Products/Services for BGA ROM 102 Chip
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MASK ROM (MROM) - (22 companies)MASK ROM (MROM) chips contain software (a mask) that is burned onto the chip during the semiconductor manufacturing process. Mask ROM (MROM) chips contain a software mask that is burned onto the chip during the design phase of the semiconductor... -
Memory Chips - (676 companies)...is not a read-only (ROM) chip, as described below. Most RAM is classified as volatile; special types of non-volatile RAM (NVRAM), such as ferroelectric RAM (FRAM), are non-volatile. RAM types include: Dynamic RAM (DRAM). Static RAM (SRAM). Non-volatile RAM (NVRAM... -
LAN Chips - (39 companies)LAN chips provide wireless local area network (LAN) connectivity in a system-on-chip platform. A LAN chip is a device on an Ethernet network that broadcasts information and provides Ethernet functions, including PHYceivers and media access control... -
xDSL Chips - (11 companies)...xDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines. An xDSL chip is a generic term for all forms of DSL service spanning transmission... -
Sensor Interface Chips - (195 companies)Sensor interface chips are used as interfaces to sensors and other devices. The input at the interface collects data from the sensor and the output of the interface sends the data to a computer or other suitable device. IC is an acronym... -
FLASH Memory Chips - (273 companies)FLASH memory chips offer extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. They do not need a constant power supply to retain their data. Image Credit: Newark / element14 | Digi-Key Corporation...
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GPRS Chips - (17 companies)GPRS chips use general packet radio service (GPRS), a standard for wireless communication with a throughput rate of 115 kilobits per second. GPRS chips use general packet radio service (GPRS), a standard for wireless communications with a throughput...
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Smart Card Chips - (27 companies)Smart card chips contain a microprocessor and/or memory. They are embedded in smart cards; portable devices that resemble credit cards but are used in applications such as banking and health care. Smart card chips contain a microprocessor...
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System on a Chip (SoC) - (151 companies)System on a chip (SoC) devices are semiconductor chips with embedded components that make the chip a standalone system. System on a chip (SoC) devices are semiconductor chips with embedded components that enable the chip to function as standalone...
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SRAM Memory Chips - (197 companies)...for SRAM memory chips include: Ball grid array (BGA) - Variants include plastic-ball grid array (PBGA) and tape-ball grid array (TBGA). Quad flat package (QFP) - Variants include low-profile quad flat package (LQFP) and thin quad flat package (TQFP...
Product News
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OFIL Systems
Helicopters Use DayCor® ROM For Aerial Inspection With fiber optic IMU and a single fiber optic cable connecting selected HD sensors IR | EO | Photo | UV | LRFDayCor (R) with the control unit, ROM HD is the premium choice for aerial inspections. ROM turret hosts a customized selection of up to 5 optical sensors including, exclusively, Ofil 's proprietary ROM UV EYE Bi-Spectral Daytime camera. ROM is easily installed and operated. Installation takes only a couple of minutes due to the use, inter alia, of a single connecting cable... (read more)Browse Predictive Maintenance and Condition Monitoring Systems Datasheets for OFIL Systems -
OFIL Systems
DayCor ROM - Aerial HD Inspection System Fiber Optic Gyro. >> High sensitivity to corona. >> High flight performance. >> Set for high speed. >> FAA | EASA conformity. >> HD cameras: UV, IR, TV, PHOTO. >> Radiometric readings. >> Auto tracking. >> Geo pointing. >> Geo Lock. >> RTcA DO 160G avionic std. A powerful high-speed inspection solution for aircraft, equipped with combinations of outstandingly highly sensitive, high definition (HD) sensors in a gyro stabilized payload platform. ROM meets the need for stability, accuracy... (read more) -
PCBWay
BGA Technology in High-Density Medical Devices In the world of Printed Circuit Boards (PCBs), Ball Grid Array (BGA) technology has revolutionized the design and assembly of complex electronic circuits, particularly in applications where high component density, reliability, and performance are paramount. One specific area where BGA technology shines is in high-density medical devices, such as implantable medical devices, portable diagnostic equipment, and wearable health monitors. These devices require compact designs without compromising... (read more) -
Rego Electronics Inc.
Chip Coolers Rego 's chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements. Rego not only provides existing standard products but also customized thermal solutions according to your specifications. Product Series -. Chip Size : 35mm x 35mm to 52mm x 52mm, Height : 8.5mm to 10 mm, TDP... (read more)Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Quarktwin Technology Ltd.
