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Supplier: DigiKey
Description: MODULE DDR SDRAM 256MB 200SODIMM
- Capacity: 256 MB
- DRAM Type: DDR SDRAM
- Form Factor: SO DIMM
- Pin Count: 200 #
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Supplier: DigiKey
Description: MODULE DDR SDRAM 256MB 184UDIMM
- Capacity: 256 MB
- DRAM Type: DDR SDRAM
- Form Factor: uDIMM
- Pin Count: 184 #
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Supplier: DigiKey
Description: MODULE DDR SDRAM 256MB 184RDIMM
- Capacity: 256 MB
- DRAM Type: DDR SDRAM
- Form Factor: Other
- Pin Count: 184 #
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Supplier: DigiKey
Description: MODULE DDR SDRAM 256MB 184UDIMM
- Capacity: 256 MB
- DRAM Type: DDR SDRAM
- Form Factor: uDIMM
- Pin Count: 184 #
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DRAM and SDRAM Memory Chips - Memory - Modules - MT18LSDT3272AY-133G3 -- 747775-MT18LSDT3272AY-133G3Supplier: Win Source Electronics
Description: Manufacturer: Micron Technology Inc. Win Source Part Number: 747775-MT18LSDT3272A Y-133G3 Speed: 133MHz Package: 168-UDIMM Memory Type: SDRAM Memory Size: 256Mb Part Status: Obsolete(EOL) Family Name: MT18LSDT3272AY Categories: Memory Cards, Modules
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1243327-SDN03264C1CJ 1MT-50WR Category: Memory Cards, Modules>Memory - Modules Speed: 400MT/s Package: Tray Standard Package: 100 Memory Type: DDR SDRAM Memory Size: 256Mb Package / Case: 200-SODIMM ECCN: OBSOLETE Fake Threat
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1243326-SDN03264C1CJ 1MT-50R Category: Memory Cards, Modules>Memory - Modules Speed: 400MT/s Package: Tray Standard Package: 100 Memory Type: DDR SDRAM Memory Size: 256Mb Package / Case: 200-SODIMM ECCN: OBSOLETE Fake Threat In
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1243329-SDN03264G1CJ 1MT-50R Category: Memory Cards, Modules>Memory - Modules Speed: 400MT/s Package: Tray Standard Package: 100 Memory Type: DDR SDRAM Memory Size: 256Mb Package / Case: 200-SODIMM ECCN: OBSOLETE Fake Threat In
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Supplier: Sealevel Systems, Inc.
Description: -backlit models, the system offers an amazing -30° to +70°C operating temperature range with no heaters or cooling fans required. Powered by a 400 MHz ARM9 microprocessor, the system includes 128 MB RAM and 256 MB Flash memory for maximum performance in embedded systems. Standard I
- Display Size: 7 inch
- Features: Touch Screen
- Operating System: Microsoft®
- Processor: Other
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Supplier: Sealevel Systems, Inc.
Description: fans required. Powered by a 400 MHz ARM9 microprocessor, the system includes 128 MB RAM and 256 MB Flash memory for maximum performance in embedded systems. Standard I/O includes Ethernet, serial, USB, and digital interfaces. The system is powered from your 9-30VDC source or select
- Display Size: 8.4 inch
- Features: Touch Screen
- Operating System: Microsoft®
- Processor: Other
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Supplier: Acromag, Inc.
Description: code loads from PCI bus or 32MB flash memory Two banks of 256K x 32-bit dual-ported SRAM Two banks of 64M x 16-bit DDR2 SDRAM Other memory options available (contact factory) Supports dual DMA channel data transfer to CPU/bus Supports 3.3V signalling Support for Xilinx
- Number of Ports: 64
- PMC Data Bus: 64-bit
- Product Type: FPGA Module, Other
- Technology: PMC
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Supplier: Acromag, Inc.
Description: FPGA code loads from PCI bus or flash memory Two banks of 256Kb x 32-bit dual-ported SRAM Two banks of 32Mb x 16-bit DDR2 SDRAM Other memory options available (contact factory) Supports dual DMA channel data transfer to CPU/bus Supports 3.3V signalling Support for Xilinx
- Number of Ports: 64
- PMC Data Bus: 64-bit
- Product Type: FPGA Module, Other
- Technology: PMC
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Supplier: Acromag, Inc.
Description: or flash memory Two banks of 256Kb x 32-bit dual-ported SRAM Two banks of 32Mb x 16-bit DDR2 SDRAM Other memory options available (contact factory) Supports dual DMA channel data transfer to CPU/bus Supports 3.3V signalling Support for Xilinx ChipScope™ Pro interface 0 to
- Number of Ports: 64
- PMC Data Bus: 64-bit
- Product Type: FPGA Module, Other
- Technology: PMC
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Supplier: Indocomp Systems, Inc.
Description: Features 5.25" form factor Single Board Computer Pentium III Socket 370 Processors 533-1G mhz Intel Celerion, Cyrix III, VIA C3 Up to 256 MB SDRAM in one 168-Pin DIMM socket, PC100/PC133 supported Intel 815E chipset integrates graphics ITE 8712 I
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Supplier: Accuris
Description: MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE
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Supplier: Advantech
Description: PCM-3343 is a cost-effective System On Chip (SoC) PC/104 CPU module driven by the ultra low power DM&P Vortex86DX 800 MHz processor with 256 MB of DDR2 SDRAM memory on board. PCM-3343 has the standard dimensions of 96 x 90 mm in a fanless PC/104 architecture, supporting
- CPU Speed: 800 MHz
- Cache Memory (L1 & L2): 256 KB
- Features: Watchdog Timer?
- Operating Temperature: 32 to 140 F
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Supplier: Microchip Technology, Inc.
Description: compatible with DDR4 SDRAM modules. The 34AA04 includes reversible software write protection for each of four independent 128 x 8-bit blocks and supports an SMBus compatible bus time out. The device features a page write capability of up to 16 bytes of data. Address pins allow up to
- Data Rate: 1 MHz
- Data Retention: 200 years
- Density: 4 kbits
- Endurance: 1.00E6 Write/Erase Cycles
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Description: Lake-D) processors SKUs available with native extended temperature support Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 6U CompactPCI module
- Communication Networks: Ethernet
- I/O Bus Specifications: CompactPCI (cPCI), USB, Other
- Ports: Serial Ports, USB
- Processor / CPU Type: Intel® Xeon®
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Description: authentication, authorization, and accounting (AAA) and public key infrastructure XMC/PMC form factor Conduction-cooled Technical Specs Memory 4 GB DDR4 ECC SDRAM Up to 128 MB NOR flash 128 kB SEEPROM I
- Features: Ruggedized
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Description: engine per core Alternate Processor NXP QorIQ LS1023A processor with two 64-bit Arm® A53 cores at up to 1.2 GHz Memory Up to 8 GB of DDR4 ECC SDRAM Up to 256 MB of NOR flash (with redundancy) Up to 16 GB of NAND flash
- Communication Networks: Ethernet
- Hard Drive Support?: Other
- I/O Bus Specifications: PMC, USB, Other
- Ports: Serial Ports, USB
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Description: Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash 3U VPX (VITA 46) module Ruggedized Enhanced Design Implementation (REDI) per VITA 48 Compatible with
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, VPX, Other
- Ports: Serial Ports, USB
- Processor / CPU Type: Intel® Xeon®
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Supplier: ELMA Electronic Inc.
Description: Features: Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number. Freescale MPC8540 System-on-Chip processor 256MB/512MB DDR ECC SDRAM; 64MB/128MB of Flash
- Communication Networks: Ethernet
- Flash Memory (RAM): 64000 to 128000 KB
- I/O Bus Specifications: PCI Express, VMEbus
- Ports: USB
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Supplier: Microchip Technology, Inc.
Description: -channel peripheral, memory-to-memory DMA controller, high-speed USB embedded host, SD/SDIO card, MLC NAND flash with ECC, and SDRAM interfaces. This device features 256KB internal high-speed flash and an AES crypto module, capable of 128 to 256-bit AES encryption
- A/D Converter: Other
- Clock Speed: 84 MHz
- IC Package Type: Other
- Internal RAM Size: 128 KB
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Supplier: ELMA Electronic Inc.
Description: MB/512MB DDR ECC SDRAM; 64MB/128MB of Flash memory Dual Gigabit, one 10/100 Ethernet ports, USB 2.0 and SATA controllers Tsi148 PCI-X bus to VMEbus bridge with 320MB/sec 2eSST VMEbus protocol Dual PMC-X sites Five serial ports, RTC, four tick timers, watchdog timer, and Rear Transition
- Communication Networks: Ethernet
- Flash Memory (RAM): 64000 to 128000 KB
- I/O Bus Specifications: PCI-X, PMC, VMEbus
- Ports: USB
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Supplier: RS Components, Ltd.
