Package Adapters / Converters IC Interconnect Components

Adapter Sockets, PGA plug, 1.0mm pitch/1.27mm pitch -- MPGAP-xxxP-xxxx-xxx
from JC Cherry, Inc.

Adapter Sockets. PGA plug. 1.0mm pitch/1.27mm pitch. Plug for PGA devices. The contact part has highly reliable structure of plural contact fingers. We also welcome custom request. [See More]

  • Product Type: IC Socket; Package Adapters / Converters
  • Operating Temperature: -55 to 150
  • Socket Type: PGA
1582761 [W9344RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

DIP to PLCC Adaptics which emulates PLCC devices with standard dual in line packages. Also, can be used to convert PLCC to dual in line package in times of product shortage or redesign. Plug body: Glass Filled Polyester . Temperature rating: +105 °C. Pitch = 1.27 mm, 15.24 mm. End 1 = 28 Pin... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 15.24
  • Mounting: Through-Hole
PLCC Adapters with Murphy Circuits®
from Advanced Interconnections Corp.

Adapters for Jedec .050" (1.27mm) Pitch PLCC's (Leaded Type A) feature our own patented Murphy Circuits ®. [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole; Solder
  • Socket Type: PLCC
  • Contact Type: Low Profile Pins (optional feature); Solder Tail Pins
DIP-Sockets-Adapters -- KS308-176TG [KS308-176TG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : DIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : No [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • Socket Type: DIP
  • Contacts Pitch: 2.54
Adapter Sockets, PGA Socket, 1.0mm pitch/1.27mm pitch -- MPGAS-xxxP-xxxx-xxx
from JC Cherry, Inc.

Adapter Sockets. PGA Socket. 1.0mm pitch/1.27mm pitch. Socket for PGA devices. The contact part has highly reliable structure of plural contact fingers. We also welcome custom request. [See More]

  • Product Type: IC Socket; Package Adapters / Converters
  • Operating Temperature: -55 to 150
  • Socket Type: PGA
1582799 [WA08080DQAETRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Standard Adaptics stu suit a broad range of QFPs for both development and production requirements. A low cost solution which converts a QFP IC to the data sheet PGA footprint. PCB: Epoxy Fibreglass FR4. Pins: Brass. Plating: Tin over Nickel. Pitch = 0.5 mm, 2.54 mm. End 1 = 80 Pin Female QFP. End 2... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 0.5000 to 2.54
  • Mounting: Through-Hole
DIP-Sockets-Adapters -- RLS308-01MG [RLS308-01MG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : DIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : Yes [See More]

  • Product Type: Package Adapters / Converters
  • Socket Type: DIP
  • RoHS Compliant: RoHS Compliant
  • Mounting: SMT
1582878 [W9501RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 8 Pin Female SOP. End 2 = 8 Pin Male DIP. End 1 Number of Contacts = 8. End 2 Number of Contacts = 8. End 1 Type = SOP. [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
PGA-Sockets-Adapters -- 1RSX503-82GG [1RSX503-82GG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : PGA-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : Yes [See More]

  • Product Type: Package Adapters / Converters
  • Socket Type: PGA
  • RoHS Compliant: RoHS Compliant
  • Mounting: SMT
1582890 [W9502RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 14 Pin Female SOP. End 2 = 14 Pin Male DIP. End 1 Number of Contacts = 14. End 2 Number of Contacts = 14. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
PGA-Sockets-Adapters -- 2RIS156-01TG [2RIS156-01TG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : PGA-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : No [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • Socket Type: PGA
  • Contacts Pitch: 2.54
1582907 [W9503RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 16 Pin Female SOP. End 2 = 16 Pin Male DIP. End 1 Number of Contacts = 16. End 2 Number of Contacts = 16. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
SIP-Sockets-Adapters -- HLSS032-01TG [HLSS032-01TG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : SIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : No [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • Socket Type: SIP
  • Contacts Pitch: 2.54
1582913 [W9504RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 18 Pin Female SOP. End 2 = 18 Pin Male DIP. End 1 Number of Contacts = 18. End 2 Number of Contacts = 18. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
SIP-Sockets-Adapters -- KSA005-79G [KSA005-79G from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : SIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : Yes [See More]

  • Product Type: Package Adapters / Converters
  • Socket Type: SIP
  • RoHS Compliant: RoHS Compliant
  • Mounting: SMT
1582929 [W9505RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 20 Pin Female SOP. End 2 = 20 Pin Male DIP. End 1 Number of Contacts = 20. End 2 Number of Contacts = 20. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
SIP-Sockets-Adapters -- KSS005-85TG [KSS005-85TG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : SIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : No [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • Socket Type: SIP
  • Contacts Pitch: 2.54
1582935 [W9506RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 24 Pin Female SOP. End 2 = 24 Pin Male DIP. End 1 Number of Contacts = 24. End 2 Number of Contacts = 24. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
SIP-Sockets-Adapters -- RLNB014-208TG [RLNB014-208TG from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : SIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : No [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • Socket Type: SIP
  • Contacts Pitch: 2.54
1582957 [W9513RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 24 Pin Female SOP. End 2 = 24 Pin Male DIP. End 1 Number of Contacts = 24. End 2 Number of Contacts = 24. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
SIP-Sockets-Adapters -- RNA004-444G [RNA004-444G from Advanced Interconnections Corp.]
from bisco industries

