat source and cooler with a low-pressure application. This gel can be fast cured at room temperature or elevated temperature. It is the best solution for different heights of heat sources or complex shapes and large irregularities in one specific area. (read more)

Shiu Li Technology Co., Ltd - Electrical Insulated Thermal PUTTY

Thermal Conductive Putty | LiPOLY Putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our Putty can replace thermals pads in design gaps of 0.1mm-3.0mm. Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the Putty series is 3.5~8.0 W/m*K. (read more)

Shiu Li Technology Co., Ltd - LiPOLY-20.0 W/m*K Thermal Conductive Gap Filler

Shiu Li Technology-LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 is a high thermal conductivity material with insulating properties, offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. (read more)

Shiu Li Technology Co., Ltd - Ultra-High Performance Thermal Liquid Gap Filler

LiPOLY PK700DM is a two-part, low viscosity with good thixotropic characteristics thermal conductivity gap filler. With a thermal conductivity of 7.0 W/m*K. PK700DM provides high thermal conductivity and low thermal impedance; ultra-conforming, a gel-like material after being cured for fragile and low-stress applications. Available in 50ml and 400ml cartridges. (read more)

Shiu Li Technology Co., Ltd - Don’t Sacrifice Performance for Cost Savings!

LiPOLY T-work series offers outstanding thermal conductivity at 11.0, 15.0, & 20.0 W/m*K with high insulating properties, and extremely low thermal resistance under minimal force. Our T-work series offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. (read more)

Shiu Li Technology Co., Ltd - EPDM30 Two-Part Thermally Conductive Epoxy

EPDM30 Two-Part Thermally Conductive Epoxy

Applications-

  • CPU, MOS, Mother Board, Wireless Hub, Telecom Device, Automotive electronics, Computer.
  • Between any heat-generating component and a heat sink.
(read more)
Shiu Li Technology Co., Ltd - Non-Silicon Thermal Pads

Non-Silicon Thermal Pads

Applications

  • Optical
  • Automotive
  • Networking
  • Sensitive electric
(read more)
Shiu Li Technology Co., Ltd - Liquid Thermal Interface Materials

Thermal Putty vs Thermal Grease vs Two-Part Fast Curing Thermal Conductive Gel (read more)

Shiu Li Technology Co., Ltd - Nano-Thermal Interface Grease

Applications

  • CPU, ICs and chip coolers
  • Power transistors and switching power supplies
  • Between any heat generating component and heatsink
(read more)
Shiu Li Technology Co., Ltd - Thermally conductive non-silicone putty

Applications

  • Notebook computers
  • Optical application
  • LED/TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM
(read more)
Shiu Li Technology Co., Ltd - Tolerance filled, thermally conductive putty

Applications

  • Notebook computers
  • Heat pipe assemblies
  • TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM
(read more)
Shiu Li Technology Co., Ltd - S-Putty is a great alternative to thermal grease

Applications

  • Notebook computers
  • Heat pipe assemblies
  • TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM
(read more)
Shiu Li Technology Co., Ltd - Thermal Grease vs Thermal Pad?

Thermal Grease vs Thermal Pad? (read more)

Shiu Li Technology Co., Ltd - Thermally conductive gel designed for gap filling

Ultra Low Oil-Bleeding Gel Pad: AS200
LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. (read more)

Shiu Li Technology Co., Ltd - Thermally Conductive Tape with Fiberglass

LiPOLY AT900A is a thermally conductive tape, which uses glass fabrics as a base material. The thermal conductivity is 0.9W/m*K. The thermal conductivity and stickiness will increase when temperature and pressure rise. (read more)

Shiu Li Technology Co., Ltd - High-Performance Nano-Thermal Interface Grease

LiPOLY TT3000 is a highly reliable thermal interface grease made of solvent-free silicone oil compounds and thermal fillers.  (read more)

Shiu Li Technology Co., Ltd - Thermal Conductive Liquid Gap Filler – SH-putty3

LiPOLY SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity. (read more)

Shiu Li Technology Co., Ltd - Thermally conductive tape

LiPOLY’s ST6000 is a UL thermally conductive tape with high-temperature heat resistance. The thermal conductivity is 1.8 W/m*K. The stickiness and strength of the thermal tape will increase when temperatures and pressure rise. (read more)

Shiu Li Technology Co., Ltd - Thermal Interface Grease
  • Nano-Thermal Interface Grease: TT3000
  • Thermal Interface Grease: G3380
  • Thermal Interface Grease: G338N Non-silicone
(read more)
Shiu Li Technology Co., Ltd -  High Thermally Conductive Gap Filler

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. (read more)

Shiu Li Technology Co., Ltd - Thermally Conductive Putty

Shiu Li Technology has created a new advanced thermal interface material. (read more)

Shiu Li Technology Co., Ltd - New High-Performance Nano-Thermal Interface Grease

LiPOLY TT3000 is a highly reliable thermal interface grease made of solvent-free silicone oil compounds and thermal fillers.  (read more)