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  • UV Curing Adhesives and Potting Compounds
    Recent advancements in ultraviolet curing have given engineers a new opportunity when choosing adhesives, potting compounds, coatings, and sealants. Until now, most of these systems were either two-component systems requiring mixing, one-component heat cure systems, or solvent-based systems
  • Managing Heat Transfer With Potting Compounds
    and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
  • Selecting the Right Potting Compound for Your Application
    Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
  • New Urethane Technology for Potting & Encapsulation in Electronics
    Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
  • Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
    The Potting or Encapsulation of electronic components is a common engineering design tool to protect products from environmental exposure. Potting involves the covering or embedding of an electronic or electrical device. In most cases an assembly is placed in a case or shell and then a liquid
  • Tech Tip 26 - Pot Life, Working Life and Gel Time of Epoxies
    Pot life, working life, and gel time are properties of an epoxy that can vary greatly from product to product. These properties play a vital role in material selection in choosing an adhesive for a specific manufacturing environment or process. When selecting an epoxy, pot life may be an important
  • Monitoring Floor Panel Separation with a String Pot
    CAS DataLoggers recently provided the datalogging solution for GSI Grain Storage in Assumption, Illinois, the world's largest manufacturer of steel farm grain bins, commercial storage grain bins and grain silos, as well as grain dryers and material handling systems including grain bin sweeps
  • Dielectric Materials for Use in Radomes
    low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
  • Frequently Asked Questions about Opto-couplers
    . Photo diode Vrwm. Potting material. Package size. Custom configurations. Processing
  • Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
    micro-electronic grade joining materials will be used. For LEDs, the silver epoxy is needed for both electrical and thermal properties. Optically clear epoxy is used for the potting, molding, or encapsulation of the LED. In LCDs, there are many different applications of epoxy of which 2 are presented.

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