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  • Passivation and the Passive Layer
    Purity of fluids and gases are a critical issue in the food and beverage industry. Passivation techniques provide a way of. achieving it.
  • Developing an Effective Passivation Process to Maintain
    from stainless steel material because of its natural corrosion. resistance and relatively chemical inert surface. However, laser marking of stainless steel alters the surface composition. and degrades the natural passive layer resulting in a mark that is susceptible to corrosion. To restore
  • Comparing the characteristics of surface-passivated and electropolished 316L stainless steel
    , AISI 316L stainless steel has an intrinsic corrosion resistance because of its ability to form a protective oxide or "passive" layer on its surface by alloying >12% chromium with iron, nickel, and molybdenum. This protective layer is thought to consist of a heterogeneous chromium oxide film (Cr
  • Medical Device Link .
    dissolves martensitic particles created by mechanical processes like grinding and rolling. It also enriches the chromium oxide in the passive layer. It is often assumed that a voltage versus current (V -I) curve must be plotted and that current plateau densities must be established to reach
  • What Is Passivation? Why Do We Need To Passivate Flanged Heaters?
    oxide layer-or a passive film-on the surface of the metal. When stainless steel objects are cut or scratched, this passive film reacts with oxygen and "repairs" the exposed surface, preventing the formation of rust. See Figure 1 for the advantages.
  • Medical Device Link .
    temperatures. They offer superior corrosion resistance compared with other steels and aluminum, which is primarily due to the addition of chromium (at least 11% by weight) to the steel and the subsequent presence of chromium oxide on the outer surface. This passive surface layer superficially protects
  • MICRO:Building Copperopolis, by Qingyuan Han (Oct '99)
    processes. Because the chemical structure of many low-k materials differs from and is less passive than that of the conventional SiO dielectric, dry strip processes can cause unacceptable undercutting (insufficient selectivity) and fundamentally alter low-k film properties. Consequently, there has been

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