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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a single sided coated copper which contains a high Dk ceramic powder. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and
- Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding
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Supplier: LG Chemical of America Inc.
Description: Circuit / Semiconductor Materials LG Chem achieved growth mainly based on high value products. LG Chem boasts competitiveness in the materials used for PCB and semiconductors such as CCL, 2CCL, and DAF. LG Chem started mass-producing 2CCL beginning 2005, and it has been widely used in major IT
- Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding, Specialty / Other
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Supplier: Denkai America
Description: When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex® is the solution! Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package
- Embedded Passives (Capacitance / Resistance): Yes
- Features: Tested to IPC, Dielectric / Insulating, UL Listed, Other
- Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding, Plastic / Polymer
- RF / Microwave Laminate: Yes
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Supplier: RS Components, Ltd.
Description: CopperCladPCB,Polyim ide,150x200,OneSide - Printed Circuit Boards - PCB - Plain Copper Ink Resist Boards
- Length: 0.4921 ft
- Materials of Construction: Specialty / Other
- Thickness: 0.0033 inches
- Type: Rigid
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Supplier: RS Components, Ltd.
Description: CopperCladPCB,Polyim ide,100x150,OneSide - Printed Circuit Boards - PCB - Plain Copper Ink Resist Boards
- Length: 0.3281 ft
- Materials of Construction: Specialty / Other
- Thickness: 0.0033 inches
- Type: Rigid
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Supplier: ASTM International
Description: . Detailed critical reviews of porosity testing are also available. Other porosity test methods are B735, B798, B799 and B809. 1.5 This test method is specifically designed for use with gold coatings (>95% gold) on substrates of copper and nickel and their alloys. Although not covered
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Supplier: ASTM International
Description: substrates of copper, nickel, and their alloys, which are commonly used in electrical contacts. 1.3 A variety of full porosity testing methods is described in the literature. 2 , 3 These porosity Test Methods are B735 , B741 , B798 , B799 , and B809 . An ASTM Guide to the selection of
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Supplier: ASTM International
Description: substrates of copper, nickel, and their alloys, which are commonly used in electrical contacts. 1.3 A variety of full porosity testing methods is described in the literature. , These porosity Test Methods are B735, B741, B798, B799, and B809. An ASTM Guide to the selection of porosity
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Supplier: ASTM International
Description: substrates of copper, nickel, and their alloys, which are commonly used in electrical contacts. 1.3 A variety of full porosity testing methods is described in the literature., These porosity Test Methods are B 735, B 741, B 798, B 799, and B 809. An ASTM Guide to the selection of
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Supplier: RS Components, Ltd.
Description: CopperCladPCB,FR1,1. 6tx200x250,OneSide - Printed Circuit Boards - PCB - Plain Copper Ink Resist Boards
- Length: 0.6562 ft
- Materials of Construction: Paper, Specialty / Other
- Thickness: 0.0630 inches
- Type: Rigid
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Supplier: RS Components, Ltd.
Description: CopperCladPCB,FR1,1. 6tx100x150,OneSide - Printed Circuit Boards - PCB - Plain Copper Ink Resist Boards
- Length: 0.3281 ft
- Materials of Construction: Paper, Specialty / Other
- Thickness: 0.0630 inches
- Type: Rigid
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Supplier: S&P Global Engineering Solutions
Description: LAMINATE - COMPOSITE SUBSTRATE - COPPER CLAD ***TO BE USED WITH FORD WSS-M99P1111-A***
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Supplier: Henkel Corporation - Electronics
Description: Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction. Thermal Clad is a
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction. Thermal Clad is a
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction. Thermal Clad is a
- Industry: Electronics
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Supplier: Hubbard-Hall Inc.
Description: , copper, brass, bronze, aluminum alloys, nickel clad steel, stainless steel, and zinc die-castings. Aquaease™ PL 72 A32 may be used to clean a variety of synthetic lubricants and coolants, quench oils, stamping and drawing lubricants. I can be used with ultrasonics in immersion
- Applications: Cleaners / Disinfectants
- Form: Liquid / Solution
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Supplier: Henkel Corporation - Electronics
Description: Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction. Thermal Clad is a
- Industry: Electronics
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Supplier: LPKF Laser & Electronics North America
Description: substrates can be processed included copper-clad FR4, aluminum-coated PET films, ceramics, Rogers TMM®, RT/duroid®, RO4000® and PTFE based materials up to 9" x 12" in size. Precise alignment for double-sided prototypes is achieved with an included fiducial recognition camera. This
- Automation / Control: Windows / PC Control
- Form Factor: Work Station
- Laser Type: Other
- Materials Processed: Semiconductors / Electronics
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Conduct Research Top
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Characteristics and Application of 96% Alumina Ceramic Substrate
96% alumina ceramic substrates are mainly used in high-power circuit substrates such as copper clad laminates, printers, LED lighting, communications, automobile chips and other electronic components.
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Indicates content that may require registration and/or purchase.
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Book Reviews
Nowadays, the polyamide adhesive- less flexible copper clad substrate is the industry standard.
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SLOT LINE INVESTIGATIONS
C. USING THE COPPER CLAD SUBSTRATE .
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Application of fringe field capacitance sensor for the study of water permeation in organic coatings
Epoxy resin of the same grade is spin coated over another copper clad substrate under identical spinning conditions to form a uniform coating with same thickness for EIS study.
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Terahertz Planar Antennas for Next Generation Communication
The thickness of the copper is kept equal to 20 lm as mentioned earlier because commercial copper clad substrates do have the metallization in the order of micrometer.
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Recent Advances In Millimeter-Wave Integrated Subsystems
All matching elements and filters are fabricated using photolithographic tech- niques on a copper clad substrate , resulting in fewer and less costly subelements which comprise the mixer.
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Gold wire bonding onto flexible polymeric substrates
Commercially available copper clad substrates , discussed in the next section, were selected on the basis of their high temperature stability.
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2006 IEEE MTT-S Exhibition Guide as of March 20
Norwalk, CT W LaRusso, F Monger, B. Willianson Polyflon manufactures copper clad substrates which in,clulde Psire PTFE CuFlon'TM, Nor- CLAD .
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Design of dual-polarized and angular stable new bandpass frequency selective surface in X-band
The proposed bandpass FSS structure fabricated on a single sided copper clad substrate of 18 × 18 cm2 using the conventional chemical processing is placed between the two horn antennas and illuminated by the plane waves gen- erated by the transmitting horn…
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Novel dual‐mode bandpass filters using substrate integrated waveguide cavity structure
As shown in the figure, a 32 3 16 mm2 SIW cavity is formed by a double-side copper cladding substrate , and the cavity side walls are emulated by a periodically spaced blind-via enclosure with via diameter 0.6 mm and…
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Three‐port cascade de‐embedding methodology with the dangling leg effect considered for pHEMT electron trapping characterization at microwave frequency
A ground strip is printed on the front side of a rectangular piece of low loss, copper clad substrate , 0.5oz, 31 mil (0.7874 mm) thick Rogers DuroidTM 5880.