Products/Services for Ebdw Lithography
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Lithography Equipment - (64 companies)Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules... -
Commercial Printing Services - (2783 companies)Commercial printing services provide high volume printing, duplication and publication of magazines, newspapers, catalogs, brochures, graphics, drawings, images and other printed media. -
Semiconductor Equipment Repair Services - (43 companies)Other semiconductor equipment repair services repair, rebuild or refurbish die bonders; cleaning and washing equipment; dicing equipment; die separators; lithography systems; packaging equipment; wafer coating equipment; wafer bonding systems... -
Photolithography Services - (31 companies)Photolithography services create photomasks and use them to etch or engrave patterns on semiconductor substrates.
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Rapid Prototyping Services - (832 companies)Rapid prototyping automates the fabrication of a prototype part from a three-dimensional (3-D) CAD drawing. These physical models convey more complete information about the product earlier in the development cycle. -
Presses (metalworking) - (520 companies)Industrial presses (metalworking) use a ram to shear, punch, form or assemble metal or other material by means of cutting, shaping, or combination dies attached to slides. Examples include die cutting machines, forming and bending machines, punch presses, shop presses, sheet metal equipment, stamping presses, and wire forming machines.
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Metal Plates and Plate Stock - (707 companies)Metal plates and metal plate stock includes metals and alloys in the form of blanks, flats, bars, plates, and sheet stock. Metal and alloy plates and plate stock are used in a variety of applications such as raw material feed for machining or forming of parts, flooring or floor fabrication, and building and construction materials.
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Sinks (washbasins) - (204 companies)Sinks are washbasins which are used to for a variety of general washing activites. They have a manageable flow of water which is drained away from the basin.
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Autofocus Systems - (13 companies)...and/or determine the distance to the sample. The signal can be a laser, light, or sound. Applications. Both active and passive AF technologies are used in applications such as: microscope automation. digital cameras. telescopes. binoculars. lithography systems...
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Imaging Plates - (14 companies)Selecting imaging plates, imaging films and imaging chemicals may require an analysis of products for offset printing. Imaging plates for offset lithography differ by substrate, plate-end type, and graining. Substrate materials include cellulose-based...
Product News
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3X Ceramic Parts Company Limited
SiC ceramic precision parts in lithography machine Silicon carbide ceramic precision parts: inject "soul" into the new generation of lithography machine. The key equipment of integrated circuit represented by lithography machine is the product of high integration of modern technology. Its design and manufacturing process can reflect the highest level in many related scientific fields, including material science and engineering, machining and so on. For the discipline of materials science and engineering, the key equipment of integrated circuit... (read more)Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
THK America, Inc.
Completely Non-Magnetic Products Cutting edge technology support by THK-NM1. MRI Scanner. Electron Microscope. NMR Spectrometer. Electron Beam Lithography System. Learn More (read more)Browse Roller Bearings Datasheets for THK America, Inc. -
Navitar, Inc.
Industrial Imaging Technologies Our integrated imaging solutions provide the eyes of automation for machine vision, metrology and robotic systems, advanced semiconductor and electronic inspection, semiconductor lithography, advanced life science equipment, autonomous vehicles, homeland security, entertainment, planetarium, military applications and AR/VR. (read more)Browse Image Analysis Software Datasheets for Navitar, Inc. -
Mitsui Chemicals America, Inc.
Mitsui Pellicle Mitsui Pellicle is a dust proof membrane applied to photomask in the lithography process of the semiconductor manufacturing process. Pellicle's membrane materials and membrane thickness are designed to optimize different light exposures and achieve excellent transmission rates. To ensure photomask, Mitsui Chemicals selects materials such as non-dust structures that eliminate particle generation and ensure cleanliness during long periods of light exposure. With its high level of cleanliness... (read more) -
Air Innovations, Inc.
Custom ECU for Semiconductor Process Equipment Semiconductor: Custom ECU for Semiconductor Process Equipment. The Challenge: Custom ECU for Semiconductor Application. One of the biggest challenges in using lithography in high-volume semiconductor fabrication is photomask defectivity. A global supplier to the semiconductor and photomask making industries asked Air Innovations to create an environmental control unit (ECU) that could service -- on demand -- any of its nanomachining mask repair tool systems. Extremely tight tolerance... (read more)Browse Environmental Control Systems Datasheets for Air Innovations, Inc. -
Tecnotion
ULV – G2 series The Vacuum ULV - G2 series is the medium-size series in the high-end vacuum-rated linear motor series. They are commonly used for applications demanding peak force or low heat output.Such as in lithography and inspection solutions. In longer strokes, ULV - G2 coils can be combined to save magnet material but still achieve high performance. (read more)Browse Linear Motors Datasheets for Tecnotion -
NBK America LLC
Semiconductor Manufacturing Equipment Screws NBK has a large variety of screws which have unique functions thereby making them suitable for Semiconductor Manufacturing Equipment. Examples inlcude: Vented, Low Outgas, Chemical Resistance, High Strength, Heat Resistance, Anti-Galling-Seizing, Non-Magnetic screws, etc. These can be used for Wafer cleaning machinery, Oxidation/diffusion equipment, Coater/developer, Semiconductor lithography equipment, Etching equipment, Ion implantation equipment, Film deposition equipment, Sputtering... (read more)Browse Screws Datasheets for NBK America LLC -
Zygo Corporation
ZMI ™ Displacement Measuring Interferometers ZYGO is the technology and application support leader in heterodyne displacement interferometry, offering complete solutions and support for your OEM metrology application. ZYGO's technologies and OEM products have been field proven over many years of use in leading-edge production facilities. Typical Applications. * Lithography tools: optical lithography steppers and scanners, e-beam & laser mask writers. * Metrology tools: Mask and wafer inspection and measurement tools, CD-SEMs... (read more)Browse Semiconductor Metrology Instruments Datasheets for Zygo Corporation -
Xiamen Unipretec Ceramic Technology Co., Ltd.
High-Precision Ceramic Wafer Chuck The Ceramic Wafer Chuck is essential in the semiconductor industry for holding wafers securely during high-precision processes like lithography, etching, deposition, and testing. With its exceptional thermal stability, chemical resistance, and flatness, this chuck ensures precise wafer positioning for optimal process control, reducing misalignment and contamination risks. Engineers rely on the Ceramic Wafer Chuck to maintain consistent wafer handling, improving production yields and ensuring... (read more)Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Richardson RFPD
New 18W X-Band GaN-on-SiC MMIC Amplifier from UMS The CHA8612-QDB/20 is manufactured with a GaN-on-SiC process, 0.25 um gate length, via holes through the substrate, air bridges and electron beam gate lithography. FEATURES. High output power: 18 W. High PAE: 40%. Linear gain: 26 dB. DC bias: Vd=30 V @ IDQ=680 mA. MSL 3. APPLICATIONS. It is designed for a wide range of applications, from military to commercial radar and communication systems. (read more)Browse RF Amplifiers Datasheets for Richardson RFPD
More Information
Indicates content that may require registration and/or purchase.
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Manufacturing concerns for advanced CMOS circuit realization EBDW alternative solution for cost and cycle time reductions
Finally, integration results of EBDW lithography for 120nm node patterning circuit are demonstrated.
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Electron beam direct write lithography flexibility for ASIC manufacturing: an opportunity for cost reduction (Keynote Paper)
Via-customization techniques4, fix architecture validation are examples where EBDW lithography can offer a consequent price reduction versus standard ASIC "optical" production flow.
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A lossless circuit layout image compression algorithm for electron beam direct write lithography systems
There are a number of advantages to EBDW lithography systems.
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E-beam direct-write lithography for the 45nm node using the novel STEAG HamaTech single substrate coat-bake-develop ModuTrack
This integrated tool concept is demonstrated referring to the recently installed 8“ wafer and 6“ photomask ModuTrack at ITRI (Industrial Technology Research Institute of Taiwan), where the process development for wafer e-beam direct-write ( EBDW ) lithography and photomask processing is ongoing.
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Introduction to Semiconductor Manufacturing Technology
An EBDW lithography system uses a fine scanning e-beam to directly write the design patterns stored in a database computer onto the electron-sensitive resist on a substrate surface, similar to a laser printer printing words or images from a computer …
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Feasibility study of optical/e-beam complementary lithography
Borodovsky proposes a combination of different lithography technologies such as 193i or EUV with one optical mask, or maskless E-Beam Direct Write ( EBDW ) lithography , to cut the lines, thus complementing optical lithography, which the one that called “Complementary Lithography”.
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Electron beam direct write process development for sub 45nm CMOS manufacturing
Electron Beam Direct Write ( EBDW ) lithography represents a low cost and a rapid way to start basic studies for advance devices and process developments (1, 2) .
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Data preparation solution for e-beam multiple pass exposure: reaching sub-22nm nodes with a tool dedicated to 45 nm
Electron Beam Direct Write ( EBDW ) lithography is used in the IC manufacturing industry to sustain optical lithography for prototyping applications and low volume manufacturing.
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Electron beam lithography simulation based on a single convolution approach: application for sub-45nm nodes
Moreover, this EBDW lithography requires more and more an accurate electron beam proximity correction (EBPC) [3] models for sub-45nm nodes layers.
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New writing strategy in electron beam direct write lithography to improve critical dense lines patterning for sub-45nm nodes
In this paper, we proposed a new writing strategy using multiple pass exposure to pattern critical dense features with EBDW lithography .