600 MHz Video Switch IC - 304-BGA/AD8105ABPZ High Bandwidth Performance: Operates at 600 MHz, ensuring robust signal integrity. Wide Temperature Range: Supports temperatures from -40 C to 85 C (-40 F to 185 F), suitable for various environments. Package Type: 304-BGA Exposed Pad for enhanced thermal management. Certifications: RoHS compliant, meeting environmental standards. Ideal for precision video switching applications, the AD8105ABPZ from Analog Devices offers high bandwidth and reliable performance in diverse environmental... (read more)Browse IC Analog Multiplexers Datasheets for Quarktwin Technology Ltd. -
EXAIR
Filter out chips with EXAIR’s Chip Trapper EXAIR's patented Chip Trapper offers a fast, easy way to clean chips, swarf and shavings out of used coolants and other liquids. The Chip Trapper vacuums the coolant or liquid that is filled with debris and traps all the solids in a reusable filter bag. Only the liquid pumps back out. It is ideal for use on machines with sumps, parts washers, tanks and storage containers of contaminated liquids. A sudden lack of coolant flow in a machining operation will likely damage the part and expensive... (read more)Browse Vacuum Cleaners Datasheets for EXAIR -
KOA Speer Electronics, Inc.
ANTI-SULFURATION CHIP RESISTORS Silver-based inner electrodes in flat chip resistors can lose conductivity when the silver reacts with sulfur in a high-sulfur environment. The electrodes can lose all conductivity and disconnect the circuit as sulfuration continues. KOA Speer has developed a complete line of anti-sulfur chip resistors and arrays to protect against sulfuration of the resistor electrodes. Learn more (read more)Browse Chip Resistors Datasheets for KOA Speer Electronics, Inc. -
Win Source Electronics
S29AL008D90MFI010 Flash Memory Chip The S29AL008D90MFI010 from Spansion is a high-performance 1MB Flash memory chip designed for a wide range of electronic applications. With its robust architecture, this component offers excellent reliability and data retention, making it a suitable choice for various industrial and consumer electronics. Key Features: Memory Capacity: 1MB. Manufacturer: Spansion. Part Number: 1245140-S29AL008D90MFI010. Market Popularity: Medium. Supply Status: Limited availability. Fake Threat in Open Market: 31... (read more)Browse Memory Chips Datasheets for Win Source Electronics -
Coilcraft, Inc.
Ceramic Chip Inductors 112 inductance values from 0.8 to 120 nH. Available in 0.1 nH incremental steps between 2.8 nH and 10 nH. For inductance values greater than 120 nH please consider the 0402HP series. Lower DCR than other 0402 chip inductors. AEC-Q200 Grade 1 ( -40°C to +125°C). Exceptionally high Q - up to 160 at 2.4 GHz!. Very high self-resonant frequencies - as high as 28.8 GHz. RoHS Compliant. 260°C compatible. Matte tin over nickel over silver-platinum-glass frit terminations (read more)Browse Chip Inductors Datasheets for Coilcraft, Inc. -
Busch Vacuum Solutions
Crispy Chips and Shiny Fittings From composite foils to showerheads and reflectors, plastics with metallic surfaces are everywhere. They are often produced using BUSCH vacuum pumps. Hard, shiny, and hermetically sealed. To prevent potato chips from becoming rancid and stale, the inside of most packets of chips is coated with an ultra-thin layer of aluminum. It makes the plastic foil impermeable to air, water vapor, and UV light. It also keeps flavors from escaping via diffusion, as would be possible with pure plastic foils... (read more)Browse Mechanical Vacuum Pumps and Systems Datasheets for Busch Vacuum Solutions
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Raspberry pi, The technical manual
Ball Grid array, BGA 64 gripping ana pi 10 Bash programming 177 Bash Scripts 177 BBC micro 3, 65 BCM2835 14, 63, 71, 84, 197, 201 Beaglebone Black 9, 102 example program in C 191 acceleration sensor 198 state of readiness lines … Cache memory 70 Camera Serial interface gcc 173, 188, 191 CD / DVD- Romums -drive 141 Central Processing Unit, CPU 64 chip Package 63 chip-to-chip communication 205 Cinch adapters 127 Clock/Calendar 239, 242 Codecs 137, CSI 32, 98, 117, 193 …
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Raspberry pi, The manual
… audio and video players 104 audio adjustments 102 audio cables 100 audio options 102 sound signal 99 … Ball Grid Acray, BGA 56 Bash programming 149 Bash Scripts 149 Cache memory 61 Cambridge 1 Camera Serial interface, CSI 192 C-compilers CPU 56, gcc 145 CD / DVD- Romums -drive 114 Central Processing uni, Cinch adapters 100 Cinch plugs 68 Oock / Calendar- chip 195 Codecs 110 Command Line tool 193 …
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Nanometer CMOS ICs
… state immunity, 265 BCD, 272 rv counter, 488 behavioural simulation, 392 best-case corner, 305 BGA , 634 … device model, 576 CHEI, 336 Chemical Mechanical Polishing, 147 Chemical Vapour Deposition, 138 chip , vi rv select … … voltage scaling, 689, 695 contact filling, 167 CONTACT mask, 154 CONTACT-mask programmed ROM cell, 332 content … fat zero, 264 FD-SOI, 102 Fermi level, 9 ferroelectric RAM , 346 FIB, 680 .
