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Supplier: Win Source Electronics
Description: Win Source Part Number: 1147486-HSB12-272706 Category: Fans, Thermal Management>Thermal - Heat Sinks Series: HSB Type: Top Mount Package: Box Length: 1.063" (27.00mm) Standard Package: 1,540 Material: Aluminum Alloy Shape: Square, Pin Fins Package
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Supplier: DigiKey
Description: ARMOR LITE HEAT SINK WITH PWM FA
- Device: Passive Heat Sink
- Mounting: Mounting Holes, Adhesive / Tape
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Supplier: DigiKey
Description: HEAT SINK KIT FOR RASPBERRY PI 4
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Adhesive / Tape
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Supplier: DigiKey
Description: ALUM HEAT SINK FOR RASPBERRY PI
- Device: Passive Heat Sink
- Height: 8 mm
- Length: 14 mm
- Material: Aluminum
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Supplier: DigiKey
Description: HEAT SINK KIT FOR RASPBERRY PI 4
- Device: Passive Heat Sink
- Material: Aluminum, Copper
- Mounting: Adhesive / Tape
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Supplier: Richardson RFPD
Description: Unidirectional Fin Heat Sink for BGAs
- Height: 7.24 mm
- Mounting: Adhesive / Tape
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Supplier: Henkel Corporation - Industrial
Description: White to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding
- Features: Thermal / Heat Conductive
- Viscosity: 100000 cP
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
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Supplier: Hi-Tech Seals, Inc.
Description: conductive acrylics. Dissipator® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement.
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.83E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 5.23 to 6.49
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Supplier: Budnick Converting, Inc.
Description: 3M 8805 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes.
- Thickness: 0.0050 inches
- Type: Transfer
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion. Low temperature cure Flexible Good adhesion
- Adhesive: Epoxy
- Backing: Specialty / Other
- Thickness: 0.0020 inches
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.1 W/m-K
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Supplier: RS Components, Ltd.
Description: A range of BGA heatsinks with thermally conductive adhesive tape mounting. Tape mounting saves board space by eliminating mounting holes. Convenient peel and stick assembly is quick and clean. Pin Fin array allows omni-directional airflow to maximize heat dissipation For Use With = BGA
- Height: 18 mm
- Length: 40 mm
- Mounting: Adhesive / Tape, Other
- Thermal Resistance: 12.2 °C / W
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Supplier: Protavic America, Inc.
Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Insulating / Dielectric, Thermal / Heat Conductive
- Filled / Reinforced: Yes
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Supplier: DuPont Electronics & Imaging
Description: to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive: Adhesive thickness: 12, 25, 50, 75 and 100um Certified to IPC 4203A/18
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Features: Encapsulating / Potting
- Industry: Electronics, OEM / Industrial
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt
- Compound Type: Thermal Compound / Heat Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass, making it
- Chemical / Polymer System Type: Epoxy (EP)
- Use Temperature: -85 to 311 F
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress,
- Cure Type / Technology: Single Component System
- Dielectric Strength: 424 kV/in
- Elongation: 20 %
- Features: Thermal / Heat Conductive
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Supplier: Budnick Converting, Inc.
Description: 3M 8810 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes.
- Peel Strength / Adhesion: 4.69 lbs/in
- Thickness: 0.0100 inches
- Type: Transfer
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Supplier: Xoxide
Description: potential. Features: H.D.T. (Heat-pipe direct touch) technology Vast compatibility across multiple types of memories Outstanding cooling efficiency Designed for professional gamer Supports Dual Channel Memory setup Increases overclocking
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Supplier: Essentra Components
Description: Fasten a heat sink to a processor chip on a PCB They have an integrated spring that provides continuous pressure to the heat sink until the thermal adhesive cures The HSR-2 has a cross molded in allowing it to be installed by using a phillips head screwdriver
- Material: Plastic
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Supplier: Essentra Components
Description: Fasten a heat sink to a processor chip on a PCB They have an integrated spring that provides continuous pressure to the heat sink until the thermal adhesive cures The HSR-2 has a cross molded in allowing it to be installed by using a phillips head screwdriver
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal
- Device: Passive Heat Sink
- Height: 7.5 to 17.5 mm
- Length: 15 to 45 mm
- Material: Aluminum
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.7
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3875 PTB Blue is a two component, thermally conductive, bead-on-bead adhesive designed to structurally bond, and thermally couple heats sinks to heat dissipating electronic components. Ideal for rectifiers, transistors, and other power devices. Part B, 30
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.75 to 2 W/m-K
- Viscosity: 90000 to 190000 cP
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Supplier: Ellsworth Adhesives
Description: Bergquist Bond-Ply 100 is a double-sided, acrylic adhesive tape on a fiberglass reinforced carrier. It is used for mounting heat sinks or heat spreaders instead of using screws, clips, or adhesives. It has a high bond strength and is thermally conductive. 11 in x
- Adhesive: Acrylic
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Supplier: Ellsworth Adhesives
Description: and flexibility make it ideal for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80 to 100 ºC for simple rework. Once cured the adhesive is flexible with 80 A hardness and tensile elongation
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
- Viscosity: 280000 cP
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RF and Microwave Laminates - Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive -- Pyralux® FRSupplier: DuPont Electronics & Imaging
Description: innerlayers or rigid cap layers in multilayer lamination. It is also widely used to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive:
- Features: Tested to IPC, UL Listed
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
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Supplier: RS Components, Ltd.
