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Reducing the power and footprint of high channel count Direct RF Sampling Solutions with Zynq UltraScale+ RFSoC

The integration of direct RF-sampling data converters with Xilinx’s Zynq UltraScale+ RFSoC technology offers the most flexible, smallest footprint, and lowest power solution for a wide range of radio applications.



Originally presented: September 11, 2018
Duration: 1 hour
Presented by:

Overview

To achieve the performance required of the latest generation of wireless access, DOCSIS cable modems, and a range of Aerospace and Defense applications, direct RF-sampling technology holds the promise of increased agility and higher performance. Direct RF-sampling enables a new level agility and intelligence by moving much of the RF signal processing into the digital domain, thereby eliminating much of the analog signal processing.

However, there is immense market pressure to reduce the power and footprint of these systems. This presentation outlines a solution which integrates high channel counts of RF-sampling data converters with SOC devices using advanced CMOS technology. Xilinx has long provided highly flexible digital signal processing solutions for a range of radio applications. By integrating direct RF-sampling data converters with the programmable device a highly adaptable platform for radio development that also addresses many of the challenges associated with current discrete direct RF-sampling solutions.

Key Takeaways

  • Direct RF Sampling Solutions enable highly flexible RF front end solutions by moved much of the signal processing in the digital domain
  • The integration of state of the art RF sampling converters with advanced CMOS technology is possible and can dramatically reduce the footprint and power associated with high BW and antenna counts
  • Xilinx now provides Direct RF Sampling solutions integrated with the latest generation of MPSoC devices along with flexible evaluation and prototyping boards.

Speakers

Anthony Collins, Senior Manager, Technical Marketing, Xilinx Inc.

Anthony Collins holds a Hons. Dip. EE from the Dublin Institute of Technology and the B.Sc.Eng. degree from Trinity College Dublin. He received the MBA from the Smurfit Post Graduate School of Business, University College Dublin, in 2008. He is a Senior Staff Technical Marketing Engineer at Xilinx Inc. with specific responsibility for high performance data converters. He has over 20 years' experience in applications and marketing roles supporting analog and mixed signal semiconductor products across a wide range of end applications and market segments.

Bob Tait, Senior Manager, Channel Marketing, Xilinx Inc.

Bob Tait, also holds a Hons. Dip. EE from the Dublin Institute of Technology and the B.Sc.Eng. degree from Trinity College Dublin. He received his MBA from the Open University Business School in 2007. He has over 30 years global experience in sales and marketing across the semiconductor value chain and is currently responsible for Xilinx Channel Marketing in EMEA.