Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • Copper Heat Sinks Versus Aluminum Heat Sinks - Advantages and Disadvantages (.pdf)
    Many designers will turn to copper as an alternative material to improve heat sink performance when an aluminum sink may not provide enough cooling. In some cases this switch is justified, in other cases it may not be. Following are a few rules of thumb for when the extra cost and weight of copper
  • Managing Heat Transfer With Potting Compounds
    heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air
  • Thermabond Application Notes -D001
    Typically, the most difficult part of working with Thermabond (R) is liner removal after the material has been tacked to the heat sink. The key to this process is to avoid trapping air at this interface. If not removed, the material tends to "lift up" when the brown liner is removed, causing
  • Finite Element Analysis Report - Advantages of the CTE Matched Flange
    , particularly in stress calculations. It is further assumed that the convection and radiation effects are negligible, and therefore the majority of the dissipated energy is conducted to the heat sink through the carrier.
  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative
  • High Reliability Interconnects for High Powered Assembly
    New high and ultra-high power LED package designs provide high lumen density that can enable significant system cost reductions through fewer LEDs, smaller PCBs, and smaller heat sink size requirements. Use of high and ultra-high power packages necessitates use of Metal Core PCBs for thermal
  • Press-Fit Current Carrying Capacity - Part 3
    and the solder-free nature of press-fit zone components allows engineers to optimize manufacturing processes, even if the product includes large heat sinks, multiple internal substrates, and complex control circuitry, all with different thermal coefficient of expansion (CTE) characteristics
  • Fiber Laser Welding of High Integrity Implantable Medical Devices
    , particularly used for electrical connections, have become so small and thin that the conventional Nd:YAG laser performs like a big and rough tool. The greatest challenge for welding is that the miniature components have limited heat sink ability, particularly if the components contain heat sensitive elements

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire