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  • Metal Migration Failures in a Hybrid Device: Interaction of Package Materials, Process Residuals, and Ambient Gases
    containing gold and copper extended from Vcc to ground across the surface of the passivation. Crystalline-like corrosion products were observed on the bond pads. The failure mechanism is shown to be an electrochemical corrosion reaction within the hybrid. Hybrid devices can contain reactive chemical
  • Tin Vs. Bare
    cold welds (metallic bonding), let's get back to the insulation displacement connectors that started the conversation. As we have already covered, an insulation displacement connector drives a blade through the insulation of the wire and makes contact with the copper conductor inside. If things go

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