Description: Thermally conductive adhesive for bonding transistors to heat sinks and heat sinks to boards. Kit includes 25ml syringe and 18ml activator. Type = Thermal Conductive Adhesive Product Material = Acrylic Package Type = Bottle, Syringe Package Size = 18 ml, 25
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 0.8150 W/m-K
- Use Temperature: -67 to 302 F
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: . Fix the CPU and heat sink or heat sink. 2. Fix the LED strip, substrate and frame. 3. Fix the electronic components and heat sink?
- Backing: Cloth - Woven Fabric, Glass / Fiberglass, Specialty / Other
- Type: Double-Sided
- Width: 0.3937 to 9.84 inches
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Coeff. of Thermal Expansion (CTE): 11.67 to 52.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.95
- Features: Thermal / Heat Conductive
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Supplier: Techsil Limited
Description: low resistivity needed for many operating conditions. This epoxy adhesive is great for forming conductivity seals, bonding and the repairing of electronic devices. Primarily used as a solder replacement for bonding heat-sensitive electronic components. It allows for quick cold
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Techsil Limited
Description: PCB's to substrates and for use as a thermal adhesive between electronic components and heat sinks. Product Benefits Easy to use, one-component material Thermally conductive Flame retardant Non-corrosive to most metals Low volatility
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Features: Thermal / Heat Conductive
- Industry: Electronics
Find Suppliers by Category Top
Featured Products Top
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This is because aluminum replaced copper as the cheaper alternative for heat sinks in LEDs. However, although it is relatively malleable and effective in conducting heat, it’s not that environmentally friendly to dispose of. This is where ceramic comes in! Ceramic is a very cost (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
SARCON® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. Application: 1. Fix the CPU and heat sink or heat sink. 2. Fix the LED strip, substrate and frame. 3. Fix the electronic components and heat sink? See more for application Picture & DataSheets (read more)
Browse Adhesive Tapes Datasheets for Shenzhen You-San Technology Co., Ltd. -
, potting, etc. A wide variety of pressure sensitive adhesive backings to choose from Custom mounting of heaters to heat sinks Fabrication of customer specified heat sinks (read more)
Browse Industrial Heaters Datasheets for Flexible Circuit Technologies, Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
. The Converting Experts The acrylic transfer tape was chosen because it is a very thin low tack adhesive (very similar to a Post-It Note). Its properties allowed us to laminate to their material and make it repositionable. The acrylic adhesive did not prevent the heat (read more)
Browse Specialty Tapes Datasheets for Budnick Converting, Inc. -
heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks. Sarcon® EGR-11F also provides excellent shielding effectiveness across a broad frequency spectrum while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
sponge and solid materials. R10404 – Closed-cell conformable silicone rubber sponge is designed for use where both conformability and heat transfer are necessary, such between printed circuit boards and heat sinks, decal transfer or applying heat activated adhesives. R10400 (read more)
Browse Elastomer and Rubber Shapes Datasheets for Saint-Gobain Tape Solutions
Conduct Research Top
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Skived Fin Heat Sinks: Solutions as Smooth as Butter
Many heat sink designs consist of separate fins and base and are assembled together using an adhesive process to bond the two together. These heat sink assemblies have an added thermal resistance in the form of the adhesive layer between the base and the fins. Extrusions, which are a single piece
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Bond, Thermal Bond: An Overview on Bonded Fin Heat Sinks
Aavid Genie has a bonded fin heat sink as one of the options available to you in the Technology Matrix. For those unfamiliar to them, a bonded fin heat sink consists of 3 main parts: a base with grooves, fins, and an adhesive to "bond" the fins to the base. Hence the name "Bonded Fin Heat Sink."
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Sep Solving Common Challenges with Electronic Assembly Adhesive
components to printed circuit boards, attaching heat sinks to electronic components, and sealing electronic enclosures.
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Webb Abrasives Clog Resistant Technology
by a precise combination of backing, grit, adhesives and coating. It uses a heat-resistant adhesive that prevents grit from sinking into the adhesive during friction. This flexible adhesive also allows the grit to sweep back and forth like a broom allowing an aggressive cut. A thin clear coat of polymer
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Thermabond Application Notes -D001
Typically, the most difficult part of working with Thermabond (R) is liner removal after the material has been tacked to the heat sink. The key to this process is to avoid trapping air at this interface. If not removed, the material tends to "lift up" when the brown liner is removed, causing