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On-Demand Webinar:

Bluetooth Mesh® - State-of-the-art Mesh Technology in Silicon and Software

Bluetooth Special Interest Group (SIG) published the Bluetooth Low Energy Mesh 1.0 standard in July 2017. This specification adds a new mesh topology option to existing Bluetooth LE solutions. Attendees will get an introduction to Bluetooth LE mesh, its applications and Toshiba’s solutions.



Date: January 23, 2018
Time: 10 AM EST (7 AM PST)
Duration: 1 hour
Presented by:

Overview

European time: 4 pm CET

Bluetooth Special Interest Group (SIG) published the Bluetooth Low Energy Mesh 1.0 standard in July 2017. This specification adds a new mesh topology option to existing Bluetooth LE solutions. Today, the low power wireless landscape is very fragmented, which results in isolated solutions with very limited interoperability between each other. Furthermore, no other low power wireless technology is present in mobile phones, tablets and PCs. Hence there is always a bridge required, which comes with its own set of downsides. Due to its ubiquitous industry support, it is expected that Bluetooth LE mesh will rapidly increase market share in various applications that traditionally used other interface technologies.

This webinar provides an introduction to Bluetooth LE mesh and highlights some of its major features. Furthermore it explains the benefits for users and gives some examples of possible applications.

Attendees will also learn about Toshiba's Bluetooth LE mesh solutions, which consist of a Bluetooth LE IC family, stack and mesh extensions. The webinar also introduces the benefits and unique features of the Toshiba Bluetooth LE hardware solutions.

The webinar will be wrapped up with a Q&A session in which participants get the opportunity to ask questions to the presenter.

Key Take-Aways

  • Learn the fundaments of Bluetooth LE mesh
  • Understand the benefits of Bluetooth LE mesh for various applications (not only lighting)
  • Get to know the applications in which Bluetooth LE mesh is used
  • Discover Toshiba's Bluetooth LE mesh capability (FW & SW) in conjunction with G2/G3 HW
  • Learn about Toshiba Bluetooth LE solutions and get more insight in the technology.

Speaker

Sven Hegner, Chief Engineer Solution Marketing, Toshiba Electronics Europe GmbH

Sven Hegner has more than 17 years of experience in the semiconductor industry, ranging from IC development, business development and standardisation to technical marketing. Since four years he has been focusing on developing MCU and Bluetooth based solutions for innovative markets like wearable devices, smart home and smart building. Sven is the chief engineer responsible for smart home, building automation and energy management systems at Toshiba.