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Inside NAND Flash Memories
… 386, 425, 430, 433, 435, 436, 443, 496 Bake, 430 Ball grid array ( BGA ), 178, 193, 194 … … hot electron, 90 Charge trap, 20, 51, 115–127, 545 Chien, 403, 408, 410–412 Chip enable (CE), 28 … … DRAM, 1, 11, 13, 14, 44, 50, 55, 162–164, 167, 170, 442 DSL/DSG, 102 , 331, 332, 337 … … 60–62, 72, 82, 90, 97, 107, 111, 119, 329 Funnel effect, 547 Fuse ROM , 383–388, 426, 442 …
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Manual of the Mess- and automation technique in the automobile
… injection 17 human-machine-interaction 7 human-machine-interface 391 human-machine-system 4 metal housing 156 MIC 381 Microcontroller 221, 246 Microtick 551, 553 Mikroantrieb 300 micro- BGA 156 Mikrocontroller 13 micro … … 147 MTN 377 multi chip -module 156 multi-domains … … array Logic (PAL) 143 program Mable Logic Device (PLD) 125, 143 program Mable ROM (PROM) 141 PROM … … switching behavior switching operation 287 switching time 288 338 to Schalt-the diversity 102 switch operation 327 …
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A Platform-Centric Approach to System-on-Chip (SOC) Design
The NiOS embedded processor provides for customizable, on- chip peripherals that attributes to a convenient configuration of … … based logic, or three types of memory: dual-port RAM, read-only memory ( ROM ), or content-addressable … It is housed in the 484-pin fine line, ball grid array ( BGA ) package; the maximum of … Some well- known UML processes include the Rose™ Unified Process [ 102 ], the UML/Catalysis as described by Graham …
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PDF - Ultratec CapTel CT2400i
102 … IEEE802.11b, Baseband/MAC/RF Transceiver, Dual 44MHz 32- Bit ARM7 CPU, 384KB Flash, 80KB ROM , & 128KB RAM … WLAN, Single Chip , IEEE802.11b/g/n, Baseband/MAC/RF/PA/LNA ATHEROS, (R), 6003G-BC2B, PNB305.3B, 1248 TW BGA .
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Strategies to the Prediction Mitigation and Management of Product Obsolescence
102 In general, ROM and EPROM markets have been replaced partly by EEPROM, but mainly by flash memory. … trend in most IC manufacturers is to embed memory on board a logic chip , thereby producing a … In this case, the consolidation led to the introduction of BGA packages in April 2009.
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Memory Mass Storage
… 247 Back-Side, finishing processes, 250 Bad block management, 310 Ball grid arrays ( BGA ), 237 BBM, bad … … 183 modeling of magnetic recording, 180 recording, 181 Chemical mechanical polishing (CMP), 252 Chip scale package (CSP … … MRAM (magneto resistive RAM), 91 multi-level cell (MLC) devices, 290 NAND flash, 102 , 178 natural history … … change, 352 disk, manufacturing process for a recordable, 348 disk, read only memory ( ROM ), 340 disk, readout …
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http://focus.ti.com/lit/ds/symlink/tms320vc5421.pdf
In addition, the 5421 has 128K words of on- chip program memory that can be shared between … 2K x 16-bit words of ROM have been added to the 5421 for bootloading purposes only. Figure 2−2 illustrates the ball locations for the 144-pin ball grid array ( BGA ) package and is … 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 …
