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Supplier: ASME
Description: ................ .................... ..........31 Don't tell a circuit designer which board layout gives the worst thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat
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Supplier: ASME Standards and Certification
Description: ................ .................... ..........31 Don't tell a circuit designer which board layout gives the worst thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy insulating full lengths of extruded aluminium alloy heatsinks. Length = 114.3mm Height = 51.31mm Mounting = Horizontal Colour = Black Series = 8064 Material = Aluminium Finish = Black Anodized
- Height: 51.31 mm
- Length: 114 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks
- Height: 40 mm
- Length: 200 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high
- Height: 38.6 mm
- Length: 55 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: RS Components, Ltd.
Description: = Black Anodized Material = Aluminium Special Features = Economy, Low Profile Channel Style Heat Sink is Perfect for Use on Printed Circuit Boards, Narrow Base
- Height: 21.6 mm
- Length: 19.8 mm
- Material: Aluminum
- Thermal Resistance: 15.6 °C / W
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Supplier: Sensata Technologies
Description: 0.7°C/W Thermal resistance Suitable for 1 or 2 single or dual Solid State Relays Panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 0.7000 °C / W
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon? 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508 CPU
- Height: 64 mm
- Length: 90 mm
- Material: Aluminum, Copper, Mixed Material
- Weight: 490 g
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Supplier: Airflow/Y.S. Tech, Inc.
Description: modules Material Options for Custom Heat Sinks Aluminum heat sink Copper heat sink Size Options for Custom Heat Sinks 19-57mm Heatsinks 69-120mm Heatsinks 122-174mm Heatsinks 186-250mm Heatsinks 271-482mm Heatsinks
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Length: 19 to 482 mm
- Material: Aluminum, Copper
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Description: We provide OEM CNC machined heat sink, modest price, short lead time and good quality.
- Device: Passive Heat Sink, Vapor Cooler, Cold Plate
- Heat Sink Fin Style: Round Pin, Elliptical Fin, Straight Fin, Machined Plate
- Material: Aluminum
- Mounting: Mounting Holes
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Supplier: DigiKey
Description: HEATSINK 60X60X10MM XCUT T766
- Device: Passive Heat Sink
- Height: 10.01 mm
- Length: 59.99 mm
- Material: Aluminum
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Supplier: Boyd
Description: liquid cold plates feature copper or stainless steel tubing mechanically interlocked into aluminum plates. These cost effective liquid cold plates are designed specifically for low to medium power density applications. Standard Aavid Hi-Contact™ tube liquid cold plates feature a joint
- Device: Liquid Cooler/Cold Plate
- Height: 14 to 15.2 mm
- Length: 57.2 to 610 mm
- Material: Aluminum, Other Materials
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Supplier: Utmel Electronic Limited
Description: Heatsink; TO-220; 15.6degC/W; 44.45 x 17.78 x 12.7mm; Through Hole Mount
- Material: Aluminum
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Supplier: Ohmite Manufacturing Co.
Description: C Series For TO Package Heatsinks No tool, camming clip system Compatible with TO-264, TO-247,TO-220 and TO-126 Devices. Mount up to 3 devices per heatsink Spring Clip delivers constant repeatable pressure For TBH, TCH, TEH, and TFH series
- Device: Passive Heat Sink
- Height: 32.5 to 38 mm
- Length: 25 to 75 mm
- Material: Aluminum, Mixed Material
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Supplier: Broadband TelCom Power, Inc.
Description: Longitudinal fin orientation
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 6.35 mm
- Length: 36.07 mm
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® 775-land LGA Package.
- Device: Active Heat Sink
- Fan Noise: 42 dB
- Fan Speed: 3900 rpm
- Fan Voltage: 12 VDC
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Supplier: Cooliance
Description: Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Height: 6.35 to 19.94 mm
- Material: Aluminum
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This is because aluminum replaced copper as the cheaper alternative for heat sinks in LEDs. However, although it is relatively malleable and effective in conducting heat, it’s not that environmentally friendly to dispose of. This is where ceramic comes in! Ceramic is a very cost (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. These sinks are processed with high pressure, below temperatures of 300°C. Under this circumstance, forged (read more)
Browse Heat Sinks Datasheets for Rego Electronics Inc. -
civil field, aluminum nitride has been widely used in integrated circuits, automobiles, high-speed rail, electric power, semiconductors and other fields, such as integrated circuit substrates, IGBT control modules, electrostatic chucks for wafer processing, high-power LED heat sinks, etc. . At the (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Aluminum Nitride is a material that has heat resistance, high thermal conductivity, dielectricity, piezoelectricity, low thermal expansion, and so on. Because of those properties, this material is often used for heat sinks, heaters, substrates, and so on. For example, we machine it into a part (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
found in HVAC systems, as well as industrial and portable air conditioning; in air cooling for variable frequency drives (VFD), wind power generators and power converters, solar inverters, uninterruptable power supplies (UPS), transformers, heat sinks, fan coils, telecom racks and other industrial (read more)
Browse Electronic Cooling Fans Datasheets for Rosenberg USA -
high frequency and thermal ladder applications. They are available in a wide range of connection options including component-to-heat sink, component-to-case, component-to-ground plane, pad-to-pad, pad-to-via and pad-to-trace applications. Features & Benefits: (read more)
Browse Resistor, Capacitor Networks Datasheets for New Yorker Electronics Co., Inc. -
The ARG Series is a high-performance heatsinkable aluminum housed resistor. These aluminum housed resistors are suited to withstand industrial applications that may include vibration, shock, and harsh environmental conditions. The ARG resistors are aluminum housed providing heat-sinking (read more)
Browse Power Resistors Datasheets for Ohmite Manufacturing Co. -
base and aluminum fins or vice versa. Depending on your application needs, you may need an all aluminum or all copper heat sink. The material selection determines the joining method between the fins and the base. Aluminum resists soldering, so aluminum/aluminum joints are epoxy bonded. Epoxy (read more)
Browse Heat Sinks Datasheets for Boyd -
characteristics. By utilizing our titanium composite packaging technology (incorporating Mo/Cu or AlSiC composite heat sinks) that characteristic becomes a non-issue. During the initial design phase, the electronic circuitry is mapped against the housing floor where hot spots are (read more)
Browse Electronic Packages and Lids Datasheets for Qnnect, formerly Hermetic Solutions Group -
Rego is specialized in tailor made thermal module business. We take advantage of diversified heat sink technologies such as extrusion, skive, forge, stamp, die casting & CNC machining. According to different need of each project, our design engineers will integrate heat pipes, vapor (read more)
Browse Edge Connectors Datasheets for Rego Electronics Inc.
