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Supplier: Allied Electronics, Inc.
Description: assembly no-clean and surface mount rework application because it can deliver flux to a specific area. Kester 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL
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Supplier: Indium Corporation
Description: TACFlux® 055 is an air reflow, halogen-free, no-clean flux used with Sn/Bi and Sn/Bi/Ag alloys. TACFlux® 055 provides excellent wetting in air and nitrogen and provides the low activation temperature necessary for the low melting Sn/Bi and Sn/Bi/Ag alloys.
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y for the low melting SnBi and SnBiAg alloys.
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Indium Corporation
Description: 3541 No-Clean is a low-solids fl ux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated. This fl ux contains a small amount of resin which enhances the wetting properties. 3541 No-Clean is activated by a
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Wave Solder Flux 3577-TF is a low-solids flux especially formulated to eliminate post-cleaning operations. This flux contains a small amount of resin, which enhances the wetting properties. 3577-TF is activated by a multi-component, synergetic fluxing
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: assembly no-clean and surface mount rework application because it can deliver flux to a specific area. Kester 951 is a halogen-free, non-rosin organic Flux Pen® that is specifically designed for rework of conventional and surface mount circuit board assemblies. The extremely low
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Supplier: Nordson EFD
Description: provides a wide array of formulations for use in a variety of applications. FluxPlus Families No Clean (NC) Consisting of rosin, solvent, and a small amount of activator, NC flux has low activity and is suited to easily soldered surfaces. NC residue is clear, hard
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: Flux - Rosin Mildly Activated (RMA), No Clean, Liquid
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Kester 979VT is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of lead-free electronic circuit board assemblies. This flux's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: no-clean flux. The extremely low-solids (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Kester 979 is is a high performing ORL0, low residue, VOC-free no-clean flux that maintains its soldering performance for excellent hole fill and low-defect soldering of lead-free assemblies. Product Overview Kester 979's finely tuned activation system offers the best
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: employing water cleaning. It has a buffered activation system containing no free acid, and has a neutral pH. Its post-soldering residues are also non-acidic. ALPHA 856 is a low-smoking, efficient foam flux. Using moderate air flow rates, its fine-bubble foam head is fast
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 835 Rosin Flux contains a type RA rosin-activated flux, composed of pure white-water gum rosin, a unique solvent system and very effective activators. The superior fluxing remains consistent throughout the entire aeration process and provides fast
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator. Our No Clean formula wets and spreads like normal RA type flux and does not splatter. Features/Benefits: Meets J-STD-004 and QQ-S-571 No Clean Standard
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Supplier: Allied Electronics, Inc.
Description: M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator. Our No Clean formula wets and spreads like normal RA type flux and does not splatter. Features/Benefits: Meets J-STD-004 and QQ-S-571 No Clean Standard
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Supplier: Techsil Limited
Description: wire. Non-corrosive and non-conductive, halide free. Product Benefits Lead free & no clean Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B The resin spreads like rosin-activated flux Virtually non
- Form / Shape: Solid Wire
- Lead Free: Yes
- Welding Process / Form: Flux Cored Wire
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.7mm Product Form = Wire Melting Point = +227°C Percent Silver =
- Diameter / Thickness: 0.0276 inch
- Form / Shape: Solid Wire
- Melting Range: 441 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.7mm Product Form = Wire Melting Point = +227°C Percent Silver =
- Diameter / Thickness: 0.0276 inch
- Form / Shape: Solid Wire
- Melting Range: 441 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 1mm Product Form = Wire Melting Point = +227°C Percent Silver =
- Diameter / Thickness: 0.0394 inch
- Form / Shape: Solid Wire
- Melting Range: 441 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.5mm Product Form = Wire Melting Point = +227°C Percent Silver =
- Diameter / Thickness: 0.0197 inch
- Form / Shape: Solid Wire
- Melting Range: 441 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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thickness increases asymptotically and is mostly independent of surface geometry. Autocatalytic/Electroless Autocatalytic / electroless reactions are reduction reactions that add new metals atop the original base metals. Unlike typical electroplating reactions, no external current is (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Advanced Assembly, LLC.
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Reliability and analytical evaluations of no-clean flip-chip assembly
A solution was developed which used a mildly activated no - clean fluxing material in combination .
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Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components
The presence of non- activated no - clean solder flux residues at concentrations around 92 mg cm22 increases the migration probability on size 0805 ceramic capacitor to greater than 80% under water droplet conditions.
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The importance of lead-free electronics processes
A variety of fluxes will be used on the coupons, including activated water-soluble, mildly activated , and no - clean fluxes .
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Characterizing Corrosion Effects of Weak Organic Acids
Using a Modified Bono Test
In the current lead-free and halogen-free solder- ing technology era, WOAs play a very important role as activation ingredients of no - clean fluxes used in the current electronics industry.
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Robot Building for Beginners
Choose solder containing a core of mildly activated rosin flux or no - clean rosin flux.
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Effects of Flux Residues on Surface Insulation Resistance and Electrochemical Migration
Test specimen covered by aged PF7720/G no - clean type flux We have activated the fluxes by properly adjusted four zone reflow oven.
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Printed Circuits Handbook, Sixth Edition > SOLDERING TECHNIQUES
Inerting is effective in reducing dross formation and ensuring best fluxing from no - clean or other weakly activated fluxes .
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Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature
No - clean , rosin mildly activated flux (RMA .
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Lead-Free Bumping Using an Alternating Electromagnetic Field
The flux used here was Hasaconi FL2002 (T) low-residue no - clean rosin mildly activated (RMA) flux .
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Solderability and reliability of printed electronics
The used flux was liquid no - clean rosin mildly activated (RMA).