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  • Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
    Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pres- sure impregnation , elec. and electronic adhesives/ encapsulants ; struc- tural adhesives .
  • Handbook of Adhesive Chemical and Compounding Ingredients
    Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pres- sure impregnation , elec. and electronic adhesives/ encapsulants ; struc- tural adhesives .
  • Handbook of Rheology Modifiers
    Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pressure impregnation , elec. and electronic adhesives/ encapsulants ; structural adhesives; visc. modifier for epoxies .
  • Handbook of Fillers, Extenders, and Diluents
    Uses: Epoxy diluent; aliphatic difunctional modifier for filament winding, high solids coatings, pultrusion and resin transfer molding, vacuum pressure impregnation , elec. and electronic adhesives/ encapsulants ; structural adhesives; visc. modifier for epoxies .
  • Silicon‐Containing Cycloaliphatic Epoxy Resins with Systematically Varied Functionalities: Synthesis and Structure/Property Relationships
    … excellent adhesion to various substrates after curing,[1–5] and been widely employed in a variety of applications, such as vacuum-pressure impregnation for the stator winding … … printed circuit-board fabrications, encapsulation of electronic circuits, and polymer matrix resins for high-performance fiber …
  • Thermal and electrical properties of epoxy composites at high alumina loadings and various temperatures
    Epoxy resins as thermosetting materials have been used in a variety of industrial applications, such as inks, coatings, paints, vacuum pressure, impregnation of coils, encapsu- lation of electronic circuit elements and printed circuit board coatings because of their excellent heat and chemical …
  • Influence of interface structure on dielectric properties of epoxy/alumina nanocomposites
    Of thermosets, epoxy resins have long been applied in a variety of industrial applications, such as paints, coatings, inks, reactive diluents, vacuum pressure impregnation of coils, encapsulation of electronic circuit elements and printed cir- cuit board coatings because of their good heat …
  • Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide
    … modulus and high- temperature performance, low shrinkage, and good corrosion resistance, etc.,1–3 epoxy resin finds a broad spectrum … … coatings, castings, modeling compounds, impregnation materials, high-performance composites, insulat- ing materials, encapsulating and packaging materials for elec- tronic devices, and so forth …
  • Synthesis and Properties of a Novel Cycloaliphatic Epoxide
    Cycloaliphatic epoxy resins have been found to be useful in a variety of industrial applications, such as … … diluents, acid scavengers, molded articles, filament-wound or pultruded glass-reinforced articles, vacuum pressure impregnation of coils, encapsulation of electronic circuit elements and printed …
  • Call for papers
    Dispensing equipment Drive systems Electrical/ electronic components Electrical manufacturing for durable goods Electrical steels and laminations Employee productivity Encapsulating techniques Energy-saving designs … … analysis Hi-pot testing Impregnating applications & methods Insulating … … magnet motors Plastics & resins Potting & encapsulating Power …