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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding,
- Applied Thickness / Gap Fill: 0.0020 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
- Composition: Two Component System, Unfilled
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Supplier: EXACT Dispensing Systems
Description: encapsulating of connectors, coils and other electronic components. The vacuum process provides improved impregnation in difficult to reach areas (i.e. connection pins, under circuit boards) and ensures void free encapsulation. With the advent of quick setting
- Chamber / Component Type: Custom / Specialty Chamber
- Height / Length: 24 inch
- Nominal Size (OD / Width): 18 inch, 24 inch
- Vacuum / Pressure Range: Rough / Low (< 760, > 1 torr)
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Supplier: EXACT Dispensing Systems
Description: potting or encapsulating of connectors, coils and other electronic components. The vacuum process provides improved impregnation in difficult to reach areas (i.e. connection pins, under circuit boards) and ensures void free encapsulation. With the advent of quick setting
- Mounting: Machine Mounted, Robotic
- Type: Dispense Only
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled, Solvent Based (Volatile Organic)
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.95 to 2.96
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Supplier: ELANTAS PDG, Inc.
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and
- Coeff. of Thermal Expansion (CTE): 77.78 to 172 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Master Bond, Inc.
Description: Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.4
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Supplier: ELANTAS PDG, Inc.
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 108 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: RS Components, Ltd.
Description: Mains high power factor Class II IP54 encapsulated ballast / ignitors for metal halide lamps for outdoor use comprising of a ballast, ignitor and a power factor correction capacitor. IP54 for outdoor use. Maximum load capacity 2000pF. Ballasts are vacuum impregnated with polyester
- Ballast Technology: Electronic Ballast
- Lamp Type: Metal Halide Lamp
- Lamp Wattage: 150 watts
- Nominal Voltage: Other
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Plastic enclosures for encapsulating electronics Comprehensive range of boxes for potting electronic assemblies. With special cost advantages for series type production. potted assemblies are protected from shock as well as temperature, dampness and (read more)
Browse Electronic and Instrument Enclosures Datasheets for OKW Enclosures, Inc. -
technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. OverTec 5 FR is a polyamide resin specifically designed for over-moulding. It has UL-VO flammability rating and excellent electrical properties. Components can be (read more)
Browse Electrical and Electronic Resins Datasheets for Techsil Limited -
ELANTAS provides comprehensive solutions for all your electrical insulation needs. Impregnation resins, magnet wire enamel, and flexible insulation materials from ELANTAS PDG offer reliable solutions for your critical insulation (read more)
Browse Resins and Compounds Datasheets for ELANTAS PDG, Inc. -
VMI’s single phase bridges are assembled with VMI diodes, then encapsulated in a rigid epoxy VMI manufactures high voltage assemblies ranging from 5kV to 20kV, 70nS to 3000nS, 50mA to 2.2A. About VMI... (read more)
Browse Electronic Bridges Datasheets for Voltage Multipliers, Inc. -
This exciting new range has been added for OEM buyers as well as electronics design and production engineers. A wide range of new products is available with key features for electronics applications, such as 846 carbon conductive grease which will repel moisture and (read more)
Browse Electrical and Electronic Resins Datasheets for RS Components, Ltd. -
for diagnostics. As part of the IAC™ (Intelligent Active Connector) program, additional features, such as unique connector identification can be available. In this case, the connector pair will encapsulate an electronic chip that can offer identification, counting, safety and security (read more)
Browse Medical Electronic Connectors Datasheets for LEMO USA, Inc. -
across both its implantable feed-thru and endoscope window product lines. The company's new standard product line encapsulates those design commonalities into a catalog of products that are ready to ship -- virtually eliminating multi-month lead times and NRE costs. (read more)
Browse Medical Electronic Connectors Datasheets for Hermetic Solutions Group -
enamels, impregnating resins and casting materials. This makes ELANTAS the preferred supplier for the electrical insulation industry and the main supplier to large international customers. Business Lines The Division covers the markets through its business lines. The (read more)
Browse Conformal Coatings Datasheets for ELANTAS PDG, Inc. -
position for itself and is the world‘s leading manufacturer of wire enamels, impregnating resins and casting materials. This makes ELANTAS the preferred supplier for the electrical insulation industry and the main supplier to large international customers. Business Lines (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
development of impregnating resins, compounds and wire enamel technologies. As a member of ALTANA, based in Wesel, Germany, our sister companies throughout the world offer a strong global approach to research, manufacturing and service that translates into creative solutions (read more)
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pres- sure impregnation , elec. and electronic adhesives/ encapsulants ; struc- tural adhesives .
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pres- sure impregnation , elec. and electronic adhesives/ encapsulants ; struc- tural adhesives .
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Handbook of Rheology Modifiers
Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pressure impregnation , elec. and electronic adhesives/ encapsulants ; structural adhesives; visc. modifier for epoxies .
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Handbook of Fillers, Extenders, and Diluents
Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pressure impregnation , elec. and electronic adhesives/ encapsulants ; structural adhesives; visc. modifier for epoxies .
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Silicon‐Containing Cycloaliphatic Epoxy Resins with Systematically Varied Functionalities: Synthesis and Structure/Property Relationships
… excellent adhesion to various substrates after curing,[1–5] and been widely employed in a variety of applications, such as vacuum-pressure impregnation for the stator winding … … printed circuit-board fabrications, encapsulation of electronic circuits, and polymer matrix resins for high-performance fiber …
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Thermal and electrical properties of epoxy composites at high alumina loadings and various temperatures
Epoxy resins as thermosetting materials have been used in a variety of industrial applications, such as inks, coatings, paints, vacuum pressure, impregnation of coils, encapsu- lation of electronic circuit elements and printed circuit board coatings because of their excellent heat and chemical …
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Influence of interface structure on dielectric properties of epoxy/alumina nanocomposites
Of thermosets, epoxy resins have long been applied in a variety of industrial applications, such as paints, coatings, inks, reactive diluents, vacuum pressure impregnation of coils, encapsulation of electronic circuit elements and printed cir- cuit board coatings because of their good heat …
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Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide
… modulus and high- temperature performance, low shrinkage, and good corrosion resistance, etc.,1–3 epoxy resin finds a broad spectrum … … coatings, castings, modeling compounds, impregnation materials, high-performance composites, insulat- ing materials, encapsulating and packaging materials for elec- tronic devices, and so forth …
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Synthesis and Properties of a Novel Cycloaliphatic Epoxide
Cycloaliphatic epoxy resins have been found to be useful in a variety of industrial applications, such as … … diluents, acid scavengers, molded articles, filament-wound or pultruded glass-reinforced articles, vacuum pressure impregnation of coils, encapsulation of electronic circuit elements and printed …
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Call for papers
Dispensing equipment Drive systems Electrical/ electronic components Electrical manufacturing for durable goods Electrical steels and laminations Employee productivity Encapsulating techniques Energy-saving designs … … analysis Hi-pot testing Impregnating applications & methods Insulating … … magnet motors Plastics & resins Potting & encapsulating Power …