Products Style : IC-Socket-Adapters, Product Type : SIP-Sockets-Adapters, Pitch : 2.54mm Pitch, ROHS Compliant : Yes [See More]

  • Product Type: Package Adapters / Converters
  • Socket Type: SIP
  • RoHS Compliant: RoHS Compliant
  • Mounting: SMT
1582963 [W9507RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 24 Pin Female SOIC. End 2 = 24 Pin Male DIP. End 1 Number of Contacts = 24. End 2 Number of Contacts = 24. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
1582979 [W9508RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 28 Pin Female SOP. End 2 = 28 Pin Male DIP. End 1 Number of Contacts = 28. End 2 Number of Contacts = 28. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
1582985 [W9509RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics â € ™ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 2.54 mm. End 1 = 32 Pin Female SOP. End 2 = 32 Pin Male DIP. End 1 Number of Contacts = 32. End 2 Number of Contacts = 32. End 1 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
1583023 [W9114RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics that convert dual in line packages from one pitch to another pitch. PCB: Epoxy Fibreglass FR4. Pitch = 15.24 mm, 2.54 mm. End 1 = 24 Pin Female DIP. End 2 = 24 Pin Male DIP. End 1 Number of Contacts = 24. End 2 Number of Contacts = 24. End 1 Type = DIP. End 2 Type = DIP. End 1 Gender =... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 2.54 to 15.24
  • Mounting: Through-Hole
2295531 [WA028127FSAJTRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

acirc; € ˜Adaptics â € ™ of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
2295553 [WA020127FSAJTRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

acirc; € ˜Adaptics â € ™ of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
2295569 [WA032127FSAJTRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

acirc; € ˜Adaptics â € ™ of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
2295575 [WA044127FSAJTRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

acirc; € ˜Adaptics â € ™ of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
2406595 [W9534PRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Two piece â € ˜Adaptics â € ™ that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier. [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 7.62
  • Mounting: SMT
2406602 [W9535PRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Two piece â € ˜Adaptics â € ™ that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier. [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 7.62
  • Mounting: SMT
2406618 [W9539PRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Two piece â € ˜Adaptics â € ™ that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier. [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 7.62
  • Mounting: SMT
2954347 [WA20850PRC from Winslow Adaptics Ltd]
from RS Components, Ltd.

QFP adaptors which convert a broad range of QFP ICs into a PGA footprint. The adaptors are supplied in 2 pieces, the adaptor and its mating PGA socket. QFP Adaptor Body material is Epoxy Fibreglass FR4, Contact material is Brass, Tin over Nickel plating. PGA Socket Body material is Polyphenylene... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 0.5000 to 2.54
  • Mounting: Through-Hole
3413358 [W9393 from Winslow Adaptics Ltd]
from RS Components, Ltd.

DIP to PLCC â € ˜Adaptics â € ™ for surface mount applications. DIP standard package sockets convert through to PLCC surface mount footprints. Heights above PCB:- total 17mm, PCB to bottom of DIP socket, 11mm. PCB: Epoxy Fibreglass FR4. Pitch = 1.27 mm, 15.24 mm. [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 15.24
3890626 [W9590RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

Adaptics converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format. Pitch = 0.65 mm, 2.54 mm. End 1 = 56 Pin Female SOP. End 2 = 56 Pin Male DIP. End 1 Number of Contacts = 56. End 2 Number of Contacts = 56. End 1 Type = SOP. End 2 Type = DIP. End... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 0.6500 to 2.54
  • Mounting: Through-Hole
4017765
from RS Components, Ltd.

Converts SOP IC to DIP IC. Enables SOP IC to be mounted on board manufactured for use with DIP IC. Suitable for use with reflow oven, soldering machine. End 1 = 14 Pin Female SOP. End 2 = 14 Pin Female DIP. End 1 Number of Contacts = 14. End 2 Number of Contacts = 14. End 1 Type = SOP. End 2 Type =... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
4350674 [W2443RC from Winslow Adaptics Ltd]
from RS Components, Ltd.

acirc; € ˜Adaptics â € ™ of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign... [See More]

  • Product Type: Package Adapters / Converters
  • Contacts Pitch: 1.27 to 2.54
  • Mounting: Through-Hole
0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
High Frequency TO and Microelectronic Packages
from NEC / Schott

Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all of the components involved are designed for operation at high frequencies. Hence, the easiest way to speed up data transfer rates in communication networks is to replace the... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT; Through-Hole
  • Socket Type: Transistor Sockets
132-Pin Amp PQFP-to-PGA Footprint Socket
from Aries Electronics, Inc.

FEATURES. Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105
Microelectronic Packages/ Hybrids
from NEC / Schott

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT; Through-Hole
144-Pin QFP-to-PGA Adapter for Motorola 68340
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105
144-Pin VQFP-to-PGA Adapter
from Aries Electronics, Inc.

FEATURES. Convert surface-mount VQFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105
20-Pin SSOP-to-20-Pin SOWIC Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SSOP without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: SMT
  • Contact Plating: Nickel (optional feature); Tin/Lead
24-Pin SOIC-to-22-Pin 0.400" DIP
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
24-Pin SOWIC-to-0.400" CTR DIP Adapter for 75ALS162 & Others
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. RoHS Compliant Board FR406 or IS410 per IPC 4101A/46. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Operating Temperature: 105
36-Pin SSOP-to-0.600" DIP Adapter
from Aries Electronics, Inc.

GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. PADS: bare Cu protected with Entek ® by Enthone or Omikron ® white Sn to eliminate co-planarity concerns and solder bridges. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. OPERATING TEMPERATURE: 221 °F... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
40-Pin DIP-to-Socketable PLCC Adapter
from Aries Electronics, Inc.

FEATURES. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44-pin PLCC socket. On-board bypass capacitors to reduce... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: PLCC
  • Operating Temperature: 105
44-Pin 0.8mm QFP-to-44-Pin PLCC Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to QFP without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: SMT
  • Contact Plating: Nickel (optional feature); Tin/Lead
48-Pin 0.5mm QFP-to-48-Pin 0.600" DIP Adapter
from Aries Electronics, Inc.

EATURES. Makes 48-pin QFP prototype circuits with a standard breadboard easy. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASASTM B579-73 over... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
68-Pin PLCC Motorola MC68HC000-to-64-Pin DIP
from Aries Electronics, Inc.

FEATURES. Allows easy replacement of a difficult-to-find part. GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. MALE PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM B579-73 over 100 µ [2.54 µ]... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
Adapter for Motorola MC145158-2 SOIC D to 20-Pin PLCC
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: SMT
  • Contact Plating: Nickel (optional feature); Tin/Lead
Adapter Replacement for Aromat HB2E Relay with SM Type TXSS
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
BGA Switch-A-Pitch™ Adapters
from Aries Electronics, Inc.

FEATURES. Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements). Enable the use of standard line and trace spacing. Eliminate... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: SMT
  • Contact Type: Solder Spheres
DIP-to-JEDEC TO Adapter Socket
from Aries Electronics, Inc.

FEATURES. 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. GENERAL SPECIFICATIONS. SOCKET BODY: black UL... [See More]

  • Product Type: Package Adapters / Converters
  • Current Rating: 3
  • Mounting: Through-Hole
  • Operating Temperature: 105
Fine Pitch Bump Adapters
from Aries Electronics, Inc.

FEATURES. Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm. Features raised connection pads up to 0.010 [0.25]. Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly. Can be manufactured for RoHS compliance. GENERAL SPECIFICATIONS. BOARD... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: SMT
  • RoHS Compliant: RoHS Compliant
  • Operating Temperature: 105
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Converter – RoHS-Compliant
from Aries Electronics, Inc.

FEATURES. Lead-free RoHS/WEEE-compliant. A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides. PADS: finished with ENIG (Immersion... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Gold (optional feature); Nickel (optional feature)
PLCC-to-16-Pin DIP Adapter for Motorola MC12009 & Other Microprocessors
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to PLCC package without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 ASTM... [See More]

  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
  • Mounting: Through-Hole
  • Contact Plating: Nickel (optional feature); Tin/Lead
PLCC-to-DIP Adapter – RoHS/WEEE-Compliant
from Aries Electronics, Inc.

FEATURES. Converts PLCC packaged ICs-to-DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC Sockets or PLCC Pads on top side. For Panelized Form or for mounting of consigned ICs, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: 0.062 [1.58] FR-4 or IS410 per IPC... [See More]

  • Product Type: Package Adapters / Converters
  • Socket Type: PLCC
  • RoHS Compliant: RoHS Compliant
  • Mounting: Through-Hole
PLCC-to-DIP Adapter for Intel 80/83C652 and 80C251 Microprocessors
from Aries Electronics, Inc.

Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342. FEATURES. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. Allows user to switch package styles and avoid shortage problems. Designed to plug directly... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: PLCC
  • Operating Temperature: 105
PLCC-to-PGA Adapter
from Aries Electronics, Inc.

FEATURES. Convert surface-mount PLCC packages to a PGA footprint. Pin polarization option also available. For Panelized Form or for mounting of consigned chips, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces. PADS: hot-air solder leveled. [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: PLCC
  • Operating Temperature: 105
QFP-to-PGA Adapter for 160-Position, 0.0256" [0.65mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105
QFP-to-PGA Adapter for JEDEC 132-Position, 0.025" [0.64mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105
QFP-to-PGA Adapter for Motorola DSP56000/001
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
  • Socket Type: QFP
  • Operating Temperature: 105