This webinar will provide an overview of the latest Innovations in RF diodes, SAW filters and MMICs for RF applications. We will cover RF diodes utilizing new and unique monolithic MMSM (Monolithic Microwave Surface Mount) technology with package/device integration accomplished at the wafer fabrication level. Integrated (miniature) switched SAW filter bank replacing array of discrete filters or (lower selectivity/performance) wide-band filter solution with significant miniaturization over discrete solution. Monolithic Microwave Integrated Circuits (MMIC) innovations to generate high linear output power with high efficiency. Microchip RF signal chain solution with PAs, LNAs, switches, transistors, diodes, saw filters, VCSO’s for satellite communications, 5G, aerospace and defense applications will be discussed.
Overview
This webinar will provide an overview of the latest Innovations in RF diodes, SAW filters and MMICs for RF applications. We will cover RF diodes utilizing new and unique monolithic MMSM (Monolithic Microwave Surface Mount) technology with package/device integration accomplished at the wafer fabrication level replacing die with minimal effect on size, resistance, capacitance and inductance in a surface mount package.
Integrated (miniature) switched SAW filter bank replacing array of discrete filters or (lower selectivity/performance) wide-band filter solution with significant miniaturization over discrete solution. New technology platform µSF (micro SAW filter) supporting RF filter solutions in high-volume applications. Initial reference products for GNSS, ISM/SRD applications.
Monolithic Microwave Integrated Circuits (MMIC) innovations to generate high linear output power with high efficiency. RF GaAs MMIC solutions with flat gain across the frequency band, positive gain slope, excellent LNA noise figure and distributed amplifiers IM3 linearity performance.
Gallium nitride (GaN) on silicon carbide (SiC) with highest power density across a broad frequency range plays a pivotal role in providing the best figure of merit for the power amplifier (PA) in terms of linear output power with the benefit of SWaP-C or size, weight, power and cost.
Microchip RF signal chain solution with PAs, LNAs, switches, transistors, diodes, saw filters, VCSO’s for satellite communications, 5G, aerospace and defense applications will be discussed.
Key Takeaways
- Understand the latest RF diodes innovation with MMSM (Monolithic Microwave Surface Mount) technology with package/device integration accomplished at the wafer fabrication level.
- Explore the latest SAW filters innovation with switched SAW filter bank replacing array of discrete filters with significant miniaturization over discrete solution.
- Discover Monolithic Microwave Integrated Circuits (MMIC) innovations to generate high linear output power with high efficiency.
- Learn about the Microchip RF signal chain solution with PAs, LNAs, switches, transistors, diodes, saw filters, VCSO’s for satellite communications, 5G, aerospace and defense applications
Speakers
Baljit Chandhoke has more than 15 years of product line management experience in customer facing roles leading teams in defining new products, competitive positioning, driving design wins, revenue and go-to-market strategies across wireless infrastructure, mobility (5G), aerospace and defense market segments. He has authored multiple articles in leading industry publications, presented in several conferences, consortiums, YouTube videos, webinars on RF technologies and trends. Prior to joining Microchip, Baljit worked in leadership positions at GlobalFoundries, Renesas (IDT), ON Semiconductor, Cypress Semiconductor. He has a Master’s in Business Administration (M.B.A) from Arizona State University, M.S. in Telecommunications from University of Colorado Boulder and Bachelors in Electronics and Telecommunications Engineering from University of Mumbai, India.
Mike Ziehl has more than 25 years of engineering, marketing and general management experience in the semiconductor business. He and his teams have launched innovative products that opened new market segments, driving design wins, revenue and growth in the mobility (5G), wireless infrastructure, aerospace and defense and industrial market segments. He has authored multiple articles in leading industry publications, and spoken at numerous industry events, panels and webinars. Prior to joining Microchip, Mike worked in the RF semiconductor industry in leadership positions at Macom, NXP and Hittite Microwave. He holds a Master’s in Business Administration (M.B.A) from Rensselaer Polytechnic Institute and a BSEE from Fairfield University.