Tested to IPC RF and Microwave Laminates

All Polyimide Copper Clad Laminate -- Pyralux® TA/TAH
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. They offer ideal balance between low loss performance, good bendability and easy processability. Features. Low dissipation factors (Df) enables low dielectric loss. [See More]

  • Features: IPC; UL Listed
  • Thickness: 0.0020
  • Materials: Polyimide (e.g., Kapton®); Plastic / Polymer
  • Width: 19.7
Embedded Capacitance Material -- FaradFlex®
from Denkai America

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Features: Dielectric / Insulating; UL 94V. UL746; Embedded Passives; IPC; UL Listed
  • Thickness: 3.15E-4 to 9.84E-4
  • Materials: Metal Foil; Plastic / Polymer; Copper Foil
  • Temperature Resistance: 125 to 160