Embedded Passives (Capacitance / Resistance) RF and Microwave Laminates

Embedded Capacitance Material -- FaradFlex®
from Denkai America

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Features: Dielectric / Insulating; UL 94V. UL746; Embedded Passives; IPC; UL Listed
  • Thickness: 3.15E-4 to 9.84E-4
  • Materials: Metal Foil; Plastic / Polymer; Copper Foil
  • Temperature Resistance: 125 to 160