Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
    Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability.
  • Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
    Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
  • Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
    The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
  • The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes
    The incessant drive to. miniaturize electronic. systems places pressure. on semiconductor manufacturers. to offer ever-smaller components. This trend is rapidly. approaching its logical conclusion,. which is the elimination. of the semiconductor's package. altogether in favor of a die. which can be
  • Medical Device Link .
    Flip-Chip Processes Affect Size, Cost, and Reliability by Albert P. Kretz and Donald Styblo Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips without the conventional plastic packaging that adds a great deal of bulk. Combined with tiny
  • Medical Device Link .
    Karl-Friedrich Becker, Andreas Ostmann, and Tom Adams Incorporating a flip chip into a product can be a viable option for medical electronics. Production processes must be developed that achieve short assembly time, low cost, and high reliability. Advanced chip packages offer advantages
  • Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices
    . the standard flip-chip waferbump.
  • Honey, I shrunk the circuit board
    and solderable leads associated with finished ICs saves up to 50% of the surface area required by conventional circuit layouts. The flip-chip process is a successor to COB. The flip-chip technique eliminates the surface area around the IC used for wire bonding. As with COB, flip chip is compatible

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire