Industrial Adhesive Application

Description: LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications.

• Industry: Military / Government (MIL-SPEC / GG)

Description: LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
• Cure Type / Technology: Single Component System

Description: LOCTITE ABLESTIK 3280, Acrylate, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 3280 electrically conductive die attach adhesive is designed for high reliability package applications . This material offers improved JEDEC performance on QFP type packages. Low

Description: LOCTITE ABLESTIK 8301, Epoxy hybrid, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8301 electrically conductive die attach adhesive is designed for high reliability package applications. Electrically conductive Thermally conductive Snap

Description: It is a unitized, UV-curable adhesive, specially designed for pin bonding applications of LCD terminals.

• Cure Type / Technology: UV / Radiation Cured (EB, Light)
• Substrate / Material Compatibility: Ceramic / Glass

Description: UV curing end face sealant suitable for LCD applications, convection process.

• Cure Type / Technology: UV / Radiation Cured (EB, Light)

Description: Used for LCD pin fixing.

• Cure Type / Technology: UV / Radiation Cured (EB, Light)

Description: The special formula of this product is suitable for the moisture-proof treatment of the COG or TAB installation terminal of the LCD module. The product's high flexibility and good moisture-proof characteristics improve the protection performance.

• Cure Type / Technology: UV / Radiation Cured (EB, Light)

Description: PADDING Hot Melts and Low Temperature Hot Melts for Brackett Padding Machines Cattie Adhesive Solutions offers a Full line of high quality PADDING Hot Melts, Low Temperature Hot Melts and Water-Based Adhesives for your PADDING applications. For more Info, Pricing and Samples,

• Cure Type / Technology: Thermoplastic / Hot Melt
• Industry: OEM / Industrial

Description: EverGuard® PVC Bonding Adhesive Description Solvent-based rubberized adhesive for use with PVC-based membranes Benefit/Application Two-surface contact adhesive applied to both underside of membrane and substrate surface Suitable for

• Chemical / Polymer System Type: Rubber Based / Elastomeric
• Industry: Building / Construction
• Solvent Based (Volatile Organic): Yes
• Substrate / Material Compatibility: Ceramic / Glass, Plastic

Description: EverGuard® TPO Bonding Adhesive Description Solvent-based rubberized adhesive for use withTPO-based membranes Benefit/Application Two-surface contact adhesive applied to both underside of smooth surfaced membrane and substrate surface

• Chemical / Polymer System Type: Rubber Based / Elastomeric
• Industry: Building / Construction
• Solvent Based (Volatile Organic): Yes
• Substrate / Material Compatibility: Ceramic / Glass, Plastic

Description: Transfer adhesive closures are strong, thin, and flexible and offer tooless installations. Adhesives are not intended for applications requiring periodic rework or re-entry. It is possible to peel apart an adhesive closed jacket once installed, but doing so will destroy

• Chemical / Polymer System Type: Acrylic / Polyacrylate

Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening

Description: Dap white construction adhesive is compatible with ceramic, concrete, drywall, eps, fiberboard, masonry, metal, plaster, plywood and wood materials with a 24 hr cure time. Provides a 30 min fixture time. Minimum to maximum operating temperatures are 0 F to +120 F.

• Use Temperature: 0.0 to 120 F

Description: strength and high flexibility Low odor formulation for a better environment for installer and building occupants Easy Application…sprayer, brush or notched squeegee-maintains excellent low temperature flexibility Uses MATRIX™ 102 SBS Membrane Adhesive is a

• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Features: Flexible / Dampening, UL Approved
• Industry: Building / Construction
• Substrate / Material Compatibility: Concrete / Masonry

Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Features: Electrically Insulating / Dielectric

Description: Description Matrix™ 103 Cold Process Adhesive is a contractor grade, non-polymer modified asbestos-free formulation for use as a cold-applied bonding agent for organic, fiberglass or polyester fabric Built-Up Roofing (BUR) Systems. In addition, the formulation is non-destructive to

• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Features: Flexible / Dampening, UL Approved
• Industry: Building / Construction
• Substrate / Material Compatibility: Ceramic / Glass

Description: , this adhesive is also very effective on a wide variety of materials and substrates. The gel viscosity product offers the longest assembly time of 30 seconds and an initial cure speed of 20 seconds. It is ideal for gap-filling applications, gluing porous and odd-shaped surfaces and

• Chemical / Polymer System Type: Cyanoacrylate
• Viscosity: 60000 cP

Description: Water-Based Glues and Adhesives Water-based glues are made from naturally occurring substances such as corn and are processed into materials including starch and dextrin. These are among the lower cost glues on a per-pound basis. Applications include: general labeling

Description: adhesives and sealants industry, many of our phenol-formaldehyde and urea-formaldehyde resins and modifiers are used for grit adhesion to various substrates for industrial applications including scrubbing pads and coated abrasives. GP Chemicals also produces a line of triazone

• Chemical / Polymer System Type: Phenolics / Formaldehyde Resin
• Industry: Building / Construction
• Substrate / Material Compatibility: Wood / Wood Product

Description: KB9541 is a fast curing, general purpose, low viscosity, ethyl cyanoacrylate instant adhesive, designed to bond to a variety of materials including most plastics, rubbers, metals, and other common substrates. KB9541 instant adhesive is widely used in applications including white

• Applied Thickness / Gap Fill: 0.0039 inch
• Chemical / Polymer System Type: Cyanoacrylate
• Cure Type / Technology: Reactive / Moisture Cured, Single Component System, Two Component System
• Industry: Automotive, Electronics, OEM / Industrial, Building / Construction

Description: Polyken 1027 LIQUID ADHESIVE/PRIMER Polyken 1027 liquid adhesive system is ideal for slower machine application to rough, reconditioned, or grit-blasted pipe surfaces. It provides a uniformly smooth, instant tack surface for Polyken coating systems. Applications

• Chemical / Polymer System Type: Rubber Based / Elastomeric
• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Industry: OEM / Industrial
• Solvent Based (Volatile Organic): Yes

Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Reactive / Moisture Cured, Single Component System
• Dielectric Constant (Relative Permittivity): Over 4.5
• Dielectric Strength: Over 450 kV/in

Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 58.33 µin/in-F
• Dielectric Constant (Relative Permittivity): 2.8
• Dielectric Strength: 3124 kV/in

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 111 µin/in-F
• Dielectric Constant (Relative Permittivity): 4.7 to 4.8
• Dielectric Strength: 635 kV/in

Description: The Nuts N’ Bolts is an anaerobic adhesive, used in nut and bolt assemblies. When the adhesive is confined between substrates, the oxygen is eliminated and the adhesive cures. These thread locking adhesives offer a wide-range of strengths, viscosities, and temperature

• Applied Thickness / Gap Fill: 0.0050 inch
• Chemical / Polymer System Type: Acrylic / Polyacrylate
• Coeff. of Thermal Expansion (CTE): 4.44E-4 µin/in-F
• Cure Type / Technology: Anaerobic, Single Component System

Description: VersaTILE "G" is formulated to be a multi-purpose industrial strength, high temperature adhesive for construction and refurbishment related applications. Industries for which this adhesive is suitable include general construction, Flooring coverings, furniture, RV,

• Chemical / Polymer System Type: Rubber Based / Elastomeric
• Cure Type / Technology: Air Setting / Film Drying, Contact / Pressure Sensitive (PSA), Single Component System
• Dissimilar Substrates: Yes
• Features: Laminating / Composites

Description: applications including white goods assembly, filter assembly, electronic housing assembly and general industrial manufacturing. The one component nature of Krylex KB094 lends itself to easy automation of dispensing on production lines.

• Applied Thickness / Gap Fill: 4.72E-4 inch
• Cure Type / Technology: Reactive / Moisture Cured, Single Component System, Two Component System
• Industry: Automotive, Electronics, OEM / Industrial, Building / Construction
• Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer

Description: CONAPOXY® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200°F, yet it exhibits good storage life at room temperature. Good dielectric

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Single Component System

Description: Two part, 1:2, adhesive that can be used in applications requiring FDA

• Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dissimilar Substrates: Yes
• Filled / Reinforced: Yes

Description: Elastic Bonding Adhesives ThreeBonds’ industrial elastic adhesives’ major components are special polymer (non-solvent-based and moisture curable) and synthetic rubber (solvent-based).). They have good initial adhesion and will not lose their elasticity after bonding. No primer

• Cure Type / Technology: Anaerobic, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured
• Elongation: 29 %
• Features: Flame Retardant (e.g. UL 94 Rated)
• Industry: Automotive

Description: Sonex? panel adhesive has been specially formulated to use Sonex? acoustical panels. This non-toxic, water-based adhesive makes installation hassle-free and provides a strong, permanent bond when adhering Sonex? Panels to walls or ceilings. It is a non-toxic, water-based

• Cure Type / Technology: Single Component System
• Dissimilar Substrates: Yes
• Features: Flexible / Dampening
• Industry: Building / Construction, Other

Description: Compliant. Certified to meet the general requirements for SCAQMD Rule 1168, October 6, 2017, Adhesive and Sealant Applications, as analyzed by the methods specified in Rule 1168. Meets the stainless steel service requirements of MIL-DTL-24244D (SH).

• Cure Type / Technology: Air Setting / Film Drying, Room Temp. Cure / Vulcanizing, Single Component System
• Elongation: 650 %
• Industry: Other
• Substrate / Material Compatibility: Other

Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete

• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Dissimilar Substrates: Yes
• Features: Electrically Insulating / Dielectric, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive

Description: DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability. Features:

• Features: Encapsulating / Potting
• Industry: Electronics, OEM / Industrial