Multiple market drivers and recent technology innovations are likely to cause disruptive change in manufacturing of electronics. This webinar will cover the changes underway, the technology innovations that are driving this inflexion point and materials that will enable innovative electronic structures and devices of tomorrow.
Flexible electronics offers substantial advantages compared to conventional, rigid, FR-4 based assemblies. These include significant weight reduction, thinner devices and smaller stand-offs, remarkable design flexibility, integrated structure and, substantially simpler BOM, among other benefits.
Flexible hybrid electronics (FHEs) involves assembly of packages, discretes and processors on etched flexible printed circuitry. MacDermid Alpha's ultra-low temperature solders (ULTSs) are key enablers of FHE. Using ULTS permits solder assembly, on low temperature PET substrates using widespread SMT infrastructure to build sophisticated flexible circuits.
Printed electronics (PEs) involves additively printing silver and dielectric inks to fabricate functional circuits. Use of highly conductive silver inks, dielectric inks and adhesives enable novel circuits for diverse range of applications to be built. End applications of PEs range from basic RFID and smart packaging, to more sophisticated, multi-functional applications such as white goods, consumer electronics and aerospace.
In-mold electronics (IMEs) involves integration of established technologies, such as film insert molding (FIM), SMT electronics assembly, followed by thermoforming and injection molding to produce innovative, integrated, monolithic 3D electronic structures. Formable silver inks, formable dielectric ink and electronic adhesives are the key building blocks of IME. Benefits include a simpler BOM, reduced manufacturing costs, light weighting and next generation HMI design freedom.
We will show how innovative suites of high-performance electronic materials, coupled with innovations in processing, are enabling electronic structures of tomorrow.
• Learn about the major technology inflexion points underway in electronics are assembled and built.
• Understand key drivers that are the impetus behind the broad-based changes underway.
• Learn how innovations in low temperature solders are enabling electronics to be built on low temperature PET substrates, and how use of thermoformable low temperature substrates can be injection molded to produce standalone compact 3D electronic structures.
Currently, Rahul Raut is responsible for leading new business development programs and for building and deploying growth strategies. He is author and co-author of more than 50 technical papers at various international conferences. Topics covered include flexible, formable electronics and printed electronics, advanced electronic materials, assembly processes, thermal management, sustainability and in emerging technologies, such as energy, graphene and 2D materials. He is also co-inventor of multiple patents.
Rahul Raut has a Bachelor's Degree in mechanical engineering and a master's degree in industrial engineering. He is a certified Six Sigma Black Belt in DMAIC and DFSS streams. Raut also has an executive certification in management and leadership, from Sloan School of Management, MIT.
is responsible for developing materials and technologies for electronics assembly,
semiconductor packaging and power electronics. Currently, he is responsible for
identifying and developing emerging technologies and establishing new business
verticals. Singh holds a Ph.D in plasma physics
from the University of Aston in Birmingham, U.K. He has over 65U.S. patents,
and has published over 100 technical papers covering a diverse in a range of
technical areas. He specializes in nanotechnology-based