Cerium Oxide Chemical Mechanical Planarization (CMP) Slurries Datasheets

Cerium Oxide
from Ferro Corporation-Electronic Material Systems

Offer a range of purities, average particle size can be smaller than 100nm [See More]

  • Compound / Abrasive Type: Cerium Oxide
  • Form: Powder
  • Type: CMP / Wafer Planarization; Polishing
  • Materials / Substrates Finished: CeramicsGlass; Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials