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On-Demand Webinar:

Thermal Interface Materials 101 – Enhanced Cooling for Electronic Systems

Consumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces.



Originally presented: September 26, 2019
Duration: 0.75 hour
Presented by:

Overview

Consumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. Boyd and 3M™ help make this time exhilarating by lending expertise in electronics systems to help empower the next generation of innovation. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces.

Boyd and 3M™ offer a wide range of adhesives, tapes, fillers and more, including options with other desirable properties such as electrical insulation and vibration damping. Optimized for efficient processing, these materials provide unique opportunities to design thinner, lighter, more reliable electronic devices - and beat the heat.

The webinar will discuss three types of solutions that warrant deeper understanding: thermally conductive interface tapes, thermally conductive interface pads and phase change materials.

Key Takeaways

  • Gain insight into the characteristics of key thermal interface material options that are ideal for low profile applications
  • Learn how TIMs are used in low profile applications and their benefits to a product
  • Understand the range of customization options & integration through precision converting

Speakers

Joseph Forbes Petri, Assembly Solutions Account Manager, 3M Electronic Materials Solutions Division

Joseph is currently a 3M Electronic Assembly Solutions Account Manager here in the USA. Joseph is a valuable resource for engineering and converting discussions regarding Thermal Interface Materials, Electrically Conductive Adhesives, Shielding and Grounding Tapes, and EMI Absorber Materials for electronics applications in many markets. With over 30 years of Converting experience, Joseph previously managed a 3M Industrial Adhesive and Tape business simultaneously holding the Product Marketing, Application Development Manager and Key Account Manager responsibilities to drive innovative solutions with Customers.

Andy Chou, ODM Sales Director, Boyd Corporation

Andy Chou is an ODM Sales Director with over 15 years of experience working in the area of thermal management solutions. He also leads Boyd's NPI team in developing new and innovative thermal management products and applications. With experience as a global technical engineer, key account manager and product manager, Andy is keenly in tune to the thermal management industry and attendant market trends.