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  • MICRO: Advanced Process
    the qualification of the 90-nm technology node. As the size of the memory cell decreases and the packing density increases, it is becoming more and more vital to ensure that each bit is electrically isolated from its neighbors. Failure to electrically isolate the device core can make it difficult to program
  • MICRO:Product Technology News (Sept '99)
    defects on patterned wafers. Using OperatorFree EDX analysis, the microscope features automatic material identification to characterize defects on unpatterned wafers such as monitor wafers and those with blanket films or planarized surfaces. The SEM classifies defects by type, material properties

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