Electrical Insulating / Dielectric EMI and RFI Shielding

EMI/RFI Shielded Foam
from Boyd Corporation

Seams and openings in electronic devices provide avenues for rogue energy waves to enter or exit a device, causing erratic performance. This is known as EMI (electromagnetic interference). Managing electromagnetic interference commonly includes a specialized form of EMI shielding or use of an EMI... [See More]

  • Type / Form: Stock Shape or Fabricated Part
  • Features: Dielectric or Electrically Insulating; Electrically Conductive
  • Material System: Elastomer / Rubber; Plastic
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Flat Cable Tape with a Shielded Layer
from Sheldahl Flexible Technologies - a Flex company

The proliferation of electronic devices in the world has increased the presence of and sensitivity to electromagnetic interference (EMI) and radio frequency interference (RFI). Sheldahl enables unique solutions to overcome EMI and RFI, whether your needs relate to gasketing, metalized wrapping, thin... [See More]

  • Type / Form: Tape
  • Features: Dielectric or Electrically Insulating
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1
from Master Bond, Inc.

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 400
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Type / Form: Adhesive
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
Fast Curing, High Temperature Resistant Epoxy -- EP65HT
from Master Bond, Inc.

Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 400
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Type / Form: Adhesive
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
Flexibilized Epoxy System -- Supreme 10HTFL
from Master Bond, Inc.

Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350 °F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 300
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 500
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 275
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type / Form: Adhesive; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: ? to 500
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Type / Form: Adhesive; Encapsulant; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 450
Two Component, Fast Curing Epoxy Adhesive -- EP65
from Master Bond, Inc.

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -80 to 400
EMI Shielding Tape, Ni/Cu/Polyester Fabric, Adhesive Backed -- Z-3250-Tape
from Zippertubing Co. (The)

Z-3250 Tape is a conductive EMI Shielding Tape consisting of Zippertubing â € ™s Z-3250-CN EMI shielding fabric and an electrically conductive transfer adhesive backing. The adhesive eases installation and insures continuous continuity between individual coil winds. This material... [See More]

  • Material System: Plastic
  • Features: Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -49 to 302
EMI Shielding Tape, Polyurethane and Ni/Cu/Polyester Shield -- Shielded ZT-Tape®
from Zippertubing Co. (The)

Shielded ZT-Tape ® is a combination of Zippertubing's fire retardant Polyurethane ZT-Tape ® stagger bonded to a layer of Z-3250-CN shielding fabric with an electrically conductive adhesive backing. When spirally wrapped around electrical wires or other items using a 50% overlap technique,... [See More]

  • Material System: Other; Polyurethane
  • Features: Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -49 to 225
EMI Shielding Tape, SnCu Mesh/Copper Foil, Adhesive Backed -- Zip-Mesh®-Cu
from Zippertubing Co. (The)

Zip-Mesh ®-Cu is a flexible, easy-to-use EMI Shielding tape of two-ply, woven Tinned-Copper mesh, separated by Copper polyester tape, with a self-adhesive material on one side. The material offers very low electrical resistance and is intended to compliment Zippertubing's "SH1" Foil and "SHX"... [See More]

  • Use Temperature: -40 to 347
  • Features: Dielectric or Electrically Insulating; Electrically Conductive