BGA Heat Sinks

Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU

• Device: Passive Heat Sink
• Heat Sink Fin Style: Straight Fin
• Height: 16 mm
• Length: 60 mm

Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes,

• Device: Active Heat Sink

Description: Comment : Mounting clip does not increase overall heat sink height., Heat sink assembly includes Four Leg Standard Clip, Part Number 1542026-1. Product Type Features Accessory Type : Clip Device Type : BGA

Description: Comment : Heat sink assembly includes Three Leg Standard Clip, Part Number 1542816-1., Mounting clip does not increase overall heat sink height. Product Type Features Accessory Type : Clip Device Type : BGA

Description: : No Other Air Velocity (LFM) : 200, 600, 0, 400 Comment : Heat sink assembly includes Four Leg Standard Clip, Part Number 1542026-1., Mounting clip does not increase overall heat sink height.

• Height: 11.23 mm
• Width: 25.4 mm

Description: : No Other Air Velocity (LFM) : 200, 0, 400, 600 Comment : Heat sink assembly includes Four Leg Low Profile Clip, Part Number 1542385-1., Mounting clip does not increase overall heat sink height.

• Height: 9.06 mm
• Width: 34.92 mm

Description: Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU

• Device: Active Heat Sink
• Heat Sink Fin Style: Straight Fin
• Height: 14 mm
• Length: 60 mm

Description: BGA HEAT SINK

• Device: Passive Heat Sink
• Height: 10.01 mm
• Length: 27 mm
• Material: Aluminum

Description: Win Source Part Number: 1147486-HSB12-272706 Category: Fans, Thermal Management>Thermal - Heat Sinks Series: HSB Type: Top Mount Package: Box Length: 1.063" (27.00mm) Standard Package: 1,540 Material: Aluminum Alloy Shape: Square, Pin Fins Package

Description: Win Source Part Number: 1101523-1542003-2 Category: Fans, Thermal Management>Thermal - Heat Sinks Type: Top Mount Package: Tray Standard Package: 350 Material: Aluminum Shape: Cylindrical Package Cooled: BGA Attachment Method: Clip Diameter: 1.375" (34.92mm

Description: Win Source Part Number: 1035749-2-1542006-3 Category: Fans, Thermal Management>Thermal - Heat Sinks Type: Top Mount Package: Box Standard Package: 450 Material: Aluminum Shape: Cylindrical Package Cooled: BGA Attachment Method: Clip Diameter: 1.000" (25

Description: Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal

• Device: Passive Heat Sink
• Height: 7.5 to 17.5 mm
• Length: 15 to 45 mm
• Material: Aluminum

Description: Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without

• Device: Passive Heat Sink
• Heat Sink Fin Style: Other
• Height: 6.35 to 19.94 mm
• Material: Aluminum

Description: Cooliance's precision forging capabilities allow for a variety of standard elliptical fins ranging from 160 x 160mm with max fin height of 50mm. The elliptical wing shape is superior to an equivalent extruded straight fin heatsink as the wing shape acts to break up and fully leverage existing air

• Device: Passive Heat Sink
• Heat Sink Fin Style: Elliptical Fin
• Height: 12 to 50 mm
• Length: 19 to 160 mm

Description: Cooliance offers a selection of standard pin fin heatsinks. These are particularly suitable for applications where the air flow is from the top. Cooliance offers precision forged pin fin heatsinks that come in both active and passive versions. They can be forged in either aluminum or copper.

• Device: Passive Heat Sink
• Heat Sink Fin Style: Round Pin
• Height: 12 to 33 mm
• Length: 19 to 49 mm

Description: Cooliance offers a variety of standard forged straight fin heatsinks that come in numerous base dimensions with a max height of 15mm.

• Device: Passive Heat Sink
• Heat Sink Fin Style: Straight Fin
• Height: 6.3 to 12.7 mm
• Length: 18.8 to 44.8 mm

Description: HEAT SINK BGA 25MM 2FIN RADIAL

• Device: Passive Heat Sink
• Height: 9.07 mm
• Material: Aluminum
• Mounting: Clips

Description: Win Source Part Number: 1155500-ATS-61310K-C 1-R0 Category: Fans, Thermal Management>Thermal - Heat Sinks Series: fanSINK, maxiGRIP Type: Top Mount Package: Bulk Length: 1.220" (30.99mm) Standard Package: 100 Material: Aluminum Shape: Square, Pin Fins

Description: HEAT SINK BGA 21MM 3FIN RADIAL

• Device: Passive Heat Sink
• Height: 11.23 mm
• Material: Aluminum
• Mounting: Clips

Description: HEAT SINK BGA 37.5MM 2FIN RADIAL

• Device: Passive Heat Sink
• Height: 9.07 mm
• Material: Aluminum
• Mounting: Clips

Description: market for both AMD and Intel processors and have a long standing reputation as one of the world’s most advanced high-performance heatsink manufacturers. Now with their sights set on the hardcore enthusiast aftermarket community, Enzotech has released the BMR-C1 Forged Copper BGA Heatsinks

Description: Unidirectional Fin Heat Sink for BGAs

• Height: 7.24 mm
• Mounting: Adhesive / Tape

Description: SOLDER ANCHOR FOR BGA HEATSINKS

Description: Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs

• Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Spring Loaded, Other
• Contact Plating: Gold Plating, Other
• Contacts Pitch: 1 to 1.27 mm
• Features: Machined Pins, Open Top Socket, Clamshell Socket

Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely

• Contact / Pin Type: Other
• Contact Plating: Gold Plating
• Contacts Pitch: 1 mm
• Features: Solderless, ZIF Lock, Screw Lock

Description: heat sink, an Aavid fan, attachment hardware, and thermal interface material. These drop-in solutions provide localized, device specific cooling which increases the performance of the heat sink as well as the reliability of your FPGA/BGA device. Aavid Fan

• Application: Industrial/Commercial
• Motor Type: DC

Description: Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability. Mechanical fixing (variation between heat sinks).

• Height: 35.1 mm
• Length: 60.1 mm
• Mounting: Other
• Thermal Resistance: 6.5 °C / W

Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations

• Product Type: IC Socket

Description: ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips. Applications: Automotive Electronics

• Features: Color Options
• Material: Foam, Silicone Rubber
• Operating Temperature: -112 F
• Thickness: 0.0150 to 0.0620 inch

Description: with easy release tabs Applications Secure: Heat sink onto BGA graphic processor Heat sink to computer processor Heat sink onto drive processor Heat spreader onto power converter PCB Heat spreader onto motor control PCB

• Industry: Electronics

Description: Puncture, shear and tear resistant Electrically isolating Applications Various IC Packages Thermally enhanced BGA packages Between any heat-generating semiconductor and a heat sink Computers and peripherals

• Compound Type: Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: standard voltage, PGA-type i7/i5 CPU (45W/35W) for flexible CPU selection. An unique feature, configurable CPU power mode, is developed to balance the trade-off between heat-sink size and operating temperature. According to ambient condition, you can configure Nuvo-3120 to operate in maximal

• Cache Memory (L1 & L2): 2000 to 6000 KB
• Operating Temperature: -13 to 158 F
• Processor: Intel®
• RAM: 8 GB

Description: Product Details The LTM4636-1 is a 40A step-down µModule® (power module) switching regulator with stacked inductor as a heat sink for heat dissipation and cooler operation in a small package. The LTM4636-1 detects overtemperature and input/output overvoltage

• IC Package Type: Other
• Operating Temperature: -40 to 125 C
• Output Current (I_OUT): 40 amps
• Regulator Category: Switching Regulator

Description: developed to balance the trade-off between heat-sink size and operating temperature. According to ambient condition, you can configure TB-3052 to operate in maximal performance, reduced performance or extended temperature mode. Plenty of I/O functions, such as Gigabit Ethernet, USB 3.0, SATA,

• Processor: Intel®
• RAM: 2 to 8 GB