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Insights into the Assembly of Highly Reliable Electronics

For 50 years, First Sensor Lewicki GmbH has produced highly-reliable electronic solutions for applications in industry, healthcare as well as aerospace & defense. This presentation highlights the fundamentals of hybrid electronic systems and will demonstrate some of the key techniques which are used for the assembly of highly robust electronics.



Date: June 5, 2018
Time: 10 AM EDT (7 AM PDT)
Presented by:

Overview

For 50 years, First Sensor Lewicki GmbH (FSL) has contributed to technical solutions for the assembly of electronic devices, modules and sub-systems where technologies like thick-film printing, chip-and-wire processes and hermetic encapsulation are key drivers for high reliability. With this long experience, FSL is producing highly-reliable, customer-specific solutions for applications in the fields of industry, healthcare as well as aerospace & defense. Following the strong heritage in space applications, FSL was certified from the German Space Agency as an assembly- and testhouse (ATH) for discrete power components. Today, qualified power FET assemblies (discrete components and multi-component devices) are available, and the qualification for high-voltage rectifier diode assemblies is already in progress.

Within this technical presentation some of the key assembly processes as used for highly reliable electronics will be highlighted and explained in detail. The presentation gives an overview of the fundamentals of hybrid electronic systems. Here a broad technological insight is shown, ranging from the right choice of substrate material (e.g. CTE, thermal conductivity, out-gassing, hermeticity) to bare-die and SMD component handling (e.g. materials for component attach, wire-bond materials and protection) to circuit encapsulation (e.g. moulding, hermetic encapsulation). Besides a broad technological overview, special care is taken to give some representative application examples and to highlight how typical technological limitations regarding thermal and electrical management, low volume and weight as well as dielectric-breakdown and harsh environmental conditions can be overcome. The presentation will close with an insight into techniques that can be used to detect early-stage failures already within production and to predict long-term device functionality by means of qualification and screening.

Key Take-Aways

  • Learn the fundamentals of hybrid electronic systems
  • Find out about major issues when selecting the right substrate material for your individual application
  • Learn about different die-attach and wire-bonding materials and their individual pros and cons
  • Understand the important role of thermal management solutions for low-weight power modules
  • Learn about key application examples and how technological problems can be overcome

Speaker

Benjamin Riedm├╝ller, Sales & Application Engineer, First Sensor Lewicki GmbH

Benjamin Riedm├╝ller studied electrical engineering with a focus in micro-electronics at University of Ulm/Germany starting in 2004 and finishing with a diploma degree in 2010. He then started working as a research assistant at the Institute of Micro- and Nanomaterials towards his PhD degree until 2016. His main research interests were in the field of micro-magnetic sensor and actuator systems for application in bio-electronics. After finishing his PhD in 2016 he joined First Sensor Lewicki GmbH as a Sales & Application Engineer. In his position is working as the direct technical and commercial interface towards the customer in order to mutually work out an optimal solution tailored to the customer's technical and project-related requirements.