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Integrated Test Solutions for 5G, Data Centers and High-Speed Test Applications

The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chips (SoCs) ever produced.




Originally presented: January 25, 2023
Duration: 1 hour
Presented by:

Overview

The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets and car infotainment systems have the most sophisticated System-on-Chips (SoCs) ever produced. Testing these devices in full functionality requires comprehensive understanding of the impact the interconnect has on the signal path to address high speed signaling and critical device power requirements. Beyond these requirements, how can one ensure these SoCs function with exceptional reliability and accuracy?

This presentation will walk you through how Smiths Interconnect’s high performance test solution helps to accomplish two goals:

  1. Provide an integrated test solution to meet the required device specification, so the product’s full functionality can be tested.
  2. Ensure an out-of-the-box solution for high yield production testing to meet time-to-market pressures.

Key Takeaways

  • Examine the high-speed test challenges that accompany SoC evaluation 
  • Learn how the high-speed test sockets series meets the most demanding power/performance requirements for smart applications, including wearables, data centers and autonomous vehicles      
  • Discover how the Smiths Interconnect’s high performance test solution delivers a full functionality appraisal of SoCs under test

Speakers

Tim Wooden, Market Development Director Semiconductor Test, Smiths Interconnect

Tim Wooden is an expert in semiconductor package test, with deep experience in the design, deployment, and application of advanced test socket solutions, system level, RF testing, PoP, SoC, high power, thermal and fine pitch. He has worked for Smiths Interconnect for more than three years, covering technical sales, product development and business development roles.


Steven Davis, Fields Applications Engineer Semiconductor Test, Smiths Interconnect

Steven Davis is a senior field applications engineer with 11 years of experience in the role. He started his career as a mechanical design engineer and has been with Smiths Interconnect over 16 years, gaining broad experience in providing professional contributions to the company's product lines. Davis has a comprehensive and thorough understanding of the technical drivers that impact the electro-mechanical interface performance in test applications and has designed, qualified and supported customer applications for all phases of the test process from bench and hand test, to high volume production.