This exclusive webinar explores the ATROX™ Die Attach product line from MacDermid Alpha, designed to meet the growing demands of high-reliability semiconductor assembly. Learn how ATROX can help overcome challenges in adhesion, thermal conductivity, and processing efficiency — critical factors in power packages used across automotive and other advanced semiconductor applications. Gain insights into how the diverse portfolio of products can provide targeted solutions for different semiconductor package requirements.
Overview
The increasing demand for high-performance semiconductor devices requires die attach solutions that offer superior adhesion, thermal stability, and reliability. Beyond that increasing scrutiny and regulation around use of PFAS in many industries, including semiconductor packaging, is driving the industry towards a demand for regulatory compliance in various products including die attach adhesives.
ATROX™ from MacDermid Alpha is a next-generation, PFAS-free die attach technology engineered for advanced packaging applications, including consumer electronics, automotive, and industrial semiconductors.
In this webinar, our experts will dive into the unique attributes of ATROX™ and how itprovides production ready solutions. Discover how ATROX™ can help reduce material waste, enhance thermal management, and provide long-term reliability, all while meeting stringent industry regulations. Whether you’re an engineer, process manager, or procurement specialist, this session will equip you with the knowledge to make informed decisions about your die attach needs.
Key Takeaways
- Understand the role of PFAS-free die attach solutions in semiconductor assembly.
- Learn how ATROX™ provides enhanced solutions at required thermal conductivity and reliability in power packages used across various applications.
- Explore best practices for improving manufacturing efficiency and process stability.
- Discover insights into the latest advancements in die attach materials and formulations.
- Participate in a live Q&A with industry experts to address your specific application challenges.
Speaker
Avin Dhoble is a distinguished expert in semiconductor materials and advanced packaging solutions. With over a decade of experience in materials science and semiconductor assembly, he has played a key role in developing and commercializing innovative material solutions, including the ATROX™ product line. His expertise spans across product development, technical marketing, and process optimization for high-reliability electronics. Before joining MacDermid Alpha, Avin Dhoble held key positions in materials engineering and product development focusing on providing high-performance solutions to a variety of industries. He holds a MS (Materials Science and Engineering) and MBA (Marketing and Strategy) and has contributed to multiple technical publications and industry conferences. Passionate about advancing semiconductor packaging technologies, he is committed to helping customers achieve greater efficiency, reliability, and sustainability in their manufacturing processes.