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On-Demand Webinar:

System Level Thermal Design of Complex Multi-Layer Printed Circuit Boards

This webinar aims to demonstrate how a combined electro-thermal co-simulation as well as thermo-mechanical analyses of these boards using Siemens Simcenter products can improve the accuracy of the analyses and increase the productivity of the design teams.




Originally presented: January 31, 2023
Duration: 1 hour
Presented by:

Overview

ASIC (Application Specific Integrated Circuit) powers have increased significantly and are used in a wide range of applications such as networking, AI, and machine learning. The typical ASIC is supplied power at low voltages with high current which results in significant localized Joule heating in the PCB. It is becoming increasingly important to include the PCB self-heating during thermal design to develop the ASIC thermal solution, ensure passive components are rated to reliably operate near the ASIC, and to feedback PCB temperatures to electrical power and signal integrity design.

Typical approaches for including Joule heating in CFD-based thermal design simulation involve either modeling the electrical circuit directly or mapping power calculated from a power integrity simulation to an explicit representation of the corresponding net. Neither approach is suitable for large scale analysis of models that include many PCB nets and IC components. This webinar aims to demonstrate how a combined electro-thermal co-simulation as well as thermo-mechanical analyses of these boards using Siemens Simcenter products can improve analytical accuracy and increase the productivity of design teams.

Key Takeaways

  • Understand the mutual impact of Joule heating of the copper traces and the DC voltage drop within the complex PCB
  • Explore the use of SmartPCB technology to accurately model the complex copper traces within the PCB without a large computational overhead
  • Learn how this new technique enables electro-thermal co-simulations, thereby reducing costly design re-spins, ensuring reliability of the board and components and accelerating product design
  • Examine how the structural analysis of the PCB can be carried out using the calculated thermal map, thereby ensuring the mechanical reliability of the product

Speaker

John Wilson, Electronics Thermal Application Specialist, Siemens Digital Industries Software

Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd), now part of Siemens Digital Industries Software, in 1999 and has over 20 years of thermal design experience relating to simulation and testing. He has worked on or managed more than 100+ thermal and airflow design consulting projects ranging from component level, PCB, enclosure and system level inclusive of a wide range of applications including consumer, communications, industrial and automotive electronics. Wilson developed a practical and comprehensive knowledge of IC package level thermal test and analysis correlation through his work in the Mentor Fremont, California test facilities. He has 10+ years experiencein managing U.S.-based teams of engineers that undertake consulting thermal design tasks and are responsible for supporting leading electronics industry clients globally in successful use of CFD, electronics cooling simulation tools and test solutions. Currently Wilson serves as an electronics thermal application specialist.