Casting Resin / Two-part (A+B Liquids) Foam Insulation

Polymethylene Polyphenylisocyanate -- PAPI™ 27
from Dow Polyurethanes

PAPI* 27 polymeric MDI is a. polymethylene polyphenylisocyanate. that contains MDI. This product has a. narrow molecular weight distribution. and a high reactivity. Applicable to. many foam processes, this product is. compatible with rigid polyether and. polyester polyols, making it suitable. for a... [See More]

  • Form / Shape: Casting Resin
  • Material / Composition: Polymer / Plastic; Polymeric MDI
  • Foam, All Types (View Trigger): Foam
  • Density: 77.05
Low Density Rigid Polyurethane Foam -- 20-2023
from Epoxies Etc...

Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]

  • Form / Shape: Casting Resin
  • Material / Composition: Polymer / Plastic; Elastomer; Polyurethane
  • Foam, All Types (View Trigger): Foam
  • Density: 2.2