Anti-static / ESD Control EMI and RFI Shielding

Custom Bonding and Adhesive System
from Boyd Corporation

Adhesives, also commonly referred to as bonding systems, adhesive tape and pressure sensitive adhesive (PSA), are highly engineered materials typically used to adhere various materials together or bond a component into an assembly. There are a number of key performance indicators that help Boyd... [See More]

  • Type / Form: Tape
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Material System: Composite; Elastomer / Rubber; Plastic
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1
from Master Bond, Inc.

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 400
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Type / Form: Adhesive
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
Fast Curing, High Temperature Resistant Epoxy -- EP65HT
from Master Bond, Inc.

Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 400
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 500
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 275
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -60 to 250
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type / Form: Adhesive; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: ? to 500
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Type / Form: Adhesive; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 450
Two Component, Fast Curing Epoxy Adhesive -- EP65
from Master Bond, Inc.

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -80 to 400
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -452 to 275
Tape; Anitstatic Conductive Shielding Grid; 0.5 in. + 0.030 in.; 3 in.; 36 m -- 70213840 [81250 from Desco Industries, Inc.]
from Allied Electronics, Inc.

Antistatic Tapes, +20 °C Storage Temperature, 1 in. to 3 in. Dia. Core. Antistatic Tapes reduce the generation of static charges when tapes are unrolled or removed from surfaces; using antistatic tapes instead of regular insulative tapes protects your ESD sensitive products. This if for... [See More]

  • Features: Anti-static / ESD Control
Tape; Anitstatic Conductive Shielding Grid; 0.75 in. + 0.030 in.; 3 in.; 36 m -- 70213841 [81251 from Desco Industries, Inc.]
from Allied Electronics, Inc.

Antistatic Tapes, +20 °C Storage Temperature, 1 in. to 3 in. Dia. Core. Antistatic Tapes reduce the generation of static charges when tapes are unrolled or removed from surfaces; using antistatic tapes instead of regular insulative tapes protects your ESD sensitive products. This if for... [See More]

  • Features: Anti-static / ESD Control
Tape; Anitstatic Conductive Shielding Grid; 1 in. + 0.030 in.; 3 in.; 36 m -- 70213842 [81252 from Desco Industries, Inc.]
from Allied Electronics, Inc.

Antistatic Tapes, +20 °C Storage Temperature, 1 in. to 3 in. Dia. Core. Antistatic Tapes reduce the generation of static charges when tapes are unrolled or removed from surfaces; using antistatic tapes instead of regular insulative tapes protects your ESD sensitive products. This if for... [See More]

  • Features: Anti-static / ESD Control
Tape; Anitstatic Conductive Shielding Grid; 2 in. + 0.030 in.; 3 in.; 36 m -- 70213843 [81253 from Desco Industries, Inc.]
from Allied Electronics, Inc.

Antistatic Tapes, +20 °C Storage Temperature, 1 in. to 3 in. Dia. Core. Antistatic Tapes reduce the generation of static charges when tapes are unrolled or removed from surfaces; using antistatic tapes instead of regular insulative tapes protects your ESD sensitive products. This if for... [See More]

  • Features: Anti-static / ESD Control