DPAK Heatsink

Description: Designed from the TCH35 series, the TDH35 is a surfacemount device capable of high wattage dissipation with the proper heatsink and thermal considerations. The Ohmite D series heatsinks with the TDH35 presents a complete solution for your surfacemount wattage requirements. The thick

• Category / Application: Power Resistor
• Dielectric Strength: 1.8 kilovolts
• Features: Heat Sink, Military Standards
• Mounting / Packaging: Surface Mount (SMT / SMD)

Description: Benefits Replace bipolar with unipolar rectifiers Essentially no switching losses Higher efficiency Reduction of heat-sink requirements Parallel devices without thermal runaway Features 600-volt Schottky

• Diode Type: Schottky Barrier Diodes
• I_F: 2000 mA

Description: lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. Features: Ultrafast Recovery Ultrasoft Recovery

• Diode Applications: Rectifier Diode
• Diode Type: General Purpose (PN Junction Diodes)
• I_F: 8000 mA
• T_j: Over -55 C

Description: HEATSINK DPAK SMT TIN PLATED

• Device: Passive Heat Sink
• Height: 9.14 mm
• Length: 18.8 mm
• Material: Copper

Description: HEATSINK DPAK SMT TIN PLATED

• Device: Passive Heat Sink
• Height: 9.14 mm
• Length: 18.8 mm
• Material: Copper

Description: HEATSINK D-PAK3 TIN PLATED SMD

• Device: Passive Heat Sink
• Height: 10.19 mm
• Length: 12.7 mm
• Material: Copper

Description: HEATSINK TO-252 D-PAK COPPER

• Device: Passive Heat Sink
• Height: 10.16 mm
• Length: 8 mm
• Material: Copper

Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = MO-184, SO-10, TO-263 Length = 14.99mm Width = 25.91mm Height = 9.52mm

• Height: 9.52 mm
• Length: 14.99 mm
• Mounting: Other
• Thermal Resistance: 15 °C / W

Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = TO-268 Length = 12.7mm Width = 30.99mm Height = 10.16mm Dimensions =

• Height: 10.16 mm
• Length: 12.7 mm
• Mounting: Other
• Thermal Resistance: 14 °C / W

Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = TO-263 Length = 12.7mm Width = 26.16mm Height = 10.16mm Dimensions =

• Height: 10.16 mm
• Length: 12.7 mm
• Mounting: Other
• Thermal Resistance: 18 °C / W

Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = TO-252 Length = 22.86mm Width = 8mm Height = 10.16mm Dimensions = 22.86

• Height: 10.16 mm
• Length: 22.86 mm
• Mounting: Other
• Thermal Resistance: 15 °C / W

Description: -252 (D-PAK) and TO-220 packages. The tab on the TO-220 is ground, allowing heatsinking directly to a chassis without the need for electrically insulating spacers. Overtemperature protection shuts off the LED current when the die temperature rises above 135°C (nominal). Full LED

• Features: RoHS Compliant
• Form Factor: Integrated Circuit (IC)
• Input Voltage: 6.5 to 90 volts