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Cut Curing Times and Temperatures: New Self-Bonding Silicone Potting Compound for Electronic Device Protection

At Gelest, we thrive on pushing boundaries and redefining possibilities. Our next-gen silicone potting compounds redefine electronic device protection, addressing the call for improved performance, productivity and energy efficiency. With enhanced self-bonding, shortened curing time, and lower operating temperatures, Gelest propels the industry forward, setting a new standard for productivity and performance improvements in electronic components design and assembly.




Originally presented: December 12, 2023
Duration: 1 hour
Presented by:

Overview

Silicone potting materials are used to protect electronics from environmental conditions, UV aging, temperature extremes, vibration, and humidity. Consumers today expect their electronic devices to function without fail. The use of these silicone potting materials ensures that automotive, industrial, medical, and consumer electronics will have robust performance over the expected lifetime of the products that contain these electronics.

While consumers expect long-term performance from the products they purchase, they also expect costs for their products to drop over time. Reduction of costs for electronics typically means using lower cost materials or manufacturing processes. Some of the lower cost materials used in electronics today include thermoplastic elastomers (TPEs). TPEs can have softening points at temperatures as low as 100° C. Therefore, self-bonding silicones, that typically require cure temperatures for a few hours at 100° C or above to have adhesion, need to build adhesion at temperatures below 100° C and preferably in one hour cure time or less. We will discuss the performance of a new potting material with self-bonding adhesion to electronics substrates at cure temperatures below 100° C and shorter curing times.

Key Takeaways

  • Learn why silicone potting materials are ideal for protecting electronic components from the surrounding environment, including moisture ingress that could lead to electronic failure due to oxidation, corrosion, or leakage current.
  • Explore Gelest's new low temperature curing, self-bonding product (Gelest®PP2-SP01) which offers adhesion to temperature-sensitive substrates while also allowing for productivity improvements over conventional materials.
  • Understand why, in comparison to other materials of similar hardness, Gelest's new PP2-SP01 yields higher elongation and tensile strength without causing more stress on sensitive electronic components.

Speaker

Michael Watson, Group Leader, Formulated Products, Gelest, Inc.

Watson has almost 40 years of experience working with and developing formulated silicone products with a particular emphasis on adhesion. This expertise in silicone adhesion, structure property relationships, and manufacturing of these products has led to technology and product development for healthcare, electronics, automotive, construction, semiconductor, and aerospace applications. Watson now leads the Formulated Products Group at Gelest that specializes in providing custom silicone products for electronics, healthcare, and other markets.