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3D micro-cooled HPA package for RADAR application
The higher power lower block is attached to a heat sink cooled by air flow. .... A complete radar system will integrate a large number of these small Aluminum boxes . .... This project investigates a new solution with an heat pipe where a vapour chamber is incorporated directly…
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Thermal Design: Heat Sinks Thermoelectrics Heat Pipes Compact Heat Exchangers and Solar Cells
(PCB) made of aluminum are passively cooled by natural convection. .... An internal heat . .... sink with a cold plate attached to one of the walls of the box is considered. .... is maintained at a certain temperature using a thermoelectric cooler that is not included in this project .
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Practical Electronics for Inventors, Third Edition > Hands-on Electronics
Also get heat - sink compound. .... • Standoffs: Aluminum and brass thread standoffs of 4-40, 6-32 thread of various lengths. .... • Adhesive rubber feet: For project boxes , to prevent slipping and surface scratches.
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Practical Electronics for Inventors, Fourth Edition > The Electronics Laboratory
Also get heat - sink compound. .... • Standoffs: Aluminum and brass thread standoffs of 4-40, 6-32 thread of various lengths. .... • Adhesive rubber feet: For project boxes , to prevent slipping and surface scratches.
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Moderate resolution imaging spectrometer‐tilt (modis‐t)
The cold plate provides a conductive heat transfer sink for the electronics at a constant 20 to 25°C. .... The optic plate supports the tilt and scan mechanisms, the aluminum optical compo- nents, the detector, baffles .... The cold plate interface to the electronic boxes is presently being redesigned to a new project requirement restricting the mounting of multiple components to the cold plate.
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Moderate-resolution imaging spectrometer-tilt baseline concept
The cold plate provides a conductive heat transfer sink for the electronics at a constant 20°C to 25°C. .... The optic plate support the tilt and scan mechanisms, the aluminum optical components, the detector, baffles, and .... The cold plate interface to the electronic boxes was redesigned due to a new project requirement restricting the mounting of multiple components to the cold plate.
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Comparison of heat sink and fan combinations and thermal electric coolers for use in the Mars Gravity Biosatellite
Since the mission length is projected at 5 weeks, the transient responses of each system were largely .... Therefore, the first step taken before data collection was heating the box . .... The first kind of data set taken was for natural convection across the heat sink . .... The cold bath was set and the aluminum bar stock inserted into the water.
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Better Thermal Management Promises Cheaper, Greener, Cooler Electronics -- Environmental Protection
…management for in-flight entertainment systems, which use a so-called 'Seat electronic box ' (SEB) placed … space with limited cooling possibilities - it is a real challenge to dissipate the heat in that environment … heat from the components to the SEB and from the SEB to an external heat sink .". .... infiltrated with a metal alloy that somewhat resembles a very fine sheet of aluminium foil and which … better, or it can operate at the same temperature with increased reliability," the project manager said.
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Liquid cooled LED arrays as bright as 30 headlights
The Electronic Applications Division at CeramTec GmbH supplied innovative aluminium nitride (AlN) liquid-cooled heat - sinks ; the Fraunhofer IZM institute in Oberpfaffenhofen designed the thermal and fluidic cooling; the Fraunhofer IZM institute in Berlin populated the ceramic heat-sinks with LEDs using .... The significant increase in output of the new cooling modules was made possible by several development projects . .... The CeramCool Box that resulted from this effort also allows quick adaptation of the illumination to the…
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T£ SCHOOL
Instead all the high heat output equipment such as the inverter were mounted in a manner that used the aluminum skin of the box as a heat sink . .... statement associated with the power of positive thinking, but one to live by when fielding a project .