Description: ARM Cortex-A5 + 167MHz Cortex-M4, 1MB SRAM, 512KB L2 cache. 128MB DDR3 SDRAM. 256MB NAND Flash memory. 2 x 16MB quad-SPI NAND Flash memory. Kinetis K20DX128VFM5-based OpenSDA circuit. USB-A Host socket. microUSB OTG socket. MicroSD card slot. General purpose Tower plug-in
- Category: Development Suite / Kit
- Supported System: Other
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Supplier: Microchip Technology, Inc.
Description: Features Arm® Cortex®-A5 processor-based SAMA5D2 MPU 256 MByte LPDDR2 SDRAM MCP16502 Power Management IC WILC3000 WiFi and Bluetooth module 64Mb Serial Quad I/O Flash Memory with Embedded EUI-48 MAC addresses KSZ8081 10Base-T/100Base
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Supplier: RS Components, Ltd.
Description: debug tool or as part of a Tower System development platform. Vybrid VF61NS151CMK50 processor: 500MHz ARM Cortex-A5 + 167MHz Cortex-M4, 1MB SRAM, 512KB L2 cache. 128MB DDR3 SDRAM. 256MB NAND Flash memory. 2 x 16MB quad-SPI NAND Flash memory. Kinetis K20DX128VFM5-based
- Category: Development Suite / Kit
- Supported System: Other
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Supplier: Microchip Technology, Inc.
Description: -channel peripheral, memory-to-memory DMA controller, high-speed USB embedded host, SD/SDIO card, MLC NAND flash with ECC, and SDRAM interfaces. This device features 128KB internal high-speed flash and an AES crypto module, capable of 128 to 256-bit AES encryption at
- A/D Converter: Other
- Clock Speed: 84 MHz
- IC Package Type: Other
- Internal RAM Size: 128 KB
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Supplier: RS Components, Ltd.
Description: processor: 500MHz ARM Cortex-A5 + 167MHz Cortex-M4, 1MB SRAM, 512KB L2 cache. 128MB DDR3 SDRAM. 256MB NAND Flash memory. 2 x 16MB quad-SPI NAND Flash memory. Kinetis K20DX128VFM5-based OpenSDA circuit. USB-A Host socket. microUSB OTG socket. MicroSD card slot. General
- Category: Development Suite / Kit
- Supported System: Other
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Supplier: ELMA Electronic Inc.
Description: Features: MPC7448 running at 667 or 1.4 GHz with: L1 caches : 32KB Inst. and 32KB Data with parity 1MB of L2 integrated cache with ECC 512MB , 1 or 2GB of SDRAM-DDR with ECC 64, 128 or 256MB of soldered Mirror Flash Up
- CPU Speed: 667 to 1400 MHz
- Communication Networks: Ethernet
- Flash Memory (RAM): 64000 to 1.00E6 KB
- I/O Bus Specifications: CompactPCI (cPCI), PMC
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Supplier: ELMA Electronic Inc.
Description: 128MB, 256MB or 512MB of on-board ECC SDRAM-expandable up to 1GB with optional RAM500 memory expansion modules 17MB Flash memory Dual IEEE P1386.1 compatible 32/64-bit PMC expansion slots 64-bit PCI expansion mezzanine connector allowing up to four more PMCs Dual
- CPU Speed: 500 MHz
- Communication Networks: Ethernet
- Flash Memory (RAM): 17000 KB
- I/O Bus Specifications: PCI
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Supplier: Rugged Information Technology
Description: Future Data Capacity > 16 Terabytes Dedicated SBC RAID Controller Conduction Cooled with Proprietary Thin Air Cooling 3 CPCI Slots Stationary / All Memory is Removable 6.0 Terabytes Storage with 256 Gigabyte SSDs 4 to 24 GbEthernet Ports
- Operating System: Linux, Microsoft®
- Operating Temperature: 14 to 131 F
- Processor: Intel®
- Type: Rack Mount
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Supplier: Aitech Defense Systems, Inc.
Description: Performance Graphics Controller Memory Resources Up to 8 GB DDR3 Dual channel SDRAM @ 1066 MHz with ECC Up to 128 GB SATA Flash Disc Dual Redundant BIOS Flash I/O Interfaces Four Gigabit Ethernet Ports Seven USB 2
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Supplier: Aitech Defense Systems, Inc.
Description: High Performance Graphics Controller Memory Resources Up to 4GB DDR3 SDRAM @ 1066MHz with ECC Up to 64 GB SATA Flash Disk Dual Redundant BIOS Flash I/O Interfaces Two Gigabit Ethernet Ports Two USB 2.0 Ports
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Supplier: Aitech Defense Systems, Inc.
