Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • LTE for 4G Mobile Broadband: Air Interface Technologies and Performance
    LTE for 4G Mobile Broadband: Air Interface Technologies and Performance. With extensive references, a useful discussion of technologies, and end-of-chapter summaries, this book provides an in-depth coverage of the radio-interface technologies for LTE and their contributions to system performance
  • Thermal Interface Materials - A Brief Overview
    interface materials notes, "Up to 99% of the surfaces are separated by a layer of interstitial air...a poor conductor of heat". [1] Another major manufacturer cites that two "mating surfaces may touch over only 1/10,000 of their surfaces. They may touch at only three points. Everywhere else is a air
  • Liquid Level/Interface Monitoring in Flocculant/Sludge Control (.pdf)
    collection area. The amount of air and flocculants are controlled by measuring the liquid level interface between the sludge and water.
  • Air Velocity Temperature Measurment All-in-One (.pdf)
    provides air velocity and temperature measurements in. visual, analog, and digital formats. It includes a display panel, analog outputs, and a USB computer interface. (software included). All of this is neatly packaged in a 3.5 x 4.5" NEMA 4, IP65-rated case.
  • Ocean's Surface Could Have Big Impact On Air Quality, Study Says
    may play a role in increasing ozone levels in the air we breathe, new research suggests. These ions cover the surface of the sea in an ultra-thin blanket - about one-millionth the thickness of a sheet of paper. Researchers call this region the "interface. " Using a technique that employs highly
  • W-CDMA and cdma2000 for 3G Mobile Networks
    W-CDMA and cdma2000 for 3G Mobile Networks. Worth its weight in paid consultants to wireless carriers, service developers, systems engineers, and telecom managers, this book opens a window on the implications of the air interface in the next-generation network.
  • Thermabond Application Notes -D001
    Typically, the most difficult part of working with Thermabond (R) is liner removal after the material has been tacked to the heat sink. The key to this process is to avoid trapping air at this interface. If not removed, the material tends to "lift up" when the brown liner is removed, causing
  • Ensuring Better Control of Granulation
    of the liquid/air interface and the hydrostatic suction pressure in the liquid bridge. When all the air has been displaced from between the particles, the capillary state is reached, and the particles are held by capillary suction at the liquid/air interface. The funicular state represents
  • Lithium-Air Batteries Battery Safety/Quality Testing Rechargeable Lithium Batteries Fuel Cells, Fuel Processing and Storage
    their technology and interface with key decision makers at the different branches of DoD, NASA DARPA and DoE. Attendance has grown to well over 700 people with over 50 companies displaying their products and services in the exhibit hall. Special compliments to the conference sponsors and to the event managers
  • | Electronics Industry News for EEs & Engineering Managers
    for a single air interface for third-generation cellular phones paled this past week, when two camps representing the majority of existing cellular systems joined forces to clash against a standards effort forming around the emerging wideband-CDMA standard. Two groups backing time-division multiple access
  • Power in small packages
    heat from the module. Foremost of these was the plated-cavity design. Also significant is the effectiveness of the thermal interface between the module baseplate and the user's heat-conducting material. Its effectiveness depends on minimizing thermal resistance across the interface which minimizes air
  • MICRO:Process Equipment-Lithography, by Zhou Lin (Feb 99)
    . Unlike i-line photoresist, chemically amplified DUV resist forms an acid during the exposure step. Acid loss at the resist/air interface can then cause capping on the resist profile. Such a loss may be caused by a reaction with a base adsorbed from the air into the resist film or by acid evaporation
  • Void Reduction during Low Pressure Lamination of Electronic Assemblies
    Void content at the interface of the bonding adhesive and rigid substrate of an electronic assembly can affect critical performance metrics such as thermal transfer, bond strength, and stress decoupling which can ultimately lead to poor device reliability. In this paper, the contribution

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire