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  • Post Curing Thermoset Resins
    Last July, we discussed the importance of temperature control when casting with thermoset resins. In this article, we will focus on the post cure process for molds or parts made of thermoset resins. Post curing is the process of exposing a part or mold to elevated temperatures to speed up
  • MICRO:Improving the results of post-CMP
    and gauging the quality of the outgoing product. Post-CMP thickness variations are known to have a severe impact on the stability of downstream processes and ultimately on device yield. Although it has been demonstrated that pre- and post-CMP process steps also can affect the wafer-thickness profiles
  • Post-CMP Polyvinyl Alcohol Brush Testing
    Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in achieving clean and particle free wafers
  • How to Ensure Quality of Tubular Contact Pins, Post-Plating
    Bead Electronics has several vision inspection cameras throughout the factory that we use to inspect our solid wire and tubular contact pins as they are produced. But occasionally, certain parts can get bent or deformed during the plating process, which is outsourced to a reputable plating company
  • Evaluating chemical mechanical cleaning technology for post-CMP applications
    to as DSS. While the scrubbing process is well documented, advances in CMP technology and tighter defect specifications place an ever-increasing burden on the cleaning step. The capabilities of any post-CMP clean must evolve to stay effective. An example of this evolution is the addition of more
  • Vendors waste no time responding to need for post-CMP treatment
    cleanroom-related process tools, provides manufacturing expertise. Two-year-old Lucid is using the chipmaker as a beta site to test its system, which is designed to condense three drums of waste into one. "We wanted to go out and capture some real data from real customers, " asserts McCann. Steven
  • MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31)
    defects that are major threats to final yields, the processes must be closely monitored using sophisticated wafer inspection tools. After reviewing the types of defects that may occur, this article focuses on advances in inspection technologies. Examples of effective post-CMP inspection strategies
  • Process Optimization Reality Checks
    , that change will probably trigger a CBE-30, FDA s changes being effected in 30 days supplement. For a given level of product quality, the impetus for process improvement is pure economics. Optimization, especially post-registration, must be justified through a thorough cost analysis that weighs

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