Thermal Compound / Interface EMI and RFI Shielding

Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Type / Form: Casting Resin; Thermally Conductive or Thermal Interface Material
  • Use Temperature: 482
  • Material System: Metal; Plastic; Thermally cured
  • Features: Electrically Conductive
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -452 to 275
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
Graphite Filled, Electrically Conductive Epoxy -- EP75-1
from Master Bond, Inc.

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 250
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -60 to 250
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
One Component, Electrically Conductive Coating System -- MB600G
from Master Bond, Inc.

Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Use Temperature: 0.0 to 700
  • Material System: Other; Sodium Silicate System
  • Features: Anti-static / ESD Control; Electrically Conductive
One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO
from Master Bond, Inc.

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler,... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material; NASA low outgassing
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -60 to 400
Radiopaque Two Component Epoxy Compound -- EP21BAS
from Master Bond, Inc.

Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical and chemical properties. A user friendly one-to-one (1/1) mix ratio by weight or volume... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding -- MB600S
from Master Bond, Inc.

Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a shielding... [See More]

  • Type / Form: Adhesive; Coating; Encapsulant; Thermally Conductive or Thermal Interface Material
  • Use Temperature: 0.0 to 700
  • Material System: Other; Sodium Silicate System
  • Features: Anti-static / ESD Control; Electrically Conductive
Silver Filled, Electrically Conductive Adhesive Film -- FL901S
from Master Bond, Inc.

Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed... [See More]

  • Type / Form: Adhesive; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -100 to 400
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS
from Master Bond, Inc.

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 275
Thermally Conductive Room temperature Curing Epoxy -- EP21AN
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU •in/ft ² •hr • °F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 250
Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1
from Master Bond, Inc.

Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It develops a high bonding... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -452 to 400
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -300 to 250
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Type / Form: Adhesive; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Electrically Conductive
  • Use Temperature: -452 to 275
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO
from Master Bond, Inc.

Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]

  • Type / Form: Adhesive; Thermally Conductive or Thermal Interface Material; NASA Low Outgassing
  • Features: Electrically Conductive
  • Use Temperature: -100 to 275