Electrically conductive adhesives have been widely used in many applications, such as die attaching, electronic packaging, surface mounting applications, RF grounding, EMI shielding, solar panel assembly, and so on. Traditionally, these adhesives are liquids/pastes and need dispensing or printing processes for application. Typically, they have short work life and open time. It's difficult to set and ensure a uniform void-free bonding line thickness across a large area. In addition, advanced semiconductor devices such as Gallium Nitride (GaN), Gallium Arsenide (GaAs) and Silicon Carbide (SiC) can safely operate at elevated operating temperatures, which many traditional adhesives cannot withstand.
Understanding these limitations, Henkel developed a new product combining excellent workability of B-stageable state and high temperature-stable resin technology. This product is Loctite Ablestik CF3366, a silver filled epoxy film adhesive. Its well-controlled film thickness and B-stageable characteristics offer excellent workability in terms of bonding line control and work life. This product contains rubberized particles to balance flexibility and adhesion strength and offer high adhesion strength at elevated temperatures.
These unique characteristics make it an excellent choice in RF grounding applications, especially for harsh environmental conditions.
Webinar attendees will learn about this new product, including its excellent workability and superior high temperature performance.
- Learn how CF 3366 is formulated to maintain adhesion at elevated temperatures up to 200°C but cure at temperature as low as 125°C
- Learn Henke's adhesive film product portfolio
- Gain further insights through a case study of CF 3366 comparing to 5025E
- Understand application process and issues related to supply chain
Yuan (David) Zhao received his Ph.D. in mechanical engineering from University of Maryland College Park. He has over 20 years of research and industrial experience and joined Henkel in 2014. Before that, he was with Rockwell Scientific/Teledyne Scientific and Imaging. In his previous work, he served as Principal Investigator (PI) or Co-PI for multiple projects sponsored by Defense Advanced Research Project Agency (DARPA) or Office of Navy Research (ONR), including Nano Thermal Interface (NTI) and Thermal Ground Plane (TGP), and collaborated with various industrial patterners including Boeing, BAE Systems, Northrup Grumman and Rockwell Collins.