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Upcoming Webinar:

Power GaN FET and Copper Clip Packaging Technology: Optimized Performance and Reliability

Register to learn about Nexperia’s new future proof option, CCPAK, a copper clip cascode GaN HEMT package that brings all the benefits of a copper clip to applications using 650 V and above.



Date: November 2, 2020
Time: 9 AM EST (6 AM PST / 3:00 PM CET)
Duration: 1 hour
Presented by:

Overview

We are moving into a new era of highly efficient power conversion at increasingly higher frequency switching, from automotive electrification, industrial automation to power supplies requiring new power semiconductor technology beyond Si and new packaging technology to match this. Hence, power GaN FET technology instead of Si, and Cu clip bonded packaging technology instead of traditional wire bonded D2 and TO packages.

Nexperia have developed a new future proof option, CCPAK, a copper clip cascode GaN HEMT package that brings all the benefits of a copper clip to applications using 650 V and above. Targeted for high reliability high performance applications. Very fast switching power GaN FET technology is complemented with high performance low inductance all clip bonded surface mount package.

Package innovation needs to match with technology advances, which is why Nexperia have developed a new future proof option, CCPAK, a copper clip cascode GaN HEMT package that brings all the benefits of copper clip, such as thermal performance, board level reliability, and advanced optical inspection (AOI) to power GaN FETs. As well as the above features, CCPAK has a 12 x 12 outline, which is 10% smaller than D2PAK,meaning future die sizes can be housed within the same outline.

For the application of high power high performance in power supply, solar inverter, OBC, DC-DC and traction inverter. This will allow the highest power density.

Key Takeaways

  • Learn about Nexperia's high voltage (650V) robust power GaN FET technology with high Vth (4V) and robust gate rating(+-20V)
  • Discover GaN FET's high design margin, which is easy to drive and control
  • Understand how CCPAK brings all the copper clip benefits in a reliable surface packaging technology
  • Learn how CCPAK is targeted for high reliability high performance applications offering low parasitic inductance and high current

Speaker

Dilder Chowdhury, Director of Strategic Marketing for Power GaN Technology, Nexperia

Dilder Chowdhury has worked in semiconductors for over 24 years, first joining Nexperia's Innovation team, then moving to Marketing and the role as Architect for Power GaN technology in Manchester. His current role is Director of Strategic Marketing for Power GaN technology.

His job encompasses everything from device physics down to packaging and end-products, where Nexperia investigates and combines all the value that our company can add to the offering of GaN and GaN-related packages, products and modules. It is a strategic approach designed to bring the best without compromising the robustness and quality.