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Upcoming Webinar:

Thermal interface materials for power modules: Optimized, pre-applied and trouble-free

Do you know why thermal interface materials have a critical role in power electronics applications? Join this webinar to learn how thermal interface materials work, how to choose the right material and how you can benefit from pre-applied materials in your application.



Date: April 4, 2019
Time: 10 AM EDT (7 AM PDT)
Duration: 1 hour
Presented by:

Overview

SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. Already more than 15 million pre-printed modules in the field set reliability benchmarks in the industry. In parallel new materials are launched regularly to meet ever-demanding and challenging applications.

In power electronics systems design the thermal interface material (TIM) plays a crucial role in the overall of the end product. It is the main contributor to the complete thermal impedance between the power electronic chip and the heatsink. Thus optimizing TIM is very sensible and can lead to great benefits in the application.

In the first part, the webinar explains the working principle of TIM. It presents and compares different materials. A special focus is set on optimizing the thermal interface material layer: the influence of material choice, layer thickness and printing pattern are discussed in detail. The webinar's second part guides the user through the choice of the right material. It explains which material is used best for different power modules and how the user can benefit from pre-applied TIM on the power module.

Key Takeaways

  • Discover the working principles of different thermal interface materials
  • Understand ways to optimize thermal interface materials' performance
  • Learn about expected performance improvements
  • Find out the benefits of pre-applied thermal interface materials

Speakers

Stefan Häuser, Senior Manager Product Marketing International, SEMIKRON

Stefan Häuser has a diploma in Electrical Engineering. From 2001 to 2011 he worked as group leader application in engineering for industrial motor drives at Yaskawa Europe. Joining SEMIKRON in 2011 as a product manager, he changed to his current position as senior manager of product marketing for the complete range of power modules in 2015. Beside the IGBT and thyristor/diode based power module market he also focuses on silicon carbide power module strategy.

Stefan Hopfe, Product Manager Thermal Interface Materials, SEMIKRON

Stefan Hopfe graduated as Dipl.Ing. (graduated Engineer) in Industrial Engineering at the Technical University in Ilmenau, Germany, with focus on energy management in 2008. He joined SEMIKRON in 2011 as a product manager and since 2013 he solely focusses on the technical assessment, strategy and implementation of thermal interface materials into the complete product range of power modules in SEMIKRON.