The electromechanical design project is over. The product is complete, delivered and out-the-door. Timescales were met – well, nearly - and the customer is happy. Time to take stock, to celebrate, or get started on the next design project. But how much of your success was down to human intervention between disciplines? Shouldn’t our design software do that stitching for us?
The webinar will explain how to remove the human glue between your design domains by moving the stitching to where it belongs: the design toolset. We’ll describe how using the latest MCAD and ECAD software tools in an integrated design flow during system and product development can provide design checking and verification at every step of the way. Finding and fixing errors before they can propagate down the chain. Getting your product to market quicker, at less cost and with higher quality.
Overview
The electromechanical design project is over. The product is complete, delivered and out-the-door. Timescales were met – well, nearly - and the customer is happy. Time to take stock, to celebrate, or get started on the next design project.
But how much of your success was down to human intervention between disciplines? People: engineers, designers making sure that information and design intent were correctly transferred from domain to domain. That the design in each domain was correct and verified, before progressing to the next. The human glue that so often stitches our mechanical and electronic disciplines together, that makes sure the overall project hangs together and the output from each design domain works with the next. Shouldn’t our design software do that stitching for us?
This webinar will explain how to remove the human glue between your design domains by moving the stitching to where it belongs: the design toolset. We’ll describe how using the latest MCAD and ECAD software tools in an integrated design flow during system and product development can provide design checking and verification at every step of the way. Finding and fixing errors before they can propagate down the chain. Getting your product to market quicker, at less cost and with higher quality.
Not only is it important to oversee and optimize the handover between design domains, it’s also imperative to maximize synchronization between disciplines during each design phase. So, we’ll describe how a mechanical and electronics co-design approach can help achieve first-pass success in product development and design.
We’ll also present an important new contribution to electronic systems design: support for wire bonding in the MCAD domain with information imported from the electronic design domain. Easily visualize and correct any mechanical clearance violations between wire bonds and enclosure when connecting dies to packaging, other dies or connecting between PCBs.
Key Takeaways
- Negate the need for duplication of effort by collaborating on a single dataset
- Visualize the complete design, both mechanical and electronic in either domain
- Facilitate seamless import of wire bond information from ECAD to MCAD and run clearance checking
- Reduce errors by unifying MCAD and ECAD design teams with a common view into design data to reduce ambiguity
- Reduce the need for human checking when passing design data between domains by automating design rule checking and correcting errors before they propagate
Speakers
Walker joined Siemens in 2011 having completed over 30 years in the mechanical engineering environment across multiple industries including consumer electronics, renewable energy and network infrastructure. He worked in large corporates, SMEs, start-up and consultancy roles for high and low volume products with experience in multiple different CAD systems.
He is responsible for defining the direction of Siemens NX software focused on electronic integration and the electronic and semiconductor industry.
Arnot’s career in electronics began in the 1990’s with Hewlett-Packard in Barcelona, Spain. From 1995 he held various product management and global business development roles in the inkjet commercial division before leaving in 2004 to found a wireless start-up developing social proximity applications for Facebook. From there he went on to run the U.S. operations of GreenPowerMonitor, a leading solar monitoring company. In February 2020 Arnot joined the product management team at UltraSoC, which was acquired by Siemens DISW in October 2020. In June 2022 he joined the Siemens NX team as a product marketing manager.