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Conduct Research Top

  • MICRO: Best of ASMC- Williams (January 2001)
    Randy Williams and Robert Jacques, ; and Mustafa Akbulut and Wayne Chen, A collaborative study that used an advanced unpatterned wafer inspection system found that epitaxial defects and their corresponding impact on device yield varied between wafer suppliers. Silicon wafers with an epitaxially
  • MICRO: The Hot Button
    Strained-silicon engineering leads field of transistor technology improvements The implementation of strain engineering has brought to bear a whole new set of techniques for scaling front-end-of-line (FEOL) structures well into and possibly beyond the 45-nm realm. By slightly modifying dielectric