Description: Performance Graphics Controller Memory Up to Four (4) GB DDR3 SDRAM at 1066MHz with ECC Up to 64GB SATA SSD (On-board) Dual Redundant BIOS Flash I/O Interfaces Four (4) GB Ethernet Ports Two (2) 1000Base-T Ports
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Supplier: RS Components, Ltd.
Description: Aptiv-core SoC with Ensigma Explorer RPU, FPU,â?¢ On-board W25Q16DVSNIG 2MB Boot SPI NOR Flash memory,â?¢ On-board GD5F4GQ4UCYIGT 512MB SPI NAND Flash memory,â?¢ On-board K4B2G1646C-HCH9 256MB DDR3 SDRAM,â?¢ On-board IEEE 802.11ac dual
- Category: Development Suite / Kit
- Supported System: Other
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NORTHVALE, New Jersey, USA – New Yorker Electronics has announced its release of the new Innodisk Industrial-grade DDR5 DRAM modules. The JESD79-5 DDR5 SDRAM offers significant improvements in capacity, speed, voltage and ECC functions. The modules comply with all relevant (read more)
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multimode baseband processor and power management IC 512 MB SLC NAND flash and 256 MB mobile LPDDR2 SDRAM from Micron Technology (Learn more about power management ICs on (read more)
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: $1,157 Availability: Worldwide Target market: Consumer/communications Main board The main board inside the Apple iPhone 14 Plus includes the main Apple processor, the 64-bit hexa-core applications processor, 5 GB of mobile LPDDR4X SDRAM multichip memory from Samsung (read more)
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: Consumer electronics Main board The main board is the Pico 4 VR unit contains the main components needed to operate the headset such as the Qualcomm octa-core Snapdragon XR2 applications processor and Samsung’s 256 GB TLC V-NAND flash and 8 GB mobile LPDDR4X SDRAM. Other (read more)
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,059 Availability: Worldwide Target market: Communications Main board Inside the Samsung Galaxy Z flip phone includes the Samsung multichip memory with 256 GB of 3D TLC V-NAND flash and memory controller. It also includes the Qualcomm octa (read more)
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The main board of the Xiaomi 12T smartphone includes the octa-core Dimensity 8100 applications/baseband processor and the multi-chip memory 8 GB mobile SDRAM from Samsung. Other electronic components include: Camera power management IC from OmniVision Envelope power tracker (read more)
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NETWORKING MEMORY | Softchoice
NETWORKING MEMORY 256 MB SDRAM MODULE .
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Application of partial reconfiguration of FPGAs in image processing
The ML506 board contains a 32M x 64 bit ( 256 MB) DDR2 SDRAM memory module , which is connected to the system through a multi-port memory controller.
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D2CSP (double density CSP): a new solution for high-density packaging
With these, much higher memory module e.g. 512 MB can he accessible with very low cost, comparing with a unit memory module of 256 Mh SDRAM or 512 Mb SDRAM.
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A Lightweight Framework for Runtime Reconfigurable System Prototyping
This platform contains a Xilinx Virtex- II Pro 30 FPGA, a 256 MB DDR- SDRAM memory module , a text matrix display, several LEDs, and a serial communi- cation interface.
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http://www.aanda.org/index.php?option=com_article&access=standard&Itemid=129&url=/articles/aa/pdf/2010/02/aa13335-09.pdf
The DSP board design is based on the Xilinx Virtex-II 3000 chip used as a FPGA (field-programmable gate array), and, in addition, has a fixed-point signal processor TMS320C6416 and a 256 Mbyte on-board SDRAM memory module .
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Nonvolatile and SDRAM ferroelectric memories for aerospace applications
With regards to HBD SDRAM development, a 256 -Megabit HBD ferroelectric SDRAM memory module is planned, using 0.18-micron technology.
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Real-time fast controller prototype for J-TEXT tokamak
The deterministic transfer data of the network is 170Mbytes/s with only 450 to 500 nanoseconds of latency between nodes, and each Reflective- Memory module has 256 Mbytes of onboard SDRAM .
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Adapting the reconfigurable spacecube processing system for multiple mission applications
Peripherals include four 256 MB Synchronous Dynamic Random Access Memory ( SDRAM ) modules , two redundant 512MB NAND flash modules, 20 configurable .
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Reconfigurable on-board payload data processing system developments at the European Space Agency
For the Solid-State Mass Memory modules either 64 or 256 Mbit commercial SDRAMs are used.
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Sony and National Instruments Offer Comprehensive Smart Camera Solution
A fast 256 MB DDR SDRAM module provides ample volatile memory for high-performance throughout.