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  • MICRO: Defect/Yield Analysis & Metrology
    A joint study reveals that optoacoustic metrology can be used to optimize chemical-mechanical planarization processes and track film-thickness variations during production. ith the IC industry rapidly switching to copper for circuit interconnects, the lack of etching techniques to remove copper has
  • Optical Metrology for Large Telescope Optics
    In recent years the demand for meter-scale optical elements has increased significantly, driven by growth in terrestrial and satellite-based astronomy, and defense and security applications. Laser interferometry is used throughout the manufacturing of large optics to ensure conformance to demanding
  • Utilizing Laser Technology in Dimensional Metrology Applications
    The wavelength of light provides a very high resolution, linear, and stable reference for dimensional measurement. Labmaster (R) instruments effectively couple the wavelength of light to the part to be measured. They do this by using a fringe counting laser interferometer1 to detect linear motion
  • Applying 3D Metrology Technology in Indy Racecars
    Today's new 3D metrology technology is making an impact on the design of championship Indy racecars. In this webcast, engineer Brent Knutson of Andretti Autosport (R) discusses the state of 3D metrology and laser scanning technology and its applications in design, reverse engineering and quality
  • Infrared Wire Grid Polarizers -Metrology and Modeling
    Broad and narrow-band wire grid polarizer (WGP) products suitable for MWIR and LWIR applications requiring high contrast were developed on antireflection (AR) coated silicon using Moxtek nanowire patterning capabilities. Accurate metrology was gathered in both transmission and reflection from
  • MICRO: Defect Analysis and Metrology - Ge (Feb 2000)
    Larry M. Ge, formerly of Digital Instruments, Veeco Metrology Group Digital Instruments, Veeco Metrology Group Driven by the critical need for product yield management and process control of deep submicron silicon device manufacturing, defect engineering has become increasingly important. Commonly
  • MICRO: Defect/Yield Analysis and Metrology - Collins (June 2000)
    layer in transparent multilayer film stacks on product wafers. However, there was no comparable metrology system for the analysis of opaque multilayer metal (MLM) film stacks (as depicted in Figure 1) until 1997, when Rudolph Technologies (Flanders, NJ) introduced picosecond ultrasonic laser sonar
  • Laser Trackers: Defining Accuracy (.pdf)
    accuracy. This white paper is intended to inform the reader of the meaning of accuracy in the context of metrology in general and in particular for the use of a laser tracker instrument.

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