Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • Profiling for successful BGA/CSP Rework
    This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Applied Materials to add staff in Austin Scenix chairman dies from Beijing beating Tessera expands beyond BGA technology Remnants of VTC will become analog chip foundry MCT introduces test-handling system for chip-scale packages OnQ Technology opens backend packaging facility in Philippines Alcatel
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Suntron claims legal victory over Applied Contract manufacturer Suntron Corp. claimed a legal victory over chip-equipment giant Applied Materials Inc. LCD-TVs face commoditization threat, analyst warns Despite projections of continued robust growth, liquid crystal display television manufacturers
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    , according to market research analyst iSuppli. Students write EDA tools in one day At the CADathlon at the International Conference on Computer Aided Design (ICCAD), students had just one day to solve problems by writing EDA software. Bartronics India plans chip plant in Hyderabad Bartonics India is to set
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up " BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    initial IC package for use in high-speed SDRAMs and double-data-rate (DDR) SDRAMs. The IC package, dubbed wBGA, is based on a "simplified BGA manufacturing process, " according to the Hsinchu-based company. Heard on the Beat (April 5) Heard on the Beat (April 5) Commentary & analysis of week's chip

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire