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  • Temperature Measurement Circuits for Embedded Applications
    This application note shows how to select a temperature sensor and conditioning circuit to maximize the measurement accuracy and simplify the interface to the microcontroller. Practical circuits and interface techniques will be provided for embedded applications with thermocouples, Resistive
  • Synchronizing clock sources for Agilent Pattern Generator 70841B
    The purpose of this application note is to provide design guidance, test techniques, performance data and suggested layout. recommendations for a 622 MBd ATM/SONET/SDH physical layer interface reference circuit. This standards-compliant reference design provides a convenient, interchangeable
  • Brushless DC Motor Control Using PIC18FXX31 MCUs
    with respect to the power ground (negative of DC bus). The feedback interface circuit is powered by +5VA, while +15VA supplies power to the IGBT drivers located inside the Integrated Power Module (IPM).
  • Interfacing the TC72 SPI TM Digital Temperature Sensor to a PICmicro (R) Microcontroller
    advantages, including the integration of the sensor and signal conditioning circuitry in a small integrated circuit (IC) package. The TC72 also has an One-shot Conversion mode, which performs a single temperature measurement and then goes into power-saving Shutdown mode. The One-shot Conversion mode
  • 622 MBd ATM/SONET/SDH PHY Reference Design Development
    Design issues, test techniques and the resulting measured data from a standards-compliant 622 MBd reference design used in OC-12 ATM/SONET/SDH applications are examined in this paper. This design provides a common interface circuit and footprint for either a multimode (MMF) or a single-mode (SMF
  • Computer Power User Article - Under Development
    the most advanced nanoelectronic products, in which we would want to put carbon nanotubes on top of a powerful silicon integrated circuit so that they can interface with an underlying information processing system. " Carbon nanotubes are so much smaller than
  • Medical Device Link .
    integrated circuit assembled to a wire lead frame or printed circuit board. The assembly is then moulded or cast with epoxy lenses (Figure 1). Typically, the epoxy contains filtering material that blocks visible light and allows only the IR light to pass through. Currently, more than five suppliers of IR
  • S2083: Surface Mounting Instructions for PQFN Packages
    The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil design provides a proper connection interface between the IC